JP5728065B2 - レーザ加工機 - Google Patents

レーザ加工機 Download PDF

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Publication number
JP5728065B2
JP5728065B2 JP2013234379A JP2013234379A JP5728065B2 JP 5728065 B2 JP5728065 B2 JP 5728065B2 JP 2013234379 A JP2013234379 A JP 2013234379A JP 2013234379 A JP2013234379 A JP 2013234379A JP 5728065 B2 JP5728065 B2 JP 5728065B2
Authority
JP
Japan
Prior art keywords
workpiece
laser beam
laser
alignment
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013234379A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015093300A (ja
Inventor
松本　潤一
潤一 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kataoka Corp
Original Assignee
Kataoka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kataoka Corp filed Critical Kataoka Corp
Priority to JP2013234379A priority Critical patent/JP5728065B2/ja
Priority to TW103120343A priority patent/TWI556895B/zh
Priority to KR1020140097533A priority patent/KR101622473B1/ko
Priority to CN201410412465.8A priority patent/CN104625396B/zh
Publication of JP2015093300A publication Critical patent/JP2015093300A/ja
Application granted granted Critical
Publication of JP5728065B2 publication Critical patent/JP5728065B2/ja
Priority to HK15107414.6A priority patent/HK1206682A1/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2013234379A 2013-11-12 2013-11-12 レーザ加工機 Active JP5728065B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013234379A JP5728065B2 (ja) 2013-11-12 2013-11-12 レーザ加工機
TW103120343A TWI556895B (zh) 2013-11-12 2014-06-12 Laser processing machine
KR1020140097533A KR101622473B1 (ko) 2013-11-12 2014-07-30 레이저 가공기
CN201410412465.8A CN104625396B (zh) 2013-11-12 2014-08-20 激光加工机
HK15107414.6A HK1206682A1 (zh) 2013-11-12 2015-08-03 激光加工機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013234379A JP5728065B2 (ja) 2013-11-12 2013-11-12 レーザ加工機

Publications (2)

Publication Number Publication Date
JP2015093300A JP2015093300A (ja) 2015-05-18
JP5728065B2 true JP5728065B2 (ja) 2015-06-03

Family

ID=53196075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013234379A Active JP5728065B2 (ja) 2013-11-12 2013-11-12 レーザ加工機

Country Status (5)

Country Link
JP (1) JP5728065B2 (zh)
KR (1) KR101622473B1 (zh)
CN (1) CN104625396B (zh)
HK (1) HK1206682A1 (zh)
TW (1) TWI556895B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113788A (ja) * 2015-12-24 2017-06-29 株式会社リコー 光加工装置
JP2018013342A (ja) * 2016-07-19 2018-01-25 株式会社ディスコ 検査方法
KR20180031964A (ko) * 2016-09-21 2018-03-29 레이저발 차이나 코., 엘티디 레이저 가공 장치 및 이를 이용한 레이저 가공 방법
KR102330173B1 (ko) 2019-03-29 2021-11-26 엘케이제작소 주식회사 Cnc 레이저 절단기용 얼라이먼트 조절기
CN110406268B (zh) * 2019-07-15 2021-04-02 中国船舶重工集团公司第七一六研究所 一种基于视觉识别的全自动法兰打标机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005081392A (ja) * 2003-09-09 2005-03-31 Fuji Electric Holdings Co Ltd レーザ加工方法およびレーザ加工装置
JP4755839B2 (ja) * 2005-03-23 2011-08-24 株式会社ディスコ レーザー加工装置
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置
JP2009241095A (ja) * 2008-03-31 2009-10-22 Laser Solutions Co Ltd エネルギービーム加工装置及びエネルギービーム加工物製造方法
JP4958020B2 (ja) * 2009-03-31 2012-06-20 大日本印刷株式会社 タッチパネルセンサ、タッチパネルセンサを作製するための積層体、および、タッチパネルセンサの製造方法
JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
KR101261266B1 (ko) * 2010-11-03 2013-05-09 유병소 레이저 가공 장치 및 이를 이용한 레이저 가공 방법

Also Published As

Publication number Publication date
TWI556895B (zh) 2016-11-11
HK1206682A1 (zh) 2016-01-15
KR101622473B1 (ko) 2016-05-18
TW201519982A (zh) 2015-06-01
CN104625396B (zh) 2016-09-21
JP2015093300A (ja) 2015-05-18
KR20150054642A (ko) 2015-05-20
CN104625396A (zh) 2015-05-20

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