JP5722236B2 - 接合微小電気機械アセンブリ - Google Patents

接合微小電気機械アセンブリ Download PDF

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Publication number
JP5722236B2
JP5722236B2 JP2011548062A JP2011548062A JP5722236B2 JP 5722236 B2 JP5722236 B2 JP 5722236B2 JP 2011548062 A JP2011548062 A JP 2011548062A JP 2011548062 A JP2011548062 A JP 2011548062A JP 5722236 B2 JP5722236 B2 JP 5722236B2
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JP
Japan
Prior art keywords
assembly
die
substrate
die body
laser
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Active
Application number
JP2011548062A
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English (en)
Japanese (ja)
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JP2012516246A5 (enExample
JP2012516246A (ja
Inventor
エイ ホイジントン，ポール
エイ ホイジントン，ポール
エイ トーリ，マーク
エイ トーリ，マーク
Original Assignee
フジフィルム ディマティックス， インコーポレイテッド
フジフィルム ディマティックス， インコーポレイテッド
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Application filed by フジフィルム ディマティックス， インコーポレイテッド, フジフィルム ディマティックス， インコーポレイテッド filed Critical フジフィルム ディマティックス， インコーポレイテッド
Publication of JP2012516246A publication Critical patent/JP2012516246A/ja
Publication of JP2012516246A5 publication Critical patent/JP2012516246A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00904—Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2011548062A 2009-01-28 2010-01-20 接合微小電気機械アセンブリ Active JP5722236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/361,439 2009-01-28
US12/361,439 US20100187667A1 (en) 2009-01-28 2009-01-28 Bonded Microelectromechanical Assemblies
PCT/US2010/021470 WO2010088111A2 (en) 2009-01-28 2010-01-20 Bonded microelectromechanical assemblies

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015014260A Division JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Publications (3)

Publication Number Publication Date
JP2012516246A JP2012516246A (ja) 2012-07-19
JP2012516246A5 JP2012516246A5 (enExample) 2013-03-07
JP5722236B2 true JP5722236B2 (ja) 2015-05-20

Family

ID=42353497

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011548062A Active JP5722236B2 (ja) 2009-01-28 2010-01-20 接合微小電気機械アセンブリ
JP2015014260A Active JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015014260A Active JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Country Status (6)

Country Link
US (2) US20100187667A1 (enExample)
EP (1) EP2382151B1 (enExample)
JP (2) JP5722236B2 (enExample)
KR (1) KR101700100B1 (enExample)
CN (1) CN102300801B (enExample)
WO (1) WO2010088111A2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6048794B2 (ja) * 2012-07-31 2016-12-21 株式会社リコー ノズルプレート、ノズルプレートの製造方法、インクジェットヘッド及びインクジェット印刷装置
US9132634B2 (en) * 2012-11-29 2015-09-15 Palo Alto Research Center Incorporated Bypass flow path for ink jet bubbles

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2827884B2 (ja) 1994-02-09 1998-11-25 富士ゼロックス株式会社 インクジェットヘッドの作製方法
DE69515708T2 (de) * 1994-04-20 2000-08-17 Seiko Epson Corp., Tokio/Tokyo Tintenstrahlaufzeichnungsgerät
JP3389732B2 (ja) 1994-04-20 2003-03-24 セイコーエプソン株式会社 インクジェット記録装置及びインクジェットヘッドの製造方法
JPH09141879A (ja) 1995-11-28 1997-06-03 Tec Corp インクジェットプリンタヘッドの製造方法
JPH09174861A (ja) * 1995-12-28 1997-07-08 Tec Corp インクジェットプリンタヘッドの製造方法
US6648453B2 (en) * 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
JPH11254675A (ja) 1998-03-10 1999-09-21 Oki Data Corp インクジェットヘッド及びその製造方法
CN1250720A (zh) 1998-03-27 2000-04-19 莱克斯马克国际公司 形成单个喷嘴板并将喷嘴板连接到打印头上的方法
JP3555653B2 (ja) 1998-09-30 2004-08-18 セイコーエプソン株式会社 インクジェット式記録ヘッド及びその製造方法
AUPQ130399A0 (en) * 1999-06-30 1999-07-22 Silverbrook Research Pty Ltd A method and apparatus (IJ47V9)
US6464324B1 (en) * 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
JP2001315337A (ja) * 2000-05-01 2001-11-13 Fuji Xerox Co Ltd インクジェット記録ヘッド、インクジェット記録装置及びヘッド作製方法
US6464347B2 (en) 2000-11-30 2002-10-15 Xerox Corporation Laser ablated filter
CN1289298C (zh) * 2001-09-06 2006-12-13 株式会社理光 液滴喷射头及其制造方法、微型器件、喷墨头、墨盒以及喷墨打印设备
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
US7302309B2 (en) * 2004-04-26 2007-11-27 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
WO2007006618A1 (en) * 2005-07-07 2007-01-18 Agfa Graphics Nv Ink jet print head with improved reliability
JP2007048958A (ja) * 2005-08-10 2007-02-22 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP4816406B2 (ja) 2005-11-16 2011-11-16 株式会社デンソー ウェハの加工方法
US7838331B2 (en) * 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
DE602007012162D1 (de) * 2006-03-20 2011-03-10 Brother Ind Ltd Verfahren zur Herstellung eines piezoelektrischen Aktors, Tintenstrahlkopf und Tintenstrahldrucker mit Aerosolablagerungsverfahren, piezoelektrischer Aktor, Tintenstrahlkopf und Tintenstrahldrucker
US7819506B2 (en) * 2006-03-29 2010-10-26 Lexmark International, Inc. Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto
US7487678B2 (en) * 2006-12-13 2009-02-10 Honeywell International Inc. Z offset MEMS devices and methods
JP2008311333A (ja) 2007-06-13 2008-12-25 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法

Also Published As

Publication number Publication date
CN102300801B (zh) 2016-02-03
US8979247B2 (en) 2015-03-17
EP2382151B1 (en) 2019-04-10
JP6052915B2 (ja) 2016-12-27
WO2010088111A3 (en) 2010-11-04
EP2382151A4 (en) 2017-03-22
WO2010088111A2 (en) 2010-08-05
JP2012516246A (ja) 2012-07-19
EP2382151A2 (en) 2011-11-02
US20120019598A1 (en) 2012-01-26
JP2015133491A (ja) 2015-07-23
KR101700100B1 (ko) 2017-01-26
KR20110113641A (ko) 2011-10-17
CN102300801A (zh) 2011-12-28
US20100187667A1 (en) 2010-07-29

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