CN102300801B - 接合式微机电组件 - Google Patents

接合式微机电组件 Download PDF

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Publication number
CN102300801B
CN102300801B CN201080005699.0A CN201080005699A CN102300801B CN 102300801 B CN102300801 B CN 102300801B CN 201080005699 A CN201080005699 A CN 201080005699A CN 102300801 B CN102300801 B CN 102300801B
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CN
China
Prior art keywords
mold
joined
assembly
outlet
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080005699.0A
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English (en)
Chinese (zh)
Other versions
CN102300801A (zh
Inventor
P.A.霍伊辛顿
M.A.托雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Dimatix Inc
Original Assignee
Fujifilm Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix Inc filed Critical Fujifilm Dimatix Inc
Publication of CN102300801A publication Critical patent/CN102300801A/zh
Application granted granted Critical
Publication of CN102300801B publication Critical patent/CN102300801B/zh
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00904—Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN201080005699.0A 2009-01-28 2010-01-20 接合式微机电组件 Active CN102300801B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/361,439 2009-01-28
US12/361,439 US20100187667A1 (en) 2009-01-28 2009-01-28 Bonded Microelectromechanical Assemblies
PCT/US2010/021470 WO2010088111A2 (en) 2009-01-28 2010-01-20 Bonded microelectromechanical assemblies

Publications (2)

Publication Number Publication Date
CN102300801A CN102300801A (zh) 2011-12-28
CN102300801B true CN102300801B (zh) 2016-02-03

Family

ID=42353497

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080005699.0A Active CN102300801B (zh) 2009-01-28 2010-01-20 接合式微机电组件

Country Status (6)

Country Link
US (2) US20100187667A1 (enExample)
EP (1) EP2382151B1 (enExample)
JP (2) JP5722236B2 (enExample)
KR (1) KR101700100B1 (enExample)
CN (1) CN102300801B (enExample)
WO (1) WO2010088111A2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6048794B2 (ja) * 2012-07-31 2016-12-21 株式会社リコー ノズルプレート、ノズルプレートの製造方法、インクジェットヘッド及びインクジェット印刷装置
US9132634B2 (en) * 2012-11-29 2015-09-15 Palo Alto Research Center Incorporated Bypass flow path for ink jet bubbles

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1593918A (zh) * 1999-06-30 2005-03-16 西尔弗布鲁克研究股份有限公司 具有带凸缘的致动器的微机电设备
CN1628032A (zh) * 2002-06-28 2005-06-15 西尔弗布鲁克研究有限公司 具有预定微电子机械系统高度的喷墨打印头芯片
CN1927565A (zh) * 2000-01-31 2007-03-14 皮科杰特公司 喷墨打印头制造方法
CN101041292A (zh) * 2006-03-20 2007-09-26 兄弟工业株式会社 压电促动器、喷墨头和喷墨打印机及其生产方法
EP1932803A2 (en) * 2006-12-13 2008-06-18 Honeywell International Inc. MEMS device with Z-axis asymetry

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JP2827884B2 (ja) 1994-02-09 1998-11-25 富士ゼロックス株式会社 インクジェットヘッドの作製方法
DE69515708T2 (de) * 1994-04-20 2000-08-17 Seiko Epson Corp., Tokio/Tokyo Tintenstrahlaufzeichnungsgerät
JP3389732B2 (ja) 1994-04-20 2003-03-24 セイコーエプソン株式会社 インクジェット記録装置及びインクジェットヘッドの製造方法
JPH09141879A (ja) 1995-11-28 1997-06-03 Tec Corp インクジェットプリンタヘッドの製造方法
JPH09174861A (ja) * 1995-12-28 1997-07-08 Tec Corp インクジェットプリンタヘッドの製造方法
JPH11254675A (ja) 1998-03-10 1999-09-21 Oki Data Corp インクジェットヘッド及びその製造方法
CN1250720A (zh) 1998-03-27 2000-04-19 莱克斯马克国际公司 形成单个喷嘴板并将喷嘴板连接到打印头上的方法
JP3555653B2 (ja) 1998-09-30 2004-08-18 セイコーエプソン株式会社 インクジェット式記録ヘッド及びその製造方法
JP2001315337A (ja) * 2000-05-01 2001-11-13 Fuji Xerox Co Ltd インクジェット記録ヘッド、インクジェット記録装置及びヘッド作製方法
US6464347B2 (en) 2000-11-30 2002-10-15 Xerox Corporation Laser ablated filter
CN1289298C (zh) * 2001-09-06 2006-12-13 株式会社理光 液滴喷射头及其制造方法、微型器件、喷墨头、墨盒以及喷墨打印设备
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
US7302309B2 (en) * 2004-04-26 2007-11-27 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
WO2007006618A1 (en) * 2005-07-07 2007-01-18 Agfa Graphics Nv Ink jet print head with improved reliability
JP2007048958A (ja) * 2005-08-10 2007-02-22 Renesas Technology Corp 半導体装置の製造方法および半導体装置
JP4816406B2 (ja) 2005-11-16 2011-11-16 株式会社デンソー ウェハの加工方法
US7838331B2 (en) * 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
US7819506B2 (en) * 2006-03-29 2010-10-26 Lexmark International, Inc. Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto
JP2008311333A (ja) 2007-06-13 2008-12-25 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1593918A (zh) * 1999-06-30 2005-03-16 西尔弗布鲁克研究股份有限公司 具有带凸缘的致动器的微机电设备
CN1927565A (zh) * 2000-01-31 2007-03-14 皮科杰特公司 喷墨打印头制造方法
CN1628032A (zh) * 2002-06-28 2005-06-15 西尔弗布鲁克研究有限公司 具有预定微电子机械系统高度的喷墨打印头芯片
CN101041292A (zh) * 2006-03-20 2007-09-26 兄弟工业株式会社 压电促动器、喷墨头和喷墨打印机及其生产方法
EP1932803A2 (en) * 2006-12-13 2008-06-18 Honeywell International Inc. MEMS device with Z-axis asymetry

Also Published As

Publication number Publication date
US8979247B2 (en) 2015-03-17
EP2382151B1 (en) 2019-04-10
JP5722236B2 (ja) 2015-05-20
JP6052915B2 (ja) 2016-12-27
WO2010088111A3 (en) 2010-11-04
EP2382151A4 (en) 2017-03-22
WO2010088111A2 (en) 2010-08-05
JP2012516246A (ja) 2012-07-19
EP2382151A2 (en) 2011-11-02
US20120019598A1 (en) 2012-01-26
JP2015133491A (ja) 2015-07-23
KR101700100B1 (ko) 2017-01-26
KR20110113641A (ko) 2011-10-17
CN102300801A (zh) 2011-12-28
US20100187667A1 (en) 2010-07-29

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