JP5715770B2 - 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 - Google Patents

低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 Download PDF

Info

Publication number
JP5715770B2
JP5715770B2 JP2010137935A JP2010137935A JP5715770B2 JP 5715770 B2 JP5715770 B2 JP 5715770B2 JP 2010137935 A JP2010137935 A JP 2010137935A JP 2010137935 A JP2010137935 A JP 2010137935A JP 5715770 B2 JP5715770 B2 JP 5715770B2
Authority
JP
Japan
Prior art keywords
chemical mechanical
substrate
mechanical polishing
polishing
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010137935A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012004335A5 (enrdf_load_stackoverflow
JP2012004335A (ja
Inventor
メアリー・ジョー・カルプ
シャノン・ホリー・ウィリアムズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, DuPont Electronic Materials Holding Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Priority to JP2010137935A priority Critical patent/JP5715770B2/ja
Publication of JP2012004335A publication Critical patent/JP2012004335A/ja
Publication of JP2012004335A5 publication Critical patent/JP2012004335A5/ja
Application granted granted Critical
Publication of JP5715770B2 publication Critical patent/JP5715770B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010137935A 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 Active JP5715770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010137935A JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010137935A JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Publications (3)

Publication Number Publication Date
JP2012004335A JP2012004335A (ja) 2012-01-05
JP2012004335A5 JP2012004335A5 (enrdf_load_stackoverflow) 2013-07-18
JP5715770B2 true JP5715770B2 (ja) 2015-05-13

Family

ID=45535996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010137935A Active JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Country Status (1)

Country Link
JP (1) JP5715770B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9064806B1 (en) * 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9314897B2 (en) * 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3288151B2 (ja) * 1993-09-02 2002-06-04 三井化学株式会社 二成分系ポリウレタン発泡型シーリング材組成物、シーリング方法及び灯具
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP4620331B2 (ja) * 2003-01-31 2011-01-26 ニッタ・ハース株式会社 研磨パッド及び研磨パッドの製造方法
JP4977962B2 (ja) * 2004-04-28 2012-07-18 Ｊｓｒ株式会社 化学機械研磨パッド、その製造方法及び半導体ウエハの化学機械研磨方法
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
US8697217B2 (en) * 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window

Also Published As

Publication number Publication date
JP2012004335A (ja) 2012-01-05

Similar Documents

Publication Publication Date Title
US8257544B2 (en) Chemical mechanical polishing pad having a low defect integral window
JP6487249B2 (ja) 研磨層及びウィンドウを有するケミカルメカニカル研磨パッド
JP6290004B2 (ja) 軟質かつコンディショニング可能な化学機械ウィンドウ研磨パッド
JP6177665B2 (ja) 軟質かつコンディショニング可能なケミカルメカニカル研磨パッド
JP6367611B2 (ja) 軟質かつコンディショニング可能な研磨層を有する多層化学機械研磨パッドスタック
JP7260698B2 (ja) ケミカルメカニカル研磨パッド
CN107073678B (zh) 抛光层用非多孔性成型体、抛光垫及抛光方法
JP6538397B2 (ja) 軟質かつコンディショニング可能なウィンドウ付きケミカルメカニカル研磨パッド
KR20150124897A (ko) 투명한 종점 검출 윈도우를 갖는 화학 기계적 연마 패드
TWI791157B (zh) 採用聚胺及環己烷二甲醇固化劑之研磨墊
KR102191947B1 (ko) 연성이고 컨디셔닝가능한 화학 기계적 연마 패드 적층물
KR102697100B1 (ko) 화학 기계적 연마 패드 및 연마 방법
CN105014528A (zh) 化学机械抛光垫
CN102310366B (zh) 具有低缺陷整体窗的化学机械抛光垫
JP5715770B2 (ja) 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
KR20150112855A (ko) 종점 검출 윈도우를 갖는 화학 기계적 연마 패드
CN111203798B (zh) 化学机械抛光垫和抛光方法
TWI510526B (zh) 具有低缺陷一體成型窗之化學機械研磨墊
KR101942100B1 (ko) 저결함성 창을 갖는 화학 기계 연마 패드
KR20170045185A (ko) 저결함성 창을 갖는 화학 기계 연마 패드
KR20250018129A (ko) 이중 경화제로부터 형성된 폴리싱 패드

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130604

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130604

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140416

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140807

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150316

R150 Certificate of patent or registration of utility model

Ref document number: 5715770

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250