JP2012004335A5 - - Google Patents

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Publication number
JP2012004335A5
JP2012004335A5 JP2010137935A JP2010137935A JP2012004335A5 JP 2012004335 A5 JP2012004335 A5 JP 2012004335A5 JP 2010137935 A JP2010137935 A JP 2010137935A JP 2010137935 A JP2010137935 A JP 2010137935A JP 2012004335 A5 JP2012004335 A5 JP 2012004335A5
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JP
Japan
Prior art keywords
diisocyanate
isocyanate
toluenediamine
aminobenzoate
tert
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JP2010137935A
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English (en)
Japanese (ja)
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JP5715770B2 (ja
JP2012004335A (ja
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Priority to JP2010137935A priority Critical patent/JP5715770B2/ja
Priority claimed from JP2010137935A external-priority patent/JP5715770B2/ja
Publication of JP2012004335A publication Critical patent/JP2012004335A/ja
Publication of JP2012004335A5 publication Critical patent/JP2012004335A5/ja
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JP2010137935A 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法 Active JP5715770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010137935A JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010137935A JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Publications (3)

Publication Number Publication Date
JP2012004335A JP2012004335A (ja) 2012-01-05
JP2012004335A5 true JP2012004335A5 (enrdf_load_stackoverflow) 2013-07-18
JP5715770B2 JP5715770B2 (ja) 2015-05-13

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ID=45535996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010137935A Active JP5715770B2 (ja) 2010-06-17 2010-06-17 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法

Country Status (1)

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JP (1) JP5715770B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9064806B1 (en) * 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9314897B2 (en) * 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3288151B2 (ja) * 1993-09-02 2002-06-04 三井化学株式会社 二成分系ポリウレタン発泡型シーリング材組成物、シーリング方法及び灯具
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP4620331B2 (ja) * 2003-01-31 2011-01-26 ニッタ・ハース株式会社 研磨パッド及び研磨パッドの製造方法
JP4977962B2 (ja) * 2004-04-28 2012-07-18 Jsr株式会社 化学機械研磨パッド、その製造方法及び半導体ウエハの化学機械研磨方法
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
US8697217B2 (en) * 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window

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