JP2015051498A5 - - Google Patents
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- Publication number
- JP2015051498A5 JP2015051498A5 JP2014178703A JP2014178703A JP2015051498A5 JP 2015051498 A5 JP2015051498 A5 JP 2015051498A5 JP 2014178703 A JP2014178703 A JP 2014178703A JP 2014178703 A JP2014178703 A JP 2014178703A JP 2015051498 A5 JP2015051498 A5 JP 2015051498A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- isocyanate
- reaction product
- astm
- terminated reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 claims description 25
- 239000007795 chemical reaction product Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 8
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- -1 aliphatic isocyanate Chemical class 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims 4
- 239000004005 microsphere Substances 0.000 claims 2
- 238000009472 formulation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 241001112258 Moca Species 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/017,998 US20150059254A1 (en) | 2013-09-04 | 2013-09-04 | Polyurethane polishing pad |
| US14/017,998 | 2013-09-04 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015051498A JP2015051498A (ja) | 2015-03-19 |
| JP2015051498A5 true JP2015051498A5 (enrdf_load_stackoverflow) | 2018-10-18 |
| JP6423205B2 JP6423205B2 (ja) | 2018-11-14 |
Family
ID=52470551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014178703A Active JP6423205B2 (ja) | 2013-09-04 | 2014-09-03 | ポリウレタン研磨パッド |
Country Status (7)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10086494B2 (en) * | 2016-09-13 | 2018-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High planarization efficiency chemical mechanical polishing pads and methods of making |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US10391606B2 (en) | 2017-06-06 | 2019-08-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US10464187B2 (en) * | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| JP7072429B2 (ja) * | 2018-03-30 | 2022-05-20 | 富士紡ホールディングス株式会社 | 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法 |
| KR102058877B1 (ko) * | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| WO2023104041A1 (zh) * | 2021-12-06 | 2023-06-15 | 华为技术有限公司 | 材料及其制备方法、材料的应用、研磨材料 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
| SG111222A1 (en) * | 2003-10-09 | 2005-05-30 | Rohm & Haas Elect Mat | Polishing pad |
| US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7371160B1 (en) * | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
| JP2009090397A (ja) * | 2007-10-05 | 2009-04-30 | Nitta Haas Inc | 研磨パッド |
| US8557005B2 (en) * | 2008-04-25 | 2013-10-15 | Toyo Polymer Co., Ltd. | Polyurethane foam and polishing pad |
| WO2010038724A1 (ja) * | 2008-09-30 | 2010-04-08 | Dic株式会社 | 研磨パッド用２液型ウレタン樹脂組成物、それを用いてなるポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法 |
| JP2012521478A (ja) * | 2009-03-24 | 2012-09-13 | ピーピージー インダストリーズ オハイオ，インコーポレイテッド | ポリウレタン、ポリウレタンから調製される物品およびコーティング、ならびにこれらの製造方法 |
| US8697239B2 (en) * | 2009-07-24 | 2014-04-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multi-functional polishing pad |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
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2013
- 2013-09-04 US US14/017,998 patent/US20150059254A1/en not_active Abandoned
-
2014
- 2014-09-01 TW TW103130077A patent/TW201522404A/zh unknown
- 2014-09-02 DE DE201410013023 patent/DE102014013023A1/de not_active Withdrawn
- 2014-09-03 JP JP2014178703A patent/JP6423205B2/ja active Active
- 2014-09-04 FR FR1458272A patent/FR3009990A1/fr active Pending
- 2014-09-04 KR KR1020140117547A patent/KR102160987B1/ko active Active
- 2014-09-04 CN CN201410448504.XA patent/CN104416454B/zh active Active