JP5715055B2 - 改善された靭性を有する構造用複合材料 - Google Patents

改善された靭性を有する構造用複合材料 Download PDF

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Publication number
JP5715055B2
JP5715055B2 JP2011518780A JP2011518780A JP5715055B2 JP 5715055 B2 JP5715055 B2 JP 5715055B2 JP 2011518780 A JP2011518780 A JP 2011518780A JP 2011518780 A JP2011518780 A JP 2011518780A JP 5715055 B2 JP5715055 B2 JP 5715055B2
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Japan
Prior art keywords
thermosetting resin
block copolymer
composite material
agent
present
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JP2011518780A
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Japanese (ja)
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JP2011528399A5 (enExample
JP2011528399A (ja
Inventor
トゥラキア，ラジェシュ
ベルゲゼ，ニキル
パム，ハ
ジャコブ，ジョージ
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Dow Global Technologies LLC
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Dow Global Technologies LLC
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011518780A 2008-07-17 2009-06-30 改善された靭性を有する構造用複合材料 Expired - Fee Related JP5715055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8144908P 2008-07-17 2008-07-17
US61/081,449 2008-07-17
PCT/US2009/049222 WO2010008931A1 (en) 2008-07-17 2009-06-30 Structural composites with improved toughness

Publications (3)

Publication Number Publication Date
JP2011528399A JP2011528399A (ja) 2011-11-17
JP2011528399A5 JP2011528399A5 (enExample) 2012-08-16
JP5715055B2 true JP5715055B2 (ja) 2015-05-07

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ID=41031439

Family Applications (1)

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JP2011518780A Expired - Fee Related JP5715055B2 (ja) 2008-07-17 2009-06-30 改善された靭性を有する構造用複合材料

Country Status (7)

Country Link
US (1) US20110104498A1 (enExample)
EP (2) EP2303953A1 (enExample)
JP (1) JP5715055B2 (enExample)
KR (1) KR20110041475A (enExample)
CN (1) CN102099402B (enExample)
BR (1) BRPI0910800A2 (enExample)
WO (1) WO2010008931A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102985747B (zh) * 2010-06-17 2015-05-20 3M创新有限公司 复合材料压力容器
TWI561573B (en) * 2011-11-09 2016-12-11 Dow Global Technologies Llc Curable compositions
CN103958628B (zh) 2011-11-14 2016-02-17 汉高知识产权控股有限责任公司 粘合剂组合物
US9263360B2 (en) 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants
WO2014028338A1 (en) 2012-08-13 2014-02-20 Henkel Corporation Liquid compression molding encapsulants
CN103351652B (zh) * 2013-04-16 2016-05-04 上海海隆石油化工研究所 厚涂型快干醇溶无机富锌涂料及其制备方法
KR102251170B1 (ko) 2013-07-22 2021-05-13 헨켈 아이피 앤드 홀딩 게엠베하 웨이퍼의 압축 성형시의 웨이퍼 휨을 제어하는 방법 및 그에 유용한 물품
US9245815B2 (en) * 2014-04-29 2016-01-26 Intel Corporation Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
KR20160116599A (ko) * 2015-03-30 2016-10-10 삼성전자주식회사 도전성 복합체 제조용 조성물, 이로부터 제조된 복합체, 및 이를 포함한 전자 소자
JP6606924B2 (ja) * 2015-08-27 2019-11-20 Ｄｉｃ株式会社 エポキシ樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法
WO2018080760A1 (en) * 2016-10-28 2018-05-03 Dow Global Technologies Llc Crash durable epoxy adhesive having improved low-temperature impact resistance
CN110536941B (zh) 2017-04-21 2022-04-19 汉高知识产权控股有限责任公司 粘合剂组合物
TWI768032B (zh) 2017-04-21 2022-06-21 德商漢高智慧財產控股公司 黏著劑組合物
CN110437587B (zh) * 2019-09-10 2022-04-22 固德电材系统（苏州）股份有限公司 一种风电叶片用碳纤维复合材料树脂及其制备方法
CN113999485A (zh) * 2020-12-29 2022-02-01 深材科技（深圳）有限公司 碳纤维湿法预浸料用高抗冲击高弹性模量纳米改性环氧树脂及其制备方法
CN112773724A (zh) * 2021-02-02 2021-05-11 广州市宝贝乐婴童用品有限公司 65口径奶嘴双孔
CN114163761B (zh) * 2021-11-30 2023-08-15 上海金发科技发展有限公司 一种苯乙烯-丙烯酸酯共聚组合物及其制备方法与应用
CN116535822B (zh) * 2023-06-29 2023-10-17 泰和新材集团股份有限公司 一种用于芳纶复合材料iv型瓶的树脂胶液及制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
CA2017613A1 (en) * 1989-05-29 1990-11-29 Kiyomi Yasuda Heat-resistant, flame-retardant epoxy resin compositions
TWI304321B (en) * 2002-12-27 2008-12-11 Toray Industries Layered products, electromagnetic wave shielding molded articles and method for production thereof
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
US20080160860A1 (en) * 2004-03-02 2008-07-03 Toray Industries, Inc. Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Fiber-Reinforced Composite Material
CA2558819A1 (en) * 2004-04-02 2005-10-20 Dow Global Technologies Inc. Amphiphilic block copolymer-toughened thermoset resins
US7923073B2 (en) * 2004-11-10 2011-04-12 Dow Global Technologies Llc Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom
WO2008001705A1 (en) * 2006-06-30 2008-01-03 Toray Industries, Inc. Epoxy resin composition, prepreg, and fiber-reinforced composite material
US7896190B2 (en) * 2006-07-17 2011-03-01 GM Global Technology Operations LLC Composites having an improved resistance to fatigue
EP2176348B1 (en) * 2007-08-02 2017-01-18 Dow Global Technologies LLC Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途

Also Published As

Publication number Publication date
BRPI0910800A2 (pt) 2016-07-12
CN102099402B (zh) 2014-06-25
EP2303953A1 (en) 2011-04-06
CN102099402A (zh) 2011-06-15
WO2010008931A1 (en) 2010-01-21
JP2011528399A (ja) 2011-11-17
US20110104498A1 (en) 2011-05-05
EP3037461A1 (en) 2016-06-29
KR20110041475A (ko) 2011-04-21

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