KR20110041475A - 개선된 인성을 갖는 구조 복합체 - Google Patents
개선된 인성을 갖는 구조 복합체 Download PDFInfo
- Publication number
- KR20110041475A KR20110041475A KR1020117001118A KR20117001118A KR20110041475A KR 20110041475 A KR20110041475 A KR 20110041475A KR 1020117001118 A KR1020117001118 A KR 1020117001118A KR 20117001118 A KR20117001118 A KR 20117001118A KR 20110041475 A KR20110041475 A KR 20110041475A
- Authority
- KR
- South Korea
- Prior art keywords
- thermosetting resin
- structural composite
- block copolymer
- toughening agent
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- 239000002131 composite material Substances 0.000 title claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 93
- 239000011347 resin Substances 0.000 claims abstract description 93
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 79
- 229920001400 block copolymer Polymers 0.000 claims abstract description 57
- 239000012745 toughening agent Substances 0.000 claims abstract description 49
- 239000011342 resin composition Substances 0.000 claims abstract description 27
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 20
- 239000004917 carbon fiber Substances 0.000 claims abstract description 18
- 239000012779 reinforcing material Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 230000009477 glass transition Effects 0.000 claims description 9
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- 229920000428 triblock copolymer Polymers 0.000 claims description 4
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- 229920001577 copolymer Polymers 0.000 claims description 3
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- 229920001567 vinyl ester resin Polymers 0.000 claims description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 15
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
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- KCAMXZBMXVIIQN-UHFFFAOYSA-N octan-3-yl 2-methylprop-2-enoate Chemical compound CCCCCC(CC)OC(=O)C(C)=C KCAMXZBMXVIIQN-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
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- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- ZXESZAXZKKQCEM-UHFFFAOYSA-N 2,3,4,5-tetramethyl-6-(2,3,4,5-tetrabromo-6-hydroxyphenyl)phenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=C(O)C(Br)=C(Br)C(Br)=C1Br ZXESZAXZKKQCEM-UHFFFAOYSA-N 0.000 description 1
- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
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- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
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- 239000000779 smoke Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8144908P | 2008-07-17 | 2008-07-17 | |
| US61/081,449 | 2008-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110041475A true KR20110041475A (ko) | 2011-04-21 |
Family
ID=41031439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117001118A Ceased KR20110041475A (ko) | 2008-07-17 | 2009-06-30 | 개선된 인성을 갖는 구조 복합체 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110104498A1 (enExample) |
| EP (2) | EP3037461A1 (enExample) |
| JP (1) | JP5715055B2 (enExample) |
| KR (1) | KR20110041475A (enExample) |
| CN (1) | CN102099402B (enExample) |
| BR (1) | BRPI0910800A2 (enExample) |
| WO (1) | WO2010008931A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2583020B1 (en) | 2010-06-17 | 2021-02-17 | 3M Innovative Properties Company | Composite pressure vessels |
| TWI561573B (en) * | 2011-11-09 | 2016-12-11 | Dow Global Technologies Llc | Curable compositions |
| WO2013074265A1 (en) | 2011-11-14 | 2013-05-23 | Henkel Corporation | Adhesive compositions |
| US9263360B2 (en) | 2012-07-06 | 2016-02-16 | Henkel IP & Holding GmbH | Liquid compression molding encapsulants |
| KR102173954B1 (ko) | 2012-08-13 | 2020-11-04 | 헨켈 아이피 앤드 홀딩 게엠베하 | 액체 압축 성형 캡슐화제 |
| CN103351652B (zh) * | 2013-04-16 | 2016-05-04 | 上海海隆石油化工研究所 | 厚涂型快干醇溶无机富锌涂料及其制备方法 |
| KR102251170B1 (ko) | 2013-07-22 | 2021-05-13 | 헨켈 아이피 앤드 홀딩 게엠베하 | 웨이퍼의 압축 성형시의 웨이퍼 휨을 제어하는 방법 및 그에 유용한 물품 |
| US9245815B2 (en) * | 2014-04-29 | 2016-01-26 | Intel Corporation | Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus |
| KR20160116599A (ko) * | 2015-03-30 | 2016-10-10 | 삼성전자주식회사 | 도전성 복합체 제조용 조성물, 이로부터 제조된 복합체, 및 이를 포함한 전자 소자 |
| JP6606924B2 (ja) * | 2015-08-27 | 2019-11-20 | Dic株式会社 | エポキシ樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法 |
| US20200190376A1 (en) * | 2016-10-28 | 2020-06-18 | Dow Global Technologies Llc | Crash durable epoxy adhesive having improved low-temperature impact resistance |
| TWI768032B (zh) | 2017-04-21 | 2022-06-21 | 德商漢高智慧財產控股公司 | 黏著劑組合物 |
| JP7162008B2 (ja) | 2017-04-21 | 2022-10-27 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 接着剤組成物 |
| CN110437587B (zh) * | 2019-09-10 | 2022-04-22 | 固德电材系统(苏州)股份有限公司 | 一种风电叶片用碳纤维复合材料树脂及其制备方法 |
| CN113999485A (zh) * | 2020-12-29 | 2022-02-01 | 深材科技(深圳)有限公司 | 碳纤维湿法预浸料用高抗冲击高弹性模量纳米改性环氧树脂及其制备方法 |
| CN112773724A (zh) * | 2021-02-02 | 2021-05-11 | 广州市宝贝乐婴童用品有限公司 | 65口径奶嘴双孔 |
| CN114163761B (zh) * | 2021-11-30 | 2023-08-15 | 上海金发科技发展有限公司 | 一种苯乙烯-丙烯酸酯共聚组合物及其制备方法与应用 |
| CN116535822B (zh) * | 2023-06-29 | 2023-10-17 | 泰和新材集团股份有限公司 | 一种用于芳纶复合材料iv型瓶的树脂胶液及制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925901A (en) * | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
| CA2017613A1 (en) * | 1989-05-29 | 1990-11-29 | Kiyomi Yasuda | Heat-resistant, flame-retardant epoxy resin compositions |
| TWI304321B (en) * | 2002-12-27 | 2008-12-11 | Toray Industries | Layered products, electromagnetic wave shielding molded articles and method for production thereof |
| US6887574B2 (en) * | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
| EP1724306A4 (en) * | 2004-03-02 | 2009-04-01 | Toray Industries | EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL, PREIMPREGNE AND FIBER REINFORCED COMPOSITE MATERIAL |
| ES2320906T3 (es) * | 2004-04-02 | 2009-05-29 | Dow Global Technologies Inc. | Resinas termoestables endurecidas con copolimero de bloques anfifilico. |
| BRPI0516702A (pt) * | 2004-11-10 | 2008-09-16 | Dow Global Technologies Inc | composição de verniz de resina epóxi para laminados curável, processo para preparar uma composição de verniz para laminados de resina epóxi curável, processo para preparar um laminado, laminado e pré-impregnado |
| EP2036950B1 (en) * | 2006-06-30 | 2017-05-31 | Toray Industries, Inc. | Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| US7896190B2 (en) * | 2006-07-17 | 2011-03-01 | GM Global Technology Operations LLC | Composites having an improved resistance to fatigue |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| WO2009102566A1 (en) * | 2008-02-15 | 2009-08-20 | Dow Global Technologies Inc. | Thermosetting compositions comprising silicone polyethers, their manufacture, and uses |
-
2009
- 2009-06-30 KR KR1020117001118A patent/KR20110041475A/ko not_active Ceased
- 2009-06-30 CN CN200980127690.4A patent/CN102099402B/zh not_active Expired - Fee Related
- 2009-06-30 EP EP16151525.9A patent/EP3037461A1/en not_active Withdrawn
- 2009-06-30 JP JP2011518780A patent/JP5715055B2/ja not_active Expired - Fee Related
- 2009-06-30 BR BRPI0910800A patent/BRPI0910800A2/pt not_active IP Right Cessation
- 2009-06-30 WO PCT/US2009/049222 patent/WO2010008931A1/en not_active Ceased
- 2009-06-30 US US12/996,026 patent/US20110104498A1/en not_active Abandoned
- 2009-06-30 EP EP20090790004 patent/EP2303953A1/en not_active Withdrawn
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|---|---|
| EP3037461A1 (en) | 2016-06-29 |
| WO2010008931A1 (en) | 2010-01-21 |
| US20110104498A1 (en) | 2011-05-05 |
| CN102099402B (zh) | 2014-06-25 |
| EP2303953A1 (en) | 2011-04-06 |
| JP5715055B2 (ja) | 2015-05-07 |
| CN102099402A (zh) | 2011-06-15 |
| JP2011528399A (ja) | 2011-11-17 |
| BRPI0910800A2 (pt) | 2016-07-12 |
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