BRPI0910800A2 - compósito estrutural e processo para preparar um compósito estrutural - Google Patents

compósito estrutural e processo para preparar um compósito estrutural

Info

Publication number
BRPI0910800A2
BRPI0910800A2 BRPI0910800A BRPI0910800A BRPI0910800A2 BR PI0910800 A2 BRPI0910800 A2 BR PI0910800A2 BR PI0910800 A BRPI0910800 A BR PI0910800A BR PI0910800 A BRPI0910800 A BR PI0910800A BR PI0910800 A2 BRPI0910800 A2 BR PI0910800A2
Authority
BR
Brazil
Prior art keywords
structural composite
preparing
composite
structural
Prior art date
Application number
BRPI0910800A
Other languages
English (en)
Portuguese (pt)
Inventor
George Jacob
Ha Pham
Nikhil Verghese
Rajesh Turakhia
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0910800A2 publication Critical patent/BRPI0910800A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0910800A 2008-07-17 2009-06-30 compósito estrutural e processo para preparar um compósito estrutural BRPI0910800A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8144908P 2008-07-17 2008-07-17
PCT/US2009/049222 WO2010008931A1 (en) 2008-07-17 2009-06-30 Structural composites with improved toughness

Publications (1)

Publication Number Publication Date
BRPI0910800A2 true BRPI0910800A2 (pt) 2016-07-12

Family

ID=41031439

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0910800A BRPI0910800A2 (pt) 2008-07-17 2009-06-30 compósito estrutural e processo para preparar um compósito estrutural

Country Status (7)

Country Link
US (1) US20110104498A1 (enExample)
EP (2) EP3037461A1 (enExample)
JP (1) JP5715055B2 (enExample)
KR (1) KR20110041475A (enExample)
CN (1) CN102099402B (enExample)
BR (1) BRPI0910800A2 (enExample)
WO (1) WO2010008931A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6550210B2 (ja) * 2010-06-17 2019-07-24 スリーエム イノベイティブ プロパティズ カンパニー 複合材料圧力容器
TWI561573B (en) * 2011-11-09 2016-12-11 Dow Global Technologies Llc Curable compositions
WO2013074265A1 (en) 2011-11-14 2013-05-23 Henkel Corporation Adhesive compositions
US9263360B2 (en) 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants
JP6338157B2 (ja) 2012-08-13 2018-06-06 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 液体圧縮成型封止材料
CN103351652B (zh) * 2013-04-16 2016-05-04 上海海隆石油化工研究所 厚涂型快干醇溶无机富锌涂料及其制备方法
WO2015013024A1 (en) 2013-07-22 2015-01-29 Henkel IP & Holding GmbH Methods to control wafer warpage upon compression molding thereof and articles useful therefor
US9245815B2 (en) * 2014-04-29 2016-01-26 Intel Corporation Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
KR20160116599A (ko) * 2015-03-30 2016-10-10 삼성전자주식회사 도전성 복합체 제조용 조성물, 이로부터 제조된 복합체, 및 이를 포함한 전자 소자
JP6606924B2 (ja) * 2015-08-27 2019-11-20 Ｄｉｃ株式会社 エポキシ樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法
JP7011656B2 (ja) * 2016-10-28 2022-01-26 ダウ グローバル テクノロジーズ エルエルシー 改善された低温耐衝撃性を有する衝突耐久性エポキシ接着剤
TWI768032B (zh) 2017-04-21 2022-06-21 德商漢高智慧財產控股公司 黏著劑組合物
CN110536941B (zh) 2017-04-21 2022-04-19 汉高知识产权控股有限责任公司 粘合剂组合物
CN110437587B (zh) * 2019-09-10 2022-04-22 固德电材系统（苏州）股份有限公司 一种风电叶片用碳纤维复合材料树脂及其制备方法
CN113999485A (zh) * 2020-12-29 2022-02-01 深材科技（深圳）有限公司 碳纤维湿法预浸料用高抗冲击高弹性模量纳米改性环氧树脂及其制备方法
CN112773724A (zh) * 2021-02-02 2021-05-11 广州市宝贝乐婴童用品有限公司 65口径奶嘴双孔
CN114163761B (zh) * 2021-11-30 2023-08-15 上海金发科技发展有限公司 一种苯乙烯-丙烯酸酯共聚组合物及其制备方法与应用
CN116535822B (zh) * 2023-06-29 2023-10-17 泰和新材集团股份有限公司 一种用于芳纶复合材料iv型瓶的树脂胶液及制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4925901A (en) * 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
CA2017613A1 (en) * 1989-05-29 1990-11-29 Kiyomi Yasuda Heat-resistant, flame-retardant epoxy resin compositions
TWI304321B (en) * 2002-12-27 2008-12-11 Toray Industries Layered products, electromagnetic wave shielding molded articles and method for production thereof
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JPWO2005083002A1 (ja) * 2004-03-02 2008-01-17 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、および繊維強化複合材料
JP2007530771A (ja) * 2004-04-02 2007-11-01 ダウ グローバル テクノロジーズ インコーポレイティド 両親媒性ブロックコポリマー強化熱硬化樹脂
DE602005018680D1 (de) * 2004-11-10 2010-02-11 Dow Global Technologies Inc Mit amphiphilem blockcopolymer schlagzäh modifizierte epoxidharze und daraus hergestellte elektrische laminate
CN101501132A (zh) * 2006-06-30 2009-08-05 东丽株式会社 环氧树脂组合物、预浸料及纤维增强复合材料
US7896190B2 (en) * 2006-07-17 2011-03-01 GM Global Technology Operations LLC Composites having an improved resistance to fatigue
KR20150063590A (ko) * 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
EP2245084A1 (en) * 2008-02-15 2010-11-03 Dow Global Technologies Inc. Thermosetting compositions comprising silicone polyethers, their manufacture, and uses

Also Published As

Publication number Publication date
JP2011528399A (ja) 2011-11-17
CN102099402A (zh) 2011-06-15
KR20110041475A (ko) 2011-04-21
JP5715055B2 (ja) 2015-05-07
EP3037461A1 (en) 2016-06-29
CN102099402B (zh) 2014-06-25
EP2303953A1 (en) 2011-04-06
US20110104498A1 (en) 2011-05-05
WO2010008931A1 (en) 2010-01-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]