JP5713081B2 - 塗布、現像装置 - Google Patents

塗布、現像装置 Download PDF

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Publication number
JP5713081B2
JP5713081B2 JP2013219228A JP2013219228A JP5713081B2 JP 5713081 B2 JP5713081 B2 JP 5713081B2 JP 2013219228 A JP2013219228 A JP 2013219228A JP 2013219228 A JP2013219228 A JP 2013219228A JP 5713081 B2 JP5713081 B2 JP 5713081B2
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block
unit
processing
module
wafer
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JP2013219228A
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Japanese (ja)
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JP2014033226A5 (enExample
JP2014033226A (ja
Inventor
松岡　伸明
伸明 松岡
宮田　亮
宮田　　亮
林　伸一
伸一 林
卓 榎木田
卓 榎木田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013219228A 2010-07-09 2013-10-22 塗布、現像装置 Active JP5713081B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013219228A JP5713081B2 (ja) 2010-07-09 2013-10-22 塗布、現像装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010156563 2010-07-09
JP2010156563 2010-07-09
JP2013219228A JP5713081B2 (ja) 2010-07-09 2013-10-22 塗布、現像装置

Related Parent Applications (1)

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JP2011053370A Division JP5397399B2 (ja) 2010-07-09 2011-03-10 塗布、現像装置

Related Child Applications (1)

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JP2014099659A Division JP5861738B2 (ja) 2010-07-09 2014-05-13 塗布、現像装置

Publications (3)

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JP2014033226A JP2014033226A (ja) 2014-02-20
JP2014033226A5 JP2014033226A5 (enExample) 2014-05-08
JP5713081B2 true JP5713081B2 (ja) 2015-05-07

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ID=50282769

Family Applications (2)

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JP2013219228A Active JP5713081B2 (ja) 2010-07-09 2013-10-22 塗布、現像装置
JP2014099659A Active JP5861738B2 (ja) 2010-07-09 2014-05-13 塗布、現像装置

Family Applications After (1)

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JP2014099659A Active JP5861738B2 (ja) 2010-07-09 2014-05-13 塗布、現像装置

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JP (2) JP5713081B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6209546B2 (ja) * 2015-02-06 2017-10-04 東京エレクトロン株式会社 基板処理システム、欠陥検査方法、プログラム及びコンピュータ記憶媒体
JP6311639B2 (ja) * 2015-04-13 2018-04-18 東京エレクトロン株式会社 基板処理装置、基板処理装置の運転方法及び記憶媒体
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6458292B2 (ja) * 2018-03-19 2019-01-30 東京エレクトロン株式会社 基板処理装置、基板処理装置の運転方法及び記憶媒体
JP6994489B2 (ja) * 2019-10-02 2022-01-14 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3943828B2 (ja) * 2000-12-08 2007-07-11 東京エレクトロン株式会社 塗布、現像装置及びパターン形成方法
JP2004342654A (ja) * 2003-05-13 2004-12-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4376072B2 (ja) * 2004-01-16 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5008268B2 (ja) * 2004-12-06 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4414921B2 (ja) * 2005-03-23 2010-02-17 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
JP4716362B2 (ja) * 2005-06-07 2011-07-06 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP4450784B2 (ja) * 2005-10-19 2010-04-14 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP2008288447A (ja) * 2007-05-18 2008-11-27 Sokudo:Kk 基板処理装置
JP5183993B2 (ja) * 2007-07-26 2013-04-17 株式会社Ｓｏｋｕｄｏ 基板処理装置

Also Published As

Publication number Publication date
JP2014160869A (ja) 2014-09-04
JP5861738B2 (ja) 2016-02-16
JP2014033226A (ja) 2014-02-20

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