JP5709719B2 - 電子部品支持装置及び電子デバイス - Google Patents

電子部品支持装置及び電子デバイス Download PDF

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Publication number
JP5709719B2
JP5709719B2 JP2011223051A JP2011223051A JP5709719B2 JP 5709719 B2 JP5709719 B2 JP 5709719B2 JP 2011223051 A JP2011223051 A JP 2011223051A JP 2011223051 A JP2011223051 A JP 2011223051A JP 5709719 B2 JP5709719 B2 JP 5709719B2
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Prior art keywords
substrate
electronic component
electrode
heat sink
support device
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JP2011223051A
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Japanese (ja)
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JP2012164956A5 (enExample
JP2012164956A (ja
Inventor
重信 関根
重信 関根
由莉奈 関根
由莉奈 関根
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有限会社 ナプラ
有限会社 ナプラ
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Priority to JP2011223051A priority Critical patent/JP5709719B2/ja
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Publication of JP2012164956A5 publication Critical patent/JP2012164956A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011223051A 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス Active JP5709719B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011223051A JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011007519 2011-01-18
JP2011007519 2011-01-18
JP2011223051A JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

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JP2012164956A JP2012164956A (ja) 2012-08-30
JP2012164956A5 JP2012164956A5 (enExample) 2014-10-23
JP5709719B2 true JP5709719B2 (ja) 2015-04-30

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JP2011223051A Active JP5709719B2 (ja) 2011-01-18 2011-10-07 電子部品支持装置及び電子デバイス

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JP (1) JP5709719B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368469B2 (en) 2012-08-30 2016-06-14 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method of manufacturing same
JP5651807B2 (ja) * 2012-09-05 2015-01-14 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
US9524917B2 (en) * 2014-04-23 2016-12-20 Optiz, Inc. Chip level heat dissipation using silicon
WO2020004459A1 (ja) * 2018-06-26 2020-01-02 京セラ株式会社 電子素子搭載用基板、電子装置および電子モジュール
CN114614228A (zh) * 2020-12-09 2022-06-10 深南电路股份有限公司 耦合器及电子设备
KR102855264B1 (ko) * 2022-11-22 2025-09-03 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 패키지

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294253A (ja) * 2007-05-25 2008-12-04 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP2009117489A (ja) * 2007-11-02 2009-05-28 Sharp Corp 半導体素子パッケージ及び実装基板
JP5357706B2 (ja) * 2009-11-10 2013-12-04 パナソニック株式会社 半導体実装構造体

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JP2012164956A (ja) 2012-08-30

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