JP5704606B2 - 被露光基板のアライメント補正方法及び露光装置 - Google Patents

被露光基板のアライメント補正方法及び露光装置 Download PDF

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Publication number
JP5704606B2
JP5704606B2 JP2011170292A JP2011170292A JP5704606B2 JP 5704606 B2 JP5704606 B2 JP 5704606B2 JP 2011170292 A JP2011170292 A JP 2011170292A JP 2011170292 A JP2011170292 A JP 2011170292A JP 5704606 B2 JP5704606 B2 JP 5704606B2
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JP
Japan
Prior art keywords
exposed
substrate
alignment
correction amount
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011170292A
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English (en)
Japanese (ja)
Other versions
JP2013037034A5 (enExample
JP2013037034A (ja
Inventor
義昭 野村
義昭 野村
敏成 新井
敏成 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Priority to JP2011170292A priority Critical patent/JP5704606B2/ja
Priority to CN201280037975.0A priority patent/CN103733138B/zh
Priority to PCT/JP2012/069339 priority patent/WO2013018762A1/ja
Priority to KR1020147005146A priority patent/KR20140056298A/ko
Priority to TW101127907A priority patent/TWI531876B/zh
Publication of JP2013037034A publication Critical patent/JP2013037034A/ja
Priority to US14/168,212 priority patent/US9360776B2/en
Publication of JP2013037034A5 publication Critical patent/JP2013037034A5/ja
Application granted granted Critical
Publication of JP5704606B2 publication Critical patent/JP5704606B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2011170292A 2011-08-03 2011-08-03 被露光基板のアライメント補正方法及び露光装置 Expired - Fee Related JP5704606B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011170292A JP5704606B2 (ja) 2011-08-03 2011-08-03 被露光基板のアライメント補正方法及び露光装置
PCT/JP2012/069339 WO2013018762A1 (ja) 2011-08-03 2012-07-30 被露光基板のアライメント補正方法及び露光装置
KR1020147005146A KR20140056298A (ko) 2011-08-03 2012-07-30 피노광 기판의 얼라인먼트 보정 방법 및 노광 장치
CN201280037975.0A CN103733138B (zh) 2011-08-03 2012-07-30 被曝光基板的定位校正方法及曝光装置
TW101127907A TWI531876B (zh) 2011-08-03 2012-08-03 被曝光基板之對準校正方法及曝光裝置
US14/168,212 US9360776B2 (en) 2011-08-03 2014-01-30 Alignment correction method for substrate to be exposed, and exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011170292A JP5704606B2 (ja) 2011-08-03 2011-08-03 被露光基板のアライメント補正方法及び露光装置

Publications (3)

Publication Number Publication Date
JP2013037034A JP2013037034A (ja) 2013-02-21
JP2013037034A5 JP2013037034A5 (enExample) 2014-03-06
JP5704606B2 true JP5704606B2 (ja) 2015-04-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011170292A Expired - Fee Related JP5704606B2 (ja) 2011-08-03 2011-08-03 被露光基板のアライメント補正方法及び露光装置

Country Status (6)

Country Link
US (1) US9360776B2 (enExample)
JP (1) JP5704606B2 (enExample)
KR (1) KR20140056298A (enExample)
CN (1) CN103733138B (enExample)
TW (1) TWI531876B (enExample)
WO (1) WO2013018762A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104677314A (zh) 2015-03-02 2015-06-03 合肥京东方光电科技有限公司 检测显示面板表面平坦度的装置及方法
CN104678622A (zh) * 2015-03-26 2015-06-03 合肥鑫晟光电科技有限公司 一种阵列基板检测方法和检测系统
US20170323708A1 (en) * 2016-05-03 2017-11-09 Texas Instruments Incorporated Component sheet and method of singulating
CN106086786B (zh) * 2016-08-19 2018-06-05 京东方科技集团股份有限公司 偏移校准方法及系统
US10760895B2 (en) 2016-09-30 2020-09-01 Nidec-Read Corporation Length measurement device
KR101874409B1 (ko) * 2016-10-25 2018-07-04 에이피시스템 주식회사 얼라인 검사 장치 및 이를 이용한 얼라인 검사 방법
CN106502057B (zh) * 2016-11-25 2018-07-27 天津津芯微电子科技有限公司 标定方法及标定系统
CN108267871B (zh) 2017-01-04 2020-12-04 京东方科技集团股份有限公司 一种角度调整治具
DE102017123686A1 (de) 2017-10-11 2019-04-11 Miva Technologies Gmbh Verfahren und Belichtungseinrichtung zur Belichtung von zumindest einer gespeicherten Darstellung auf einem lichtempfindlichen Aufzeichnungsträger
CN108198219B (zh) * 2017-11-21 2022-05-13 合肥工业大学 用于摄影测量的相机标定参数的误差补偿方法
KR102767412B1 (ko) * 2019-01-25 2025-02-13 삼성디스플레이 주식회사 표시장치 제조용 스테이지 얼라인먼트 장치 및 방법
CN109969807B (zh) * 2019-05-29 2019-08-16 湖南思威博恒智能科技有限责任公司 自动纠偏码垛夹具、码垛机器人以及托盘纠偏方法
DE102019122839A1 (de) * 2019-08-26 2021-03-04 Miva Technologies Gmbh Verfahren und Belichtungseinrichtung zur Belichtung eines lichtempfindlichen Aufzeichnungsträgers
CN110796658A (zh) * 2019-11-15 2020-02-14 常州瑞昇科技有限公司 织物对边方法、装置、计算机设备和存储介质
CN112117316B (zh) * 2020-09-23 2024-05-31 京东方科技集团股份有限公司 显示母板、显示母板的制备方法和对位方法
CN113382231B (zh) * 2021-06-08 2023-04-07 京东方科技集团股份有限公司 显示面板的检测方法、装置、设备和存储介质
WO2023189435A1 (ja) * 2022-03-31 2023-10-05 株式会社ニコン 解析システム、露光方法、露光装置、及びデバイス
JP2023149378A (ja) * 2022-03-31 2023-10-13 株式会社ニコン 解析システム及び露光方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4076341B2 (ja) * 2001-11-29 2008-04-16 大日本スクリーン製造株式会社 レーザ描画方法とその装置
TW200641564A (en) * 2005-02-24 2006-12-01 Fuji Photo Film Co Ltd The correction method of plotting device
JP2006337874A (ja) * 2005-06-03 2006-12-14 Fujifilm Holdings Corp 露光装置及び露光方法
JP2008076709A (ja) 2006-09-21 2008-04-03 V Technology Co Ltd 露光装置
CN100520599C (zh) * 2007-09-17 2009-07-29 上海微电子装备有限公司 一种非对称透射标记组合及其对准方法
JP2009230008A (ja) * 2008-03-25 2009-10-08 Fujifilm Corp 露光装置、及び露光方法
JP5164069B2 (ja) * 2008-08-28 2013-03-13 Ｎｓｋテクノロジー株式会社 スキャン露光装置およびスキャン露光方法
JP2010231062A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 描画装置および描画方法

Also Published As

Publication number Publication date
KR20140056298A (ko) 2014-05-09
US9360776B2 (en) 2016-06-07
WO2013018762A1 (ja) 2013-02-07
TW201321908A (zh) 2013-06-01
CN103733138A (zh) 2014-04-16
TWI531876B (zh) 2016-05-01
JP2013037034A (ja) 2013-02-21
CN103733138B (zh) 2016-03-30
US20140146299A1 (en) 2014-05-29

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