JP5699230B2 - 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体 - Google Patents

有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体 Download PDF

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Publication number
JP5699230B2
JP5699230B2 JP2013557951A JP2013557951A JP5699230B2 JP 5699230 B2 JP5699230 B2 JP 5699230B2 JP 2013557951 A JP2013557951 A JP 2013557951A JP 2013557951 A JP2013557951 A JP 2013557951A JP 5699230 B2 JP5699230 B2 JP 5699230B2
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particles
organic
group
conductive
inorganic hybrid
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Japanese (ja)
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JPWO2014087984A1 (ja
Inventor
恭幸 山田
恭幸 山田
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2013557951A priority Critical patent/JP5699230B2/ja
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Publication of JPWO2014087984A1 publication Critical patent/JPWO2014087984A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
JP2013557951A 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体 Active JP5699230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013557951A JP5699230B2 (ja) 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012267382 2012-12-06
JP2012267382 2012-12-06
PCT/JP2013/082422 WO2014087984A1 (ja) 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体
JP2013557951A JP5699230B2 (ja) 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JP5699230B2 true JP5699230B2 (ja) 2015-04-08
JPWO2014087984A1 JPWO2014087984A1 (ja) 2017-01-05

Family

ID=50883401

Family Applications (1)

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JP2013557951A Active JP5699230B2 (ja) 2012-12-06 2013-12-03 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体

Country Status (5)

Country Link
JP (1) JP5699230B2 (zh)
KR (1) KR101538904B1 (zh)
CN (1) CN104718241B (zh)
TW (1) TWI506076B (zh)
WO (1) WO2014087984A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6859077B2 (ja) * 2015-11-11 2021-04-14 積水化学工業株式会社 粒子材料、接続材料及び接続構造体
CN107709414B (zh) * 2015-11-11 2021-12-28 积水化学工业株式会社 粒子、粒子材料、连接材料及连接结构体
CN107221649B (zh) * 2016-03-21 2020-05-19 中国科学院苏州纳米技术与纳米仿生研究所 具有有机-无机复合保护层的电极、其制备方法及应用
JP6216474B1 (ja) * 2017-03-07 2017-10-18 宇部エクシモ株式会社 有機無機複合粒子
GB2561609B (en) * 2017-04-21 2019-12-18 Peratech Holdco Ltd Method of producing agglomerates for inclusion in a composite material
BR112022016524A2 (pt) * 2020-02-19 2022-10-11 Triplew Ltd Métodos e sistemas para produção de ácido lático e reciclagem de ácido polilático

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09197705A (ja) * 1996-01-11 1997-07-31 Nippon Shokubai Co Ltd 有機質−無機質複合体粒子、その製造法および用途
JP2000204119A (ja) * 1999-01-14 2000-07-25 Nippon Shokubai Co Ltd 有機質無機質複合体粒子、その製造方法およびその用途
JP2001115024A (ja) * 1999-10-19 2001-04-24 Dainippon Toryo Co Ltd 有機無機複合樹脂水性エマルジョン、その製造方法及び二液型コーティング組成物
JP2004035293A (ja) * 2002-07-01 2004-02-05 Ube Nitto Kasei Co Ltd シリカ系粒子、その製造方法及び導電性シリカ系粒子
WO2012020799A1 (ja) * 2010-08-11 2012-02-16 株式会社日本触媒 重合体微粒子、導電性微粒子および異方性導電材料
JP2012041392A (ja) * 2010-08-13 2012-03-01 Asahi Kasei E-Materials Corp 感光性シリカ粒子含有縮合反応物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503932A (en) * 1993-11-17 1996-04-02 Nippon Shokubai Co., Ltd. Organic-inorganic composite particles and production process therefor
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
CN102272218B (zh) * 2009-01-08 2014-07-16 纳克公司 聚硅氧烷聚合物与无机纳米颗粒的复合物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09197705A (ja) * 1996-01-11 1997-07-31 Nippon Shokubai Co Ltd 有機質−無機質複合体粒子、その製造法および用途
JP2000204119A (ja) * 1999-01-14 2000-07-25 Nippon Shokubai Co Ltd 有機質無機質複合体粒子、その製造方法およびその用途
JP2001115024A (ja) * 1999-10-19 2001-04-24 Dainippon Toryo Co Ltd 有機無機複合樹脂水性エマルジョン、その製造方法及び二液型コーティング組成物
JP2004035293A (ja) * 2002-07-01 2004-02-05 Ube Nitto Kasei Co Ltd シリカ系粒子、その製造方法及び導電性シリカ系粒子
WO2012020799A1 (ja) * 2010-08-11 2012-02-16 株式会社日本触媒 重合体微粒子、導電性微粒子および異方性導電材料
JP2012041392A (ja) * 2010-08-13 2012-03-01 Asahi Kasei E-Materials Corp 感光性シリカ粒子含有縮合反応物

Also Published As

Publication number Publication date
KR20150023064A (ko) 2015-03-04
WO2014087984A1 (ja) 2014-06-12
CN104718241A (zh) 2015-06-17
KR101538904B1 (ko) 2015-07-22
JPWO2014087984A1 (ja) 2017-01-05
TWI506076B (zh) 2015-11-01
CN104718241B (zh) 2016-11-23
TW201434898A (zh) 2014-09-16

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