JP5698894B2 - 電子部品の放熱構造 - Google Patents

電子部品の放熱構造 Download PDF

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Publication number
JP5698894B2
JP5698894B2 JP2008274159A JP2008274159A JP5698894B2 JP 5698894 B2 JP5698894 B2 JP 5698894B2 JP 2008274159 A JP2008274159 A JP 2008274159A JP 2008274159 A JP2008274159 A JP 2008274159A JP 5698894 B2 JP5698894 B2 JP 5698894B2
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Japan
Prior art keywords
heat
shield case
electronic component
housing
heat dissipation
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JP2008274159A
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English (en)
Japanese (ja)
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JP2010103342A5 (enExample
JP2010103342A (ja
Inventor
勇人 久津摩
勇人 久津摩
小林　孝
小林　　孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2008274159A priority Critical patent/JP5698894B2/ja
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Publication of JP2010103342A5 publication Critical patent/JP2010103342A5/ja
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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2008274159A 2008-10-24 2008-10-24 電子部品の放熱構造 Active JP5698894B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008274159A JP5698894B2 (ja) 2008-10-24 2008-10-24 電子部品の放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008274159A JP5698894B2 (ja) 2008-10-24 2008-10-24 電子部品の放熱構造

Publications (3)

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JP2010103342A JP2010103342A (ja) 2010-05-06
JP2010103342A5 JP2010103342A5 (enExample) 2011-02-10
JP5698894B2 true JP5698894B2 (ja) 2015-04-08

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Family Applications (1)

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JP2008274159A Active JP5698894B2 (ja) 2008-10-24 2008-10-24 電子部品の放熱構造

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JP (1) JP5698894B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11393739B2 (en) 2018-03-08 2022-07-19 Denso Corporation Heat dissipation device for electronic component

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5565608B2 (ja) * 2009-09-25 2014-08-06 株式会社オートネットワーク技術研究所 回路ユニット
JP2016127341A (ja) * 2014-12-26 2016-07-11 富士通株式会社 無線装置
WO2016163135A1 (ja) * 2015-04-08 2016-10-13 三菱電機株式会社 電子モジュール及び電子装置
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
JP2017212379A (ja) * 2016-05-26 2017-11-30 株式会社ジェイテクト 半導体装置
CN106231883A (zh) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb板组件及具有其的移动终端
JP7326138B2 (ja) * 2019-12-06 2023-08-15 サクサ株式会社 電子機器における放熱構造
CN119654746A (zh) * 2022-08-16 2025-03-18 谷歌有限责任公司 可在6 GHz带操作的无线网络装置
CN116406156B (zh) * 2023-06-09 2023-08-18 中国科学院微小卫星创新研究院 电磁屏蔽与散热一体化的星载电子系统及其装配方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748455A (en) * 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
JPH1041678A (ja) * 1996-07-25 1998-02-13 Hitachi Ltd 光受信器
US6195267B1 (en) * 1999-06-23 2001-02-27 Ericsson Inc. Gel structure for combined EMI shielding and thermal control of microelectronic assemblies
JP2004207661A (ja) * 2002-12-26 2004-07-22 Sony Corp 放熱部材および放熱部材を有する電子機器
KR100652621B1 (ko) * 2003-11-21 2006-12-06 엘지전자 주식회사 휴대용 단말기의 방열장치
JP4525460B2 (ja) * 2005-05-12 2010-08-18 富士通株式会社 モバイル機器
JP2008277432A (ja) * 2007-04-26 2008-11-13 Kaneka Corp 放熱構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11393739B2 (en) 2018-03-08 2022-07-19 Denso Corporation Heat dissipation device for electronic component

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JP2010103342A (ja) 2010-05-06

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