JP5697061B1 - 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 - Google Patents

半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 Download PDF

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Publication number
JP5697061B1
JP5697061B1 JP2014061011A JP2014061011A JP5697061B1 JP 5697061 B1 JP5697061 B1 JP 5697061B1 JP 2014061011 A JP2014061011 A JP 2014061011A JP 2014061011 A JP2014061011 A JP 2014061011A JP 5697061 B1 JP5697061 B1 JP 5697061B1
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JP
Japan
Prior art keywords
semiconductor wafer
processing
adhesive tape
pressure
sensitive adhesive
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Active
Application number
JP2014061011A
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English (en)
Japanese (ja)
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JP2015185692A (ja
Inventor
祥文 岡
祥文 岡
具朗 内山
具朗 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2014061011A priority Critical patent/JP5697061B1/ja
Priority to CN201580015094.2A priority patent/CN106104767B/zh
Priority to KR1020167028971A priority patent/KR101766174B1/ko
Priority to PCT/JP2015/058601 priority patent/WO2015146856A1/ja
Priority to TW104109280A priority patent/TWI590361B/zh
Application granted granted Critical
Publication of JP5697061B1 publication Critical patent/JP5697061B1/ja
Publication of JP2015185692A publication Critical patent/JP2015185692A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2014061011A 2014-03-24 2014-03-24 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法 Active JP5697061B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014061011A JP5697061B1 (ja) 2014-03-24 2014-03-24 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
CN201580015094.2A CN106104767B (zh) 2014-03-24 2015-03-20 半导体晶片加工用胶带和半导体晶片的加工方法
KR1020167028971A KR101766174B1 (ko) 2014-03-24 2015-03-20 반도체 웨이퍼 가공용 점착 테이프 및 반도체 웨이퍼의 가공 방법
PCT/JP2015/058601 WO2015146856A1 (ja) 2014-03-24 2015-03-20 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
TW104109280A TWI590361B (zh) 2014-03-24 2015-03-24 Semiconductor Wafer Processing Adhesive Tapes and Semiconductor Wafer Processing Methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014061011A JP5697061B1 (ja) 2014-03-24 2014-03-24 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法

Publications (2)

Publication Number Publication Date
JP5697061B1 true JP5697061B1 (ja) 2015-04-08
JP2015185692A JP2015185692A (ja) 2015-10-22

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JP2014061011A Active JP5697061B1 (ja) 2014-03-24 2014-03-24 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法

Country Status (5)

Country Link
JP (1) JP5697061B1 (ko)
KR (1) KR101766174B1 (ko)
CN (1) CN106104767B (ko)
TW (1) TWI590361B (ko)
WO (1) WO2015146856A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6469854B2 (ja) * 2015-11-09 2019-02-13 古河電気工業株式会社 半導体チップの製造方法及びこれに用いるマスク一体型表面保護テープ
PT3376528T (pt) 2015-11-09 2022-09-29 Furukawa Electric Co Ltd Fita de proteção de superfície de máscara integrada
SG11201808291YA (en) * 2016-03-30 2018-10-30 Lintec Corp Semiconductor processing sheet
JP2018184551A (ja) * 2017-04-26 2018-11-22 日東電工株式会社 粘着シート
JP7042667B2 (ja) 2018-03-28 2022-03-28 古河電気工業株式会社 半導体チップの製造方法
CN114080406A (zh) * 2019-07-31 2022-02-22 大阪有机化学工业株式会社 固化性树脂组合物、以及弹性体及片材

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000017239A (ja) * 1998-07-01 2000-01-18 Mitsui Chemicals Inc 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
US20030001283A1 (en) * 2001-06-29 2003-01-02 Takashi Kumamoto Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP2012214545A (ja) * 2011-03-31 2012-11-08 Lintec Corp 粘着剤および粘着シート
US20130001283A1 (en) * 2011-06-29 2013-01-03 Steven Friderich Flexible Multi-Panel Sterilization Assembly
JP2013087131A (ja) * 2011-10-13 2013-05-13 Lintec Corp 粘着シートおよびその使用方法
JP2013091731A (ja) * 2011-10-26 2013-05-16 Denki Kagaku Kogyo Kk 粘着テープ、及び粘着テープ巻取体とその製造方法
JP2013181088A (ja) * 2012-03-01 2013-09-12 Mitsubishi Plastics Inc 画像表示装置用透明両面粘着シート及びこれを用いた画像表示装置
WO2013141251A1 (ja) * 2012-03-23 2013-09-26 リンテック株式会社 フィルム、ワーク加工用シート基材およびワーク加工用シート
JP2013201263A (ja) * 2012-03-23 2013-10-03 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP2014011273A (ja) * 2012-06-28 2014-01-20 Furukawa Electric Co Ltd:The ウェハ加工用粘着テープ
JP2014055206A (ja) * 2012-09-11 2014-03-27 Mitsubishi Plastics Inc アクリル系樹脂フィルム及びダイシング用粘着シート
JP5480415B1 (ja) * 2012-10-11 2014-04-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP5705447B2 (ja) * 2010-03-31 2015-04-22 古河電気工業株式会社 表面保護用粘着テープ
JP6393449B2 (ja) 2012-03-27 2018-09-19 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000017239A (ja) * 1998-07-01 2000-01-18 Mitsui Chemicals Inc 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
US20030001283A1 (en) * 2001-06-29 2003-01-02 Takashi Kumamoto Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP2012214545A (ja) * 2011-03-31 2012-11-08 Lintec Corp 粘着剤および粘着シート
US20130001283A1 (en) * 2011-06-29 2013-01-03 Steven Friderich Flexible Multi-Panel Sterilization Assembly
JP2013087131A (ja) * 2011-10-13 2013-05-13 Lintec Corp 粘着シートおよびその使用方法
JP2013091731A (ja) * 2011-10-26 2013-05-16 Denki Kagaku Kogyo Kk 粘着テープ、及び粘着テープ巻取体とその製造方法
JP2013181088A (ja) * 2012-03-01 2013-09-12 Mitsubishi Plastics Inc 画像表示装置用透明両面粘着シート及びこれを用いた画像表示装置
WO2013141251A1 (ja) * 2012-03-23 2013-09-26 リンテック株式会社 フィルム、ワーク加工用シート基材およびワーク加工用シート
JP2013201263A (ja) * 2012-03-23 2013-10-03 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP2014011273A (ja) * 2012-06-28 2014-01-20 Furukawa Electric Co Ltd:The ウェハ加工用粘着テープ
JP2014055206A (ja) * 2012-09-11 2014-03-27 Mitsubishi Plastics Inc アクリル系樹脂フィルム及びダイシング用粘着シート
JP5480415B1 (ja) * 2012-10-11 2014-04-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ

Also Published As

Publication number Publication date
CN106104767B (zh) 2018-05-01
CN106104767A (zh) 2016-11-09
KR20160125524A (ko) 2016-10-31
TW201539630A (zh) 2015-10-16
KR101766174B1 (ko) 2017-08-07
TWI590361B (zh) 2017-07-01
JP2015185692A (ja) 2015-10-22
WO2015146856A1 (ja) 2015-10-01

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