JP5695943B2 - 真空処理装置用の端子ユニット及びその製造方法 - Google Patents
真空処理装置用の端子ユニット及びその製造方法 Download PDFInfo
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- JP5695943B2 JP5695943B2 JP2011054466A JP2011054466A JP5695943B2 JP 5695943 B2 JP5695943 B2 JP 5695943B2 JP 2011054466 A JP2011054466 A JP 2011054466A JP 2011054466 A JP2011054466 A JP 2011054466A JP 5695943 B2 JP5695943 B2 JP 5695943B2
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- vacuum
- conductor
- insulator
- terminal unit
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims description 64
- 239000012212 insulator Substances 0.000 claims description 48
- 238000005192 partition Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000005304 joining Methods 0.000 claims description 10
- 210000002105 tongue Anatomy 0.000 claims 7
- 238000005219 brazing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 230000008054 signal transmission Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 210000005182 tip of the tongue Anatomy 0.000 description 1
Images
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- Gasket Seals (AREA)
- Drying Of Semiconductors (AREA)
- Installation Of Indoor Wiring (AREA)
Description
Claims (4)
- 透孔を有する真空隔壁と、
前記真空隔壁の片面に接合され、前記透孔に連通する開口を有する絶縁体と、
前記絶縁体表面に接合され、前記透孔に連通する他の開口を有する導体と、
前記導体またはこの導体表面に更に接合される、前記透孔に連通する開口を有する絶縁体のいずれか一方の表面に接合され、絶縁体と導体との両開口から透孔に至る空間を閉鎖する蓋体とを備え、
前記導体は、その内周縁部に内方に向かって突設した第1の舌片と、その外周縁部に外方に向かって突設した第2の舌片とを備えることを特徴とする真空処理装置用の端子ユニット。 - 請求項1記載の真空処理装置用の端子ユニットであって、前記絶縁体と前記導体とが交互に複数枚積み重ねて接合されたものにおいて、一の導体に形成された第1の舌片及び第2の舌片と、他の導体に形成された第1の舌片及び第2の舌片とを周方向で相互にずらしたことを特徴する真空処理装置用の端子ユニット。
- 前記真空隔壁は、真空チャンバに設けられた接続ポートに着脱自在に装着される真空フランジであることを特徴とする請求項1または請求項2記載の真空処理装置用の端子ユニット。
- 真空処理装置の端子ユニットの製造方法であって、
透孔を有する真空隔壁の片面に、透孔に通じる開口を有する環状の絶縁体を接合する工程と、
前記絶縁体表面に前記透孔に通じる他の開口を有し、その内周縁部と外周縁部とに夫々突設した舌片を備えた環状の導体を接合する工程と、
導体表面に、絶縁体と導体との両開口から透孔に至る空間を閉鎖する蓋体と接合する工程と、を含むことを特徴とする真空処理装置用の端子ユニットの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011054466A JP5695943B2 (ja) | 2011-03-11 | 2011-03-11 | 真空処理装置用の端子ユニット及びその製造方法 |
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JP2011054466A JP5695943B2 (ja) | 2011-03-11 | 2011-03-11 | 真空処理装置用の端子ユニット及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
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JP2012191799A JP2012191799A (ja) | 2012-10-04 |
JP2012191799A5 JP2012191799A5 (ja) | 2014-04-03 |
JP5695943B2 true JP5695943B2 (ja) | 2015-04-08 |
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JP2011054466A Active JP5695943B2 (ja) | 2011-03-11 | 2011-03-11 | 真空処理装置用の端子ユニット及びその製造方法 |
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JP (1) | JP5695943B2 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4423893C2 (de) * | 1994-07-07 | 1996-09-05 | Freudenberg Carl Fa | Flachdichtung mit flexibler Leiterplatte |
JP2000245036A (ja) * | 1999-02-17 | 2000-09-08 | Ishikawajima Harima Heavy Ind Co Ltd | 電線貫通装置 |
JP2004308761A (ja) * | 2003-04-07 | 2004-11-04 | Uchiyama Mfg Corp | 多機能ガスケット |
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