JP5674321B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5674321B2 JP5674321B2 JP2010029973A JP2010029973A JP5674321B2 JP 5674321 B2 JP5674321 B2 JP 5674321B2 JP 2010029973 A JP2010029973 A JP 2010029973A JP 2010029973 A JP2010029973 A JP 2010029973A JP 5674321 B2 JP5674321 B2 JP 5674321B2
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- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- preceramic polymer
- metal film
- ceramic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73263—Layer and strap connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
2 第1パワー半導体
3 第1放熱プレート
4 第2パワー半導体
5 第2放熱プレート
6 接続装置
7 第1金属膜
8 絶縁膜
9 第2金属膜
10 接触部
11 第3パワー半導体
12 第4パワー半導体
13 接触面
14 アンダーフィル部
V1〜V6 体積
Claims (7)
- 接触部(10)を備える表面を有している半導体(2、4、11、12)が膜結合(7、8、9)から形成された電気接続装置(6)と接続されている半導体装置であって、前記電気接続装置(6)と前記半導体(2、4、11、12)の前記表面との間にアンダーフィル部(14)が設けられている半導体装置において、
前記アンダーフィル部(14)がゲル状或いは熱硬化性形態で存在するプレセラミックポリマーから形成されたマトリックスを有していて、前記膜結合は、電気絶縁膜を介して第2金属膜によって積層されている第1金属膜を含有し、前記第1金属膜は、前記半導体の前記接触部に導電接続されていることを特徴とする半導体装置。 - 前記プレセラミックポリマーが、80体積%までの充填程度で充填材料によって充填されている、請求項1に記載の半導体装置。
- 前記充填材料が、セラミック材料から形成され且つ0.5〜500μmの範囲の平均粒子サイズを有するパウダーである、請求項2に記載の半導体装置。
- 前記セラミック材料の熱伝導率λが、室温で10W/mKより大きい、請求項3に記載の半導体装置。
- 前記セラミック材料が、BN、SiC、Si3N4、AlN、ステアタイト、コーディエライトのグループから選択されている、請求項3又は4に記載の半導体装置。
- 前記プレセラミックポリマーが、ポリシロキサン、ポリシラザン、ポリカルボシランのグループから選択されている、請求項1〜5のうちのいずれか一項に記載の半導体装置。
- 前記半導体(2、4、11、12)の前記表面に対向する下面が、基板(1)と接続されている、請求項1〜6のうちのいずれか一項に記載の半導体装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009000888A DE102009000888B4 (de) | 2009-02-16 | 2009-02-16 | Halbleiteranordnung |
DE102009000888.8 | 2009-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010199578A JP2010199578A (ja) | 2010-09-09 |
JP5674321B2 true JP5674321B2 (ja) | 2015-02-25 |
Family
ID=42181148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010029973A Expired - Fee Related JP5674321B2 (ja) | 2009-02-16 | 2010-02-15 | 半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8564126B2 (ja) |
EP (1) | EP2219213B1 (ja) |
JP (1) | JP5674321B2 (ja) |
KR (1) | KR101630879B1 (ja) |
CN (1) | CN101807565B (ja) |
DE (1) | DE102009000888B4 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012222012B4 (de) * | 2012-11-30 | 2017-04-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung und ein Verfahren zur Herstellung einer Leistungshalbleitereinrichtung |
DE102013108185B4 (de) | 2013-07-31 | 2021-09-23 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer leistungselektronischen Schalteinrichtung und leistungselektronische Schalteinrichtung |
DE102015116165A1 (de) * | 2015-09-24 | 2017-03-30 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer leistungselektronischen Schalteinrichtung und leistungselektronische Schalteinrichtung |
DE102022111579A1 (de) | 2022-05-10 | 2023-11-16 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer leistungselektronischen Schalteinrichtung und leistungselektronische Schalteinrichtung |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5654246A (en) * | 1985-02-04 | 1997-08-05 | Lanxide Technology Company, Lp | Methods of making composite ceramic articles having embedded filler |
EP0586149A1 (en) | 1992-08-31 | 1994-03-09 | Dow Corning Corporation | Hermetic protection for integrated circuits, based on a ceramic layer |
US5436083A (en) * | 1994-04-01 | 1995-07-25 | Dow Corning Corporation | Protective electronic coatings using filled polysilazanes |
DE69606942T2 (de) * | 1995-09-25 | 2000-10-05 | Dow Corning | Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik |
US6319740B1 (en) * | 1995-10-27 | 2001-11-20 | Honeywell International Inc. | Multilayer protective coating for integrated circuits and multichip modules and method of applying same |
US5780163A (en) * | 1996-06-05 | 1998-07-14 | Dow Corning Corporation | Multilayer coating for microelectronic devices |
US6624216B2 (en) | 2002-01-31 | 2003-09-23 | National Starch And Chemical Investment Holding Corporation | No-flow underfill encapsulant |
US6940173B2 (en) | 2003-01-29 | 2005-09-06 | International Business Machines Corporation | Interconnect structures incorporating low-k dielectric barrier films |
DE10340438B4 (de) * | 2003-09-02 | 2005-08-04 | Epcos Ag | Sendemodul mit verbesserter Wärmeabführung |
DE10355925B4 (de) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren seiner Herstellung |
US20060062985A1 (en) * | 2004-04-26 | 2006-03-23 | Karandikar Prashant G | Nanotube-containing composite bodies, and methods for making same |
DE102006013078B4 (de) | 2006-03-22 | 2008-01-03 | Semikron Elektronik Gmbh & Co. Kg | Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung |
DE102007006706B4 (de) | 2007-02-10 | 2011-05-26 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu |
JP2010155870A (ja) * | 2007-04-20 | 2010-07-15 | Denki Kagaku Kogyo Kk | 熱伝導性コンパウンドおよびその製造方法 |
US8637627B2 (en) * | 2007-12-06 | 2014-01-28 | Rohm And Haas Company | Phenoxyphenyl polysiloxane composition and method for making and using same |
-
2009
- 2009-02-16 DE DE102009000888A patent/DE102009000888B4/de not_active Expired - Fee Related
- 2009-12-24 EP EP09016022A patent/EP2219213B1/de not_active Not-in-force
-
2010
- 2010-02-11 US US12/704,289 patent/US8564126B2/en not_active Expired - Fee Related
- 2010-02-12 KR KR1020100013316A patent/KR101630879B1/ko active IP Right Grant
- 2010-02-12 CN CN201010119271.0A patent/CN101807565B/zh not_active Expired - Fee Related
- 2010-02-15 JP JP2010029973A patent/JP5674321B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8564126B2 (en) | 2013-10-22 |
KR20100093493A (ko) | 2010-08-25 |
EP2219213A2 (de) | 2010-08-18 |
DE102009000888B4 (de) | 2011-03-24 |
US20100264537A1 (en) | 2010-10-21 |
CN101807565A (zh) | 2010-08-18 |
JP2010199578A (ja) | 2010-09-09 |
EP2219213A3 (de) | 2010-11-03 |
CN101807565B (zh) | 2015-05-13 |
DE102009000888A1 (de) | 2010-08-26 |
KR101630879B1 (ko) | 2016-06-15 |
EP2219213B1 (de) | 2012-07-25 |
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