TW201035377A - Aluminum-graphite complex, heat radiating component using the same and LED luminescent member - Google Patents

Abstract

Provided is a method for manufacturing aluminum-graphite complex, which comprises the following steps sequentially: (l) an isotropic graphite material is processed into a plate with a thickness of 0.5 to 3 mm, wherein the isotropic graphite material has a thermo conductivity of 25 DEG C of 100 to 200 W/mK, maximum/minimum of thermo conductivity on the orthogonal three directions is 1 to 1.3, a thermo expansion coefficient of 25 to 150 DEG C of 2x10<SP>-6</SP> to 5x10<SP>-6</SP>/K, maximum/minimum of thermo expansion coefficient on the orthogonal three directions is 1 to 1.3 and a porous ratio of 10 to 20 vo1%; (2) the plate consisted of isotropic graphite material is laminated with inserting mold-release plate and pressed with an assembly torque of 1 to 50 Nm, wherein the assembly torque is on a vertical direction to a plate surface of the isotropic graphite material; and (3) 70% or more of porous of the isotropic graphite material is immersed with aluminum alloy and aluminum alloy layers are installed onto the two main surfaces of the plate isotropic graphite material, wherein the immersion is proceeded by pressure immersing aluminum alloy containing 3 to 20 mass% of silicon with a pressure of 20 Mpa or more with casting forging method.

Description

201035377 • VI. Invention: [Technical Field] The present invention relates to an aluminum-graphite composite, a heat dissipating component using the same, and an LED lighting member. [Prior Art] In recent years, as a light-emitting, thin-film, and power-saving lighting and light-emitting device, a light-emitting diode (hereinafter referred to as LED) has attracted attention. The LED element is a component that causes a forward current to flow to the pn junction of the semiconductor, and the component that emits light is used.

It is produced by a III-V semiconductor crystal such as Ga As or GaN. With the advancement of semiconductor epitaxial growth technology and light-emitting device process technology, LEDs with excellent conversion efficiency have been developed and are widely used in various fields. The LED element is composed of a P-type layer and an n-type layer which are epitaxially grown on the single crystal growth substrate of the III-V semiconductor crystal, and a photoactive layer sandwiched therebetween. In general, a III-V semiconductor crystal such as GaN is epitaxially grown on a growth substrate such as a single crystal sapphire, and an electrode or the like is formed to form an LED light-emitting Q element (Patent Document 1). In recent years, the improvement in luminous efficiency of LED elements has progressed rapidly, and the amount of heat generation has increased with the increase in luminance of LEDs. Therefore, if sufficient heat dissipation measures are not taken, the reliability of the LED will decrease. Specifically, as the temperature of the LED element rises, there is a problem that the brightness is lowered and the life of the element is lowered. Therefore, in order to improve the heat dissipation of the LED package, a metal material having a high thermal conductivity such as copper or aluminum is used for the substrate portion on which the LED is mounted. In the case where the substrate is not sufficiently heat-dissipated, a heat sink made of gold 201035377 may be further used as a countermeasure against heat dissipation. For LED components to be used for lighting applications, LEDs have become more advanced in output and size. Generally, LED elements are bonded to a substrate by soldering or the like. When the thermal expansion coefficient of the LED element and the substrate material are different, stress is generated in the bonding layer, and in the worst case, destruction of the LED element may occur, and reliability is remarkably lowered. It is known to make ceramics as a material having a high thermal conductivity and a small thermal expansion coefficient in response to an increase in the amount of heat generated by the increase in output and the increase in the size of the LED.

A metal matrix composite in which CI particles are combined with metal aluminum (Patent Document 2). For example, a metal matrix composite material in which tantalum carbide and aluminum are composited satisfies the above characteristics in terms of characteristics, but when it is used as a substrate for LEDs, it is a problem of high cost. Therefore, metal-based composite materials in which graphite and aluminum are composited are being studied as a metal-based composite material having excellent workability (Patent Document 3). A metal matrix composite composed of Ming and graphite was originally developed as a sliding member. In order to improve the characteristics, the graphite material is impregnated with a high-temperature and high-pressure alloy, and the properties are improved (Patent Document 4). [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Brief Description of the Invention] In order to improve the heat conduction characteristics of the aluminum-graphite composite, it is effective to use a coke-based graphite material having a high crystallinity of 201035377 as a graphite material. However, the material of the coke-based graphite material is highly anisotropic, and the aluminum-graphite composite obtained by composite with aluminum also exhibits anisotropy in characteristics. In addition to the characteristics of thermal conductivity or thermal expansion coefficient, the base material of the LED light-emitting member is important as uniformity of the member. When an anisotropic material is excessively used, there is a problem that warpage or the like occurs, or the worst case occurs, and the LED element is broken. An aluminum-graphite composite excellent in characteristics such as thermal conductivity is suitably produced by a cast forging method. However, the material used in the casting forging method is expensive, and therefore, when the aluminum-graphite composite which is generally produced by the casting forging method is used as a substrate for an LED light-emitting member, there is a problem that the LED light-emitting member becomes expensive. In addition to the substrate material used, the LED light-emitting member is very important for heat dissipation measures of the entire light-emitting member. Therefore, in addition to the use of a substrate material having excellent heat dissipation characteristics, if the shape and thickness of the insulating material for the circuit portion on which the LED is mounted are not appropriate, there is a problem that the LED light-emitting member does not have sufficient characteristics. The present invention has been made in view of the above circumstances, and an object thereof is to provide a LED light-emitting member excellent in heat dissipation characteristics and reliability and a heat dissipation member constituting the same. In order to achieve the above object, the present invention has obtained the following findings: after processing an isotropic graphite material into a plate shape, a plurality of sheets are laminated via a stripping plate to be composited with an aluminum alloy by a casting forging method. A plate-shaped, respectively, 201035377 aluminum-graphite composite having excellent thermal conductivity, thermal expansion coefficient, and strength characteristics is efficiently produced. Further, the present invention has been completed by the following findings: By optimizing the substrate material, the insulating material, and the circuit structure, a led light-emitting member excellent in heat dissipation characteristics and reliability can be obtained. That is, the present invention is a method for producing an aluminum-graphite composite characterized by the following steps: (1) thermal conductivity at a temperature of 25 ° C of 100 to 200 W/mK and orthogonal three directions The maximum 値/min 値 is 1 to 1.3, the thermal expansion coefficient at a temperature of 25 ° C to 150 ° C is 2×10 −6 to 5×10 −6 /K, and the maximum 値/min 値 of the thermal expansion coefficient in the orthogonal three directions is 1 to 1.3. And the step of processing the isotropic graphite material having a porosity of 10 to 20% by volume into a plate having a thickness of 0.5 to 3 mm. (2) A step of laminating a plate-shaped isotropic graphite material by laminating from a stencil and pressing it in a vertical direction with respect to a plate surface of the isotropic graphite material of 1 to 50 Nm.

(3) The aluminum alloy containing 〜3 to 20% by mass is impregnated with a pressure of 20 MPa or more by a casting forging method, and 70% or more of the pores of the isotropic graphite material are impregnated with an aluminum alloy, and A step of providing an aluminum alloy layer having an average thickness of 10 to 300 / zm on both main faces of the plate-like isotropic graphite material _. Further, the present invention is a method for producing an aluminum-graphite composite which is characterized by a step of removing the aluminum alloy layer in the above-mentioned aluminum-graphite composite. Further, the isotropic graphite material is a coke-based graphite@aluminum-graphite composite. Furthermore, the present invention has a surface roughness (Ra) of 〇. 1 to 3 /zm, &amp; 201035377 'degree of 25 ° C thermal conductivity of 150 to 300 W / mK, orthogonal three-direction conductivity maximum 値/minimum 値 is 1 to 1.3, temperature 25 t~150 〇C, expansion coefficient is 4x10-6~7·5χ10-6/Κ, and the maximum 値/min 値 of the thermal coefficient in the orthogonal three directions is 1 to 1.3, and An aluminum-graphite composite characterized by a 3-point bending strength of 150 MPa. Further, the present invention is a heat dissipating member characterized by performing shape processing on a plate-shaped aluminum-graphite composite. Further, the heat dissipation group is characterized by forming a plating layer on the surface of the plate-like graphite composite. Further, the present invention forms a metal via the insulating layer on one or both of the main faces of the aluminum-graphite composite. A heat dissipating component characterized by a circuit is a heat dissipating component characterized by forming a metal circuit via a layer of active bonding material on one main surface or both main surfaces of the aluminum-graphite composite. This is an LED light-emitting member in which LED bare chips and/or LED package features are mounted on the heat sink assembly. The aluminum-graphite composite of the present invention has excellent characteristics of high heat conduction and low thermal expansion strength. In addition, due to the use of an isotropic graphite material, the anisotropy of the q characteristic is small, and it is suitable as an LED light-emitting member and for its thermal component. Further, the present invention provides a light-emitting structure of an LED light-emitting member, and provides an LED light-emitting structure excellent in light-emitting characteristics and reliability. [Embodiment] Embodiments of the invention Hereinafter, the LED light-emitting member of the present invention and the same for the same are provided. An embodiment of a stone compound will be described. The graphite material constituting the aluminum-graphite composite 1 is a thermal conductivity of 50 to 200 W/mK' at a temperature of 25 to 200 W/mK' and an orthogonal thermal conductivity of three directions. On the main surface, and outside the metal, the body is a high-performance part. The most popular heat transfer of the ink

_ Large 値 / minimum 値 is 1 ~ 1.3, temperature 25 ° C ~ 15 (TC thermal expansion coefficient is 2xl (T6 ~ 5xl0_6 / K, and the maximum 値 / minimum 値 of the orthogonal three-direction thermal expansion coefficient is 1 ~ 1.3 The isotropic graphite material having a porosity of from 1 to 20% by volume. In the present specification, the "orthogonal three directions" are perpendicular to the main faces of the block-shaped isotropic graphite material. 3 directions (longitudinal direction, lateral direction, height direction). In order to satisfy the characteristics required for the aluminum-graphite composite 1 as a substrate material of the LED light-emitting member, the graphite material needs to have the above characteristics. 'I Process an isotropic graphite material After the plate is thicker than _5~3mm, the plurality of pieces are clamped by the stripper and stacked. The sides are clamped by iron plates, etc., and the mounting torque in the vertical direction is compared with the isotropic by the screw and the nut'. In the present specification, the "plate shape" is collectively referred to as a shape having two principal faces which are parallel or substantially parallel, and the main body of the graphite material is sandwiched in a manner of 1 to 50 Nm. The surface can be a circular plate shape, an elliptical shape, a triangle, or the like The method of combining the isotropic graphite material with the aluminum alloy is to heat the isotropic graphite material and the alloy to the melting point of the aluminum alloy, and then the pressure-impregnated casting forging method is suitable. After the temperature above the melting point of the aluminum alloy, the aluminum alloy metal solution is impregnated under pressure, whereby the aluminum-graphite composite 1 having characteristics suitable for the LED light-emitting member can be obtained. The thermal conductivity of the isotropic graphite material at a temperature of 25 t is 1 〇〇~2〇〇w /mK, and the maximum 値/min 値 of the thermal conductivity in the orthogonal three directions is 〜1_3. If the thermal conductivity of the isotropic graphite material is less than i〇〇w/tool, 201035377 When the obtained aluminum-graphite composite crucible has a low thermal conductivity and is used as a substrate material for an LED light-emitting member, heat dissipation characteristics are insufficient, which is not preferable. The upper limit is not limited in characteristics, but if the thermal conductivity exceeds 200 W/ mK, the material itself becomes expensive, and the anisotropy of the characteristic becomes strong, which is not ideal. In addition, the maximum 値/min 値 of the thermal conductivity in the orthogonal three directions of the isotropic graphite material exceeds 1.3. When the anisotropy of the heat dissipation characteristics is too large, when the substrate material used as the LED light-emitting member is used, the temperature of the LED element is excessively increased, which is not preferable. The temperature of the isotropic graphite material is 25 t~ The coefficient of thermal expansion at 150 ° C is 2 xl (T6~5xl (T6/K' and the maximum 値/min 値 of the thermal expansion coefficient in the three directions orthogonal to each other is 1 to 1.3. If the temperature of the isotropic graphite material is 25 t~1 If the coefficient of thermal expansion at 50 °C is less than 2 X 1 〇 - 6 / K or exceeds 5 X 1 0 _ 6 / K, the difference between the thermal expansion coefficients of the obtained aluminum-graphite composite 1 and the LED element becomes too large. The problem that the life of the LED element is lowered and the LED element is broken is not preferable. Further, if the maximum 値/min 値 of the thermal expansion coefficient of the orthogonal three directions in the isotropic graphite material is from 25 ° C to 150 ° C exceeds 1.3, the thermal expansion of the obtained aluminum-graphite composite 1 is obtained. The anisotropy of the coefficient becomes too large. When the LED element emits light, uneven stress is applied to the LED element, and the life of the LED element is lowered, and the LED element may be broken or the like, which is not preferable. Further, the porosity of the isotropic graphite material is 10 to 20% by volume. If the porosity is less than 10% by volume, the heat of the aluminum-graphite composite 1 obtained by sufficiently impregnating the aluminum alloy in the pore portion when the aluminum alloy is impregnated under pressure is applied.

-10- 〇

201035377 Reduced conductivity characteristics is not ideal. In addition, when the porosity is more than 20%, the content of the alloy in the obtained aluminum-graphite composite 1 is large, and the thermal expansion coefficient of the graphite composite 1 is increased. As a raw material of the isotropic graphite material, a hydrostatically formed coke-based graphite is used as a raw material to form a hydrostatic pressure, and the isotropic graphite material obtained by graphitization is suitable. The isotropic graphite material having the above characteristics was processed into a plate having a thickness of 3 mm and used. Since the finally obtained aluminum-graphite composite 1' is provided inexpensively, it is necessary to also process the aluminum-graphite composite 1 obtained from the isotropic stone of the raw material, and the most slab-shaped Ming-graphite composite Matter 1. In particular, it is important to efficiently produce the brocade-graphite composite 1 in a pressure impregnation method. The processed isotropic graphite material is sandwiched by a stripper, and the layer is then impregnated as a rectangular parallelepiped block (laminate) to increase efficiency. Practically, an area of the plate-like isotropic graphite material is suitable for 100 to 2500 cm 2 . When the area of the main surface of the plate-like isotropic graphite material is less than 100 cm2, the volume of the anchor composite 1 obtained by one-time compounding is small, and the obtained sheet-shaped aluminum-graphite composite has a cost per single iu volume. . On the other hand, if the area of the plate-shaped ink material exceeds 2 500 cm 2 , the equipment used for the composite is often priced and the warpage of the aluminum-graphite composite 1 becomes large. It is difficult to form a lower portion, and circuit formation and the like become difficult, and the cost per unit volume of the plate-shaped aluminum-graphite complex becomes high, which is not preferable. The amount of volume does not change, to the 0.5~: ink and: ground surface, plate shape: plural; up to: surface: a graphite 1 I stone 〖得非Η生降物1 - 11- 201035377 In order to form a uniform thickness of the uniform aluminum alloy layer on the surface of the aluminum-graphite composite 1, it is preferable that the surface of the plate-like isotropic graphite material has an undulation of 500 Å or less, preferably ι〇 Processing in a manner less than 〇β m. If the surface of the plate-like isotropic graphite material undulates more than 5 Å/zm, the variation in the thickness of the aluminum alloy layer on the surface of the aluminum-graphite composite 1 becomes large, which is not preferable. On the other hand, by removing the aluminum alloy layer on the surface of the aluminum-graphite composite 1, although the problem of variation in the thickness of the aluminum alloy layer can be improved, the thickness of the aluminum alloy layer is thick or the warpage of the first graphite composite 1 is When the time is large, the removal of the aluminum alloy layer requires a cost and the thickness of the processed aluminum-graphite composite 1 is lowered, and the cost per unit volume of the plate-shaped aluminum-graphite composite obtained after the final processing becomes high, and not ideal. The thickness of the plate-like isotropic graphite material is substantially the same as the thickness of the aluminum-graphite composite 1, and is preferably 0_5 to 3 mm, more preferably 1 to 2 mm. When the thickness of the plate-shaped R-shaped graphite material is less than 〇5 mm, when the in-graphite composite 1 is used as a substrate material for mounting an LED element, the heat capacity is insufficient, and the temperature of the 〇LED element rises instantaneously, and does not ideal. On the other hand, when the thickness exceeds 3 mm', the thermal resistance in the thickness direction of the aluminum-graphite composite 1 increases, and the temperature of the LED element rises, which is not preferable. The plate-like isotropic graphite material is sandwiched by a release plate coated with a release agent, and this is laminated to form a block (laminate). From the point of impregnation efficiency of the casting forging method, the number of laminated sheets of the isotropic graphite material sandwiched by the die plate is preferably the same as the length of each side of the laminate. In terms of the laminated thickness, it is suitable for about 1/8 to 1/2 -12 to 201035377 of the outer peripheral length of the plate-like isotropic graphite material. When the isotropic graphite material is laminated to form a block, the mounting torque in the vertical direction is 1 to 50 Nm with respect to the surface of the isotropic graphite material, and the laminate is sandwiched and laminated. The lamination method is not particularly limited. For example, a method in which an isotropic graphite material is laminated on a release sheet made of a stainless steel coated with a release agent, and a plate made of iron is disposed on both sides. After joining, it is fastened with a predetermined mounting torque to form a block. The appropriate mounting torque varies depending on the strength, thickness, area, and number of sheets of the isotropic graphite material used. However, if the mounting torque C) is less than 1 N m ', the aluminum on the surface of the aluminum-graphite composite 1 may be present. The thickness of the alloy layer may become thicker, or the difference in thickness may become excessive. On the other hand, if the mounting torque exceeds 5 ONm, there is a problem that the isotropic graphite material is broken during fastening, which is not preferable. Next, the laminate is heated in an air atmosphere or a nitrogen atmosphere at a temperature of 600 to 750 ° C, and then placed in a high pressure vessel. In order to prevent the temperature of the laminate from decreasing, the metal Q solution of the aluminum alloy heated to a melting point or higher is supplied as quickly as possible, and is pressurized at a pressure of 20 MPa or more to be immersed in the voids of the graphite molded body. Further, the anneal treatment of the immersion product may be performed for the purpose of removing deformation during immersion. The release template used for lamination may be applied to a release agent, such as a release agent such as graphite, boron nitride or alumina. In particular, after coating alumina or the like on a stripper plate made of stainless steel, it is preferable to apply a stripping agent for a graphite release agent and have good mold release property. On the other hand, in the case of removing the aluminum alloy layer on the surface of the plate-shaped aluminum-graphite composite 1, as the stripping template, in addition to the above-mentioned stripping template, a graphite sheet or a metal which is not coated with a releasing agent may be used. material. When the heating temperature of the laminate is less than the temperature of 600 °C, the composite of the aluminum alloy is insufficient, and the characteristics such as the thermal conductivity of the aluminum-graphite composite 1 are not preferable. On the other hand, when the heating temperature exceeds 750 ° C, aluminum carbide having a low thermal conductivity is produced in combination with the aluminum alloy, and the thermal conductivity of the aluminum-graphite composite 1 is lowered, which is not preferable. In addition, when the pressure at the time of immersion is less than 20 MPa, the composite of the aluminum alloy is insufficient, and the thermal conductivity of the aluminum-graphite composite 1 is lowered, which is not preferable. A better impregnation pressure is 50 MPa or more. The aluminum alloy in the aluminum-graphite composite 1 preferably contains 〜3 to 20% by mass. When the amount of niobium contained exceeds 20% by mass, the thermal conductivity of the aluminum alloy is lowered, which is not preferable. On the other hand, when the amount of niobium contained is less than 3% by mass, the melt flow of the molten aluminum alloy is deteriorated, and the aluminum alloy does not sufficiently penetrate into the voids of the isotropic graphite material during the impregnation, which is not preferable. The metal component other than aluminum or lanthanum in the aluminum alloy is not particularly limited as long as it does not excessively change its characteristics. If it is magnesium, it may be contained in an amount of about 3% by mass. Although an aluminum alloy layer is formed on the surface of the aluminum-graphite composite 1, the average thickness is preferably from 10 to 300 / z m, more preferably from 10 to 100 / m. The aluminum alloy layer can also be honed to the surface of the aluminum-graphite composite 1 to be adjusted to a predetermined thickness. The alloy layer is suitable for plating on the surface. When the average thickness is less than 10/z m', the aluminum-graphite composite 1 may be partially exposed, which may cause problems such as insufficient plating or a decrease in plating adhesion. On the other hand, if the average thickness exceeds 30 〇 #111, the coefficient of thermal expansion of the aluminum-graphite composite 1 becomes too large, which is not preferable. Further, if the average thickness of the aluminum alloy layer exceeds 3 〇〇/zm, -14-201035377, or the average thickness difference of the aluminum alloy layers of the two main faces is extremely excessively large, the warpage of the aluminum-graphite composite 1 becomes large. The handleability is lowered, and subsequent circuit formation and the like become difficult, and it is not preferable to remove the aluminum alloy layer on the surface of the aluminum-graphite composite 1 and use it in a state where the aluminum-graphite composite 1 is exposed. The method of removing the aluminum alloy layer is not particularly limited. For example, machining such as a milling machine, a sander, a belt grinder, and a sand blasting machine can be cited. Further, the aluminum alloy layer on the surface of the aluminum-graphite composite 1 may be etched with an alkali solution, an acid solution or the like to remove the aluminum alloy ruthenium layer. Further, the aluminum alloy layer on the surface of the aluminum-graphite composite 1 may be partially removed to improve the flatness of the plate-like aluminum-graphite composite 1. The aluminum-graphite composite 1 is 70% or more of the pores of the isotropic graphite material impregnated with the aluminum alloy. If the pores not impregnated with the aluminum alloy exceed 30%, the thermal conductivity of the aluminum-graphite composite 1 is lowered, which is not preferable. The aluminum-graphite composite 1 has a thermal conductivity of 150 to 300 W / mK' at a temperature of 25 ° C and a maximum 値 / minimum 热 of a thermal conductivity in three orthogonal directions of 1 Q to 1.3. When the thermal conductivity at a temperature of 25 ° C is less than 150 W/mK, when it is used as a substrate material of an LED light-emitting member, heat dissipation characteristics are insufficient, which is not preferable. Regarding the upper limit, although there is no limitation in characteristics, the material itself becomes expensive, and the anisotropy of the characteristic becomes strong, which is not preferable. In addition, when the maximum 値/min 値 of the thermal conductivity in the three orthogonal directions exceeds 13 , the anisotropy of the heat dissipation characteristics becomes excessively large, and when the substrate material used as the LED light-emitting member is used, the temperature of the LED element excessively rises. The problem is not ideal. The thermal expansion coefficient of aluminum-graphite composite 1 series temperature from 25 °C to 150 °C is 4 -15- 201035377 ' xlO-6~7·5χ1 (Γ6/Κ, and the thermal expansion coefficient of the orthogonal three directions is larger/minimum値 is 1~1. 3. If the temperature is 2 5 °C~1 5 0 °C, the thermal expansion is less than 4χ1 (Γ δ / K, or more than 7.5xl (T 6 / K, then aluminum-graphite 1 and LED components The difference in thermal expansion coefficient becomes too large, and the life of the device is lowered, and the LED element may be broken. In other cases, the thermal expansion in the three directions orthogonal to the temperature of 25 ° C to 150 ° C is the maximum. When the minimum 値 exceeds 1.3, the anisotropy of the thermal expansion number of the aluminum-graphite composite 1 becomes excessively large, and when the LED element emits light, uneven 〇_ is applied to the LED element, and the life of the LED element is lowered. The problem of component destruction, etc. is not ideal. The aluminum-graphite composite 1 has a 3-point bending strength of 50 to 15 OMPa. When the point bending strength is less than 50 MPa, it may sometimes collapse during processing due to aluminum-graphite. Since the composite 1 is a conductive material, it is not preferable because of insulation failure, etc. Further, it is fixed by screws. When it is used on a device or a casing, it sometimes breaks during fastening, etc. Q is ideal. Regarding the upper limit of the three-point bending strength, the three-point bending strength of the aluminum-graphite composite 1 is formed without limitation of properties. When the strength exceeds 15 OMPa, it is necessary to add other ceramic particles or to add thermal conductivity characteristics (mosaic graphite), etc. The aluminum-graphite composite 1 may have a low thermal conductivity, which is not preferable. Further, the LED light-emitting member is used for a car. In the case of illumination for use in an equalizer, if the strength is insufficient, it may be broken or broken due to vibration or the like, which is not preferable. The surface roughness (Ra) of the plate-shaped aluminum-graphite composite 1 is good; The most coefficient composite LED I want. The number of inflation stress sometimes is 3, etc. It will not be scattered, but the high embedded motion will occur I 0.1 16 - 201035377 ~ 3ym, preferably 0·1 ~ 2 / Zm. When the surface roughness (Ra) A m ' is used as the substrate material of the LED light-emitting member, the adhesion strength at the time of bonding of the layer 4 or the LED element is not obtained, and the thickness of the low heat edge layer 4 is thickened. Reduced heat dissipation characteristics, not ideal. Another about surface roughness The lower limit of (Ra) does not have a characteristic surface limitation, so that Ra becomes less than 〇.lMm, and it is necessary to process a plate-shaped aluminum-graphite complex surface, which is expensive, and is not preferable. ^ A substrate on which an LED element is mounted is used as an LED In the case of the light-emitting member, the heat-dissipating surface is often used by a metal heat sink or a casing such as a heat-dissipating lubricating oil or a heat-dissipating sheet. In this type of use, the adhesion of the joint surface is ensured. A method in which a screw having an LED element is fixed to a metal heat sink or a casing or the like. A hole is formed in the material, and the substrate on which the LED element is mounted is mounted on a screw holder or a casing, whereby the adhesion between the two can be improved, and the reliability of the joint portion can be improved. Since the aluminum-graphite composite 1 is well-added, it can be processed by a usual drill or the like. In addition, holes are formed by work or water jet processing, or even press processing. The shape of the hole may be a U shape or the like if it is a shape that can be fixed by a screw. The LED light-emitting member bonds the LED element to a substrate composed of a plate-shaped aluminum compound 1. The bonding method generally uses high thermal conductivity or soldering or the like. It is preferred that the surface of the thermal conductivity is directly soldered to the substrate material without passing through the thermal conductivity 4 which is low. However, aluminum-graphite exceeds 3 and the insulating guide is the most important, but the compound 1 is bonded, and the substrate is used for the substrate to be dispersed and the workability is excellent, or graphite can be used. Re-bonding Insulation Layer Composite -17- 201035377 'Material 1 cannot be directly soldered, so a plating layer is formed on the surface of the aluminum-graphite composite 1. The method of forming the plating layer is not particularly limited and may be formed by electrowinning or electroless plating. The plating material may be nickel, copper, gold, tin, or the like, and such composite plating may be used. Regarding the plating thickness, in order to ensure the adhesion between the aluminum-graphite composite 1 of the substrate and the plating layer and the solder wettability, the surface to be thermally conductive is preferably as thin as possible, generally 1~ 5/zm. The LED element of the LED light-emitting member may also be a structure in which the bare wafer is also packaged. Further, the portion of the main surface of the aluminum-graphite composite 1 or the heat dissipating member in which the metal circuits 3 are formed in contact with the LED element may or may not be electrically insulated. Here, in the present specification, the term "heat dissipating component" is a generic term for a member that radiates heat generated from an LED element, and is, for example, a main surface or two main surfaces of a substrate composed of an aluminum-graphite composite 1. Any of the metal circuits 3 is formed arbitrarily. Fig. 1 and Fig. 3 show an embodiment in which the portion where the LED element is in contact with the heat dissipating unit is not electrically insulated. Forming the metal circuit 3 via the insulating layer 4 or the active metal bonding material layer 7 on one main surface or both main surfaces of the plate-shaped aluminum bismuth-graphite composite 1, and on the surface of the metal circuit 3 or the aluminum-graphite composite The structure of the LED element (LED wafer 2) is directly disposed by a brazing method or the like. The insulating layer 4 formed on one main surface or both main surfaces of the aluminum-graphite composite 1 is a curable resin composition mainly composed of a heat resistant resin and an inorganic chelating material, and has a thermal conductivity of 1 W after hardening. / mK is better. As the heat resistant resin, for example, an epoxy resin, a enamel resin, a polyamide resin, -18-201035377', an acrylic resin, or the like can be used. The heat-resistant resin is used in a proportion of 10 to 40% by volume. When the amount is less than 1% by volume, the viscosity of the insulating layer composition is increased, and the workability is lowered. On the other hand, if it exceeds 40% by volume, the thermal conductivity of the insulating layer 4 is lowered. Not ideal. The difference between the thermal expansion coefficient of the plate-shaped aluminum-graphite composite 1 and the LED element is large. 'In order to relax the fatigue of the joint portion caused by the heating cycle, the storage elastic modulus of the cured resin composition is 1 5000 MPa at 300K. The following is better. In this case, the curable resin composition is a combination of (1) a resin mainly composed of an epoxy resin, (2) a hardener having a polyether skeleton and having a primary amine group at the terminal of the main chain, and (3) The inorganic chelating agent can provide a cured product excellent in stress relaxation property, electrical insulation property, heat dissipation property, heat resistance, and moisture resistance. As the epoxy resin, a general-purpose epoxy resin such as a bisphenol F-type epoxy resin or a bisphenol a-type epoxy resin can be used. When one or more epoxy resins selected from the group consisting of an epoxy resin having a dicyclopentadiene skeleton, an epoxy resin having a naphthalene skeleton, an epoxy resin having a biphenyl skeleton, and an epoxy resin having a novolac skeleton are contained in an all-epoxy resin When the amount is 10% by mass or more, the balance between the stress relaxation property and the moisture resistance is further improved. A representative epoxy resin having a novolak skeleton may be a phenol novolak type epoxy resin or a cresol novolak type epoxy resin, but a dicyclopentadiene skeleton, a naphthalene skeleton or a biphenyl skeleton may be used together with Epoxy resin for the novolak skeleton. As the epoxy resin, an epoxy resin having the above-described skeleton may be used alone. In addition, it is also possible to use epoxy resin as the main component, and to use other resins as a thermosetting resin such as a phenolic resin, a polyimide resin, or a high molecular weight -19- such as a phenoxy resin, an acrylic rubber or an acrylonitrile-butadiene rubber. 201035377 Resin. When the balance of the stress relaxation property, the electrical insulating property, the heat resistance, and the moisture resistance is considered, the amount of the high molecular weight resin is preferably 30% by mass or less based on the total amount of the epoxy resin. In order to reduce the storage elastic modulus of the resin composition after hardening, the hardener uses a hardener having a polyether skeleton and having a primary amine group at the end of the main chain. Can be used with other hardeners. When an aromatic amine-based curing agent is used, it is more suitable for balance of stress relaxation property, electrical insulation property, moisture resistance, and the like. As the aromatic amine-based curing agent, diaminodiphenylmethane, diaminodibenzoquinone, m-phenylenediamine or the like can be used. Further, a curing agent such as a phenol novolak resin may be further used. Examples of the inorganic cerium include oxide ceramics such as alumina (aluminum), cerium oxide, and magnesium oxide, and nitride ceramics such as aluminum nitride, tantalum nitride, and boron nitride, and carbide ceramics. The ratio of the inorganic cerium in the curable resin composition is 18 to 27% by volume of the inorganic cerium. If it is outside this range, the viscosity of the resin composition increases, and the thermal conductivity decreases, which is not preferable. The inorganic chelating system is preferably a spherical particle having a maximum particle diameter of 100 Å or less and a minimum particle diameter of 0.05 #m or more. Further, particles containing 5 to 75 mass% of particles having a particle diameter of 5 to 50/zm, preferably containing 25 to 5 % by mass of particles having a diameter of 0 · 2 to 1 · 5 /z m are more preferable. As the insulating layer 4, a decane coupling agent, a titanate coupling agent, a stabilizer, a curing accelerator, or the like can be used as needed. Examples of the material of the metal circuit 3 include a copper foil, an aluminum foil, a copper-aluminum composite box, and a copper-nickel-aluminum composite box. -20-201035377 As a method of the metal circuit 3 on the plate-shaped aluminum-graphite composite 1, for example, the following method can be used to heat the curable resin of the insulating layer 4 on the aluminum-graphite composite 1 and heat it to a half. It is a foil and is heated to a substantially completely hardened state. The insulating layer 4 is processed into a sheet shape in a semi-hardened state, and the metal foil is integrated together. Regarding the circuit ^, there is no particular limitation 'but before the metal foil is preheated or ultraviolet (UV) hardened, an etching solution such as a mixture of liquid and sulfuric acid is used, and the LED element and the heat dissipating component are insulated from the air in the second figure. An embodiment of the situation of disposal. One of the main surfaces of the first-graphite composite 1 or the metal circuits 3 on both main faces, and in the structure of the LED elements (the LED crystals are connected to the protrusions 6 and connected by layers. 〇 or as shown in Fig. 3, in a plate shape It is preferable that the aluminum crucible surface and/or the two main surfaces are characterized by a heat dissipation structure via the active metal connection circuit 3. In the second drawing, the material of the metal circuit 3 can be the same as that shown in Fig. 1. On the other hand, the inter-layer connection protrusions 6 are formed on the graphite composite 1 having the interlayer connection structure, and the metal circuit 3 and the interlayer connection protrusions 6 are connected via the insulating layer 4. The screen-printing composition paste pattern is used to print the hardened state. After that, the method of attaching the alloy or the pattern forming method by using a hot press device in advance, although the resist ink is applied, the copper chloride and the hydrogen peroxide solution are preferably formed by etching. The contact portion is electrically charged. 2 is a view showing a material of a metal substrate and an insulating layer 4 formed in a lower portion of a sheet-like aluminum via a insulating layer 4 to form a sheet 2) via a layer of a composite material 7 of a graphite-composite composite layer 1, and via a layer connecting protrusion 6 Method, the plate-shaped aluminum - a method, if the method to be conductive, then nothing can be, -21--201035377 'include, for example, using the method of forming a metal plating, a method using a conductive paste or the like is formed. As a method of forming the insulating layer 4 in a state in which the interlayer connection protrusions 6 are formed, there is a method in which the composition of the insulating layer 4 is made into a slurry, and the periphery and the upper portion of the interlayer connection protrusions 6 are used, and screen printing or the like is used. After the method is immersed and heated to a semi-hardened state, the metal foil is bonded thereto, and after heating to a substantially completely cured state, the metal circuit of the upper portion of the interlayer connection protrusion 6 is removed by etching or the like, and is removed by laser processing or the like. The method of forming the insulating layer composition, or processing the insulating layer composition into a sheet shape in a semi-〇 hardened state in advance, and integrating it with the metal foil by a hot press device to form a convex portion at a position corresponding to the interlayer connection protrusion 6 In the part, a laminate having a metal layer is formed on the surface, and the convex portion of the laminate is removed, and the interlayer connection protrusion 6 is exposed. In Fig. 3, as the material of the metal circuit 3, a monolithic A1 alloy such as a monomer A1 or a bismuth-Si alloy, an Al-Si_Mg alloy, or an Al-Mg_Mn can be used. 〇 As the material constituting the active metal bonding material layer 7, an Al-Si-based or Al-Ge-based alloy or an Al-Cu-Mg-based alloy can be used, and in particular, an A1-Cu-M-based alloy is preferable. First, it is because A is a bonding condition between a Cu-Mg-based alloy and an Al-Si-based, Al-Ge-based, Al-Si- (}e-based or Mg-added one) and ceramic materials. The allowable range is wide, and it is not possible to bond in a vacuum. Therefore, it is possible to bond with excellent productivity. That is, in the case of Al-Si or Al-Ge, if S1 or Ge is not added in a large amount, the melting point is not lowered. However, if it is added in a large amount, it becomes hard and the problem of -22-201035377 becomes brittle. In order not to cause such a problem, for example, in the case of the A1 - Si alloy, if the ratio of Si is reduced to 5%, the melting point becomes It is difficult to join at a temperature of 620 ° C or lower at 615 ° C. In contrast, in the case of an Al—Cu—M-based alloy, even if the ratio of Cu is reduced to about 4%, it is appropriately taken. By means of pressurization or the like, it is possible to join at about 600 ° C, and the allowable range of the bonding conditions is widened. Secondly, since the Al—Cu—M-based alloy is more uniform than Cu or Mg, Cu or Mg is more uniform. Diffusion in A1, so it will produce local melting, ❹ or extrude excess It is difficult to produce edge bulging due to the combination of materials, and it is possible to form a relatively stable joint in a short time. The Al-Cu-Mg-based alloy to be used, the three-component alloy of Al, Cu, and Mg, need not be included, and may contain other components. For example, in addition to Al, Cu, and Mg, the total content of components such as Zn, In, Μη, Cr, Ti, Bi, B, and Fe may be about 5% by weight or less.

The ratio of Cu in the Al—Cu—M-based alloy is preferably 2 to 6 wt%. When the amount is less than 2% by weight, the bonding temperature becomes high and approaches the melting point of A1. When the amount is more than 6% by weight, the diffusion portion of the bonding material after bonding becomes particularly hard, and the reliability of the circuit board is lowered. It is preferably 丨5 to 5% by weight. On the other hand, regarding Mg, the bonding state is good by a small amount of addition. This is presumed to be due to the effect of removing the oxide layer on the surface of A1 or the wettability of the surface of the aluminum nitride substrate and the bonding material. The proportion of Mg is preferably from 0.1 to 2% by weight. If it is less than 〇丨% by weight, the effect of addition is not significant, and if it exceeds 2% by weight, the hardness of the alloy or the erbium alloy is adversely affected, -23-201035377 and sometimes a large amount of volatilization at the time of joining causes furnace operation. Obstruction. It is particularly preferably from 0.3 to 1.5% by weight. An example of a commercially available product of a bonding material to be used is a 2018 alloy containing about 4% by weight of Cu and about 0.5% by weight of Mg in A丨, and even a 2017 alloy containing about 0.5% by weight of Μη. First, and 2001, 2005, 2007, 2014, 2024, 2030, 2034, 2036, 2048, 2090, 2117, 2124, 2214, 2218, 2224, 2324, 7050, and the like.接合 The bonding temperature is 560 to 630 °C, which is suitable for a wide range, but the proper range differs depending on the composition of the bonding material. When the content of the low-melting component Zn or Zn or the like to which Zn or in is added is relatively large, the bonding can be sufficiently performed even at 600 ° C or lower. When the bonding temperature exceeds 63 (TC, soldering defects (boring phenomenon due to the circuit) are likely to occur at the time of bonding, which is not preferable. In the case of heating bonding, the direction perpendicular to the plane of the aluminum-graphite composite 1 is perpendicular. It is preferably pressurized at 10 to 100 kgf/cm2, particularly 15 to 80 kgf/cm2. As a pressurizing method, it can be carried out by mechanical pressing using a jig for placing a weight. The pressurization is preferably at least the temperature at which the joining starts. For example, using a 95.7 % A1 - 4% Cu - 0.3% Mg alloy foil at 610 ° C, it is maintained at this pressure to 580 ° C. In terms of heat dissipation components, the plate-shaped Ming-graphite composite A metal circuit 3 is formed on one main surface and/or both main surfaces, for example, an A1 system circuit. A bonding material of an Al-Cu-Mg alloy is laminated on a plate-shaped aluminum-graphite composite-24-201035377. 1 is interposed between the A1 type circuit pattern constituting the metal circuit 3 and the A1 type electric metal plate. However, it is used in combination with the above. The heat dissipating component is formed by using an Al-Cu-Mg alloy. The bonding material of the bonding material layer 7 can significantly improve the production thereof by one of them The vacuum furnace is not limited to a vacuum furnace. The vacuum furnace is inherently difficult to be highly continuous. In the case of a batch furnace, the volumetric efficiency furnace is prone to temperature distribution, and high yield cannot be expected. In contrast, if Al is used, When a Cu-Mg-based alloy is used as a bonding material for a bismuth Si-based or an A1-Ge-based alloy, the furnace structure is simple and continuous even if it is not in the N2, H2, inert gas, or a mixed gas of these. It is also easy to reduce the variation of the product such as the continuous temperature distribution, and it is possible to manufacture a product which is stable and stable. The A1 system is formed by using a metal plate for forming a circuit as a metal circuit to manufacture a heat dissipating component. By laminating a metal plate in which the graphite composites 1 are adjacent to each other, the aluminum alloy having a thermal expansion coefficient larger than that of the plate-like composite 1' is heated. The deformation of the convex shape on the one side is reduced. This is a point in which the material A1 is made of plastic. In order to avoid the adhesion of the A1 materials, the spacer material can be inserted in accordance with the embodiment. , it is easy to become active gold. Its valence, and if it is a large production. W A1 - empty, but also under the atmosphere, can make the rate is good, the components of the product 3 and the shape of the plate. Because Ming Yi Graphite-graphite composite deformation is easily required, and also -25-201035377' (Examples 1 and 2) Example 1 is an isotropic graphite material having a bulk density of 1.83 g/cm 3 (manufactured by Tokai Carbon Co., Ltd.: G347), and Example 2 An isotropic graphite material (manufactured by Tokai Carbon Co., Ltd.: G45 8) having a bulk density of 1.89 g/cm 3 was processed into a plate shape of 200 mm x 200 mm x 1.5 mm. Further, as a stripping plate, an alumina solution (manufactured by Nissan Chemical Co., Ltd.: alumina solution 200) was applied to a stainless steel plate of 200 x 200 x 0.6 mm, and then heat-treated at a temperature of 35 CTC for 1 hour, and then a graphite release agent was applied. Next, a plate-shaped isotropic stone ink material and a 200x200x25mm isotropic graphite material for evaluation of properties were sandwiched by a stripper. After laminating 70 sheets, an iron plate having a thickness of 12 mm was placed on both sides, and The bolts of the M10 are connected to each other in a manner of 20 Nm in the surface direction, and are fastened with a torque wrench to form a laminate. The obtained laminate was preheated in an electric furnace under a nitrogen atmosphere at a temperature of 65 ° C for 1 hour, and then placed in a pre-heated inner diameter of 300 mm x 300 mm x 300 mmH in a stamping die to inject a metal containing 12% by mass of an aluminum alloy. The solution was pressurized at a pressure Q of 100 MPa for 20 minutes to impregnate the aluminum alloy with the isotropic graphite material. Next, after cooling to room temperature, the boundary portion and the iron plate portion of the aluminum alloy and the stripper were cut by a wet band saw, and the stripped template was peeled off to obtain an aluminum-graphite composite of 200 mm x 200 mm x 1.6 mm. In order to remove the deformation at the time of immersion, the obtained composite was annealed at a temperature of 50 (TC for 2 hours. From the isotropic graphite materials used in Examples 1 and 2, orthogonal 3 was produced by grinding. Test material for thermal expansion coefficient measurement in direction (3x3x 20mm) and test material for thermal conductivity measurement (25mmx25mmxlmm). Use -26- 201035377 'Each test substance' to measure temperature 25 °C with thermal expansion meter (manufactured by Seiko Instruments Inc.; TMA300) The thermal expansion coefficient of ~150 ° C was measured by a laser flash method (manufactured by Rigaku Electric Co., Ltd.; LF/TCM - 8510B) to measure the thermal conductivity at 25 ° C. The results are shown in Table 1. Isotropic graphite materials The porosity was calculated using the theoretical density of graphite: 2.2 g/cm3' from the bulk density measured by the Archimedes method [Table 1] Bulk density (g/cm3) Porosity (%) Thermal conductivity (W) /mK) Thermal expansion coefficient (ΧΚΓ6/Κ) Average 値Maximum/Minimum average値Maximum/minimum Example 1 1.8 3 17 12 0 1. 1 4. 2 1. 2 Example 2 1.89 1 4 16 0 1. 1 3. 9 1. 2 Note 1: Thermal conductivity and thermal expansion coefficient The average 値 is the average of the three directions of 値 in the orthogonal 値 Note 2: the ratio of the maximum 最小 to the minimum 3 in the three directions in which the thermal conductivity is the largest/minimum of the thermal expansion coefficient is the second, and the obtained aluminum-graphite composite The test object (3x3x20mm) for thermal expansion coefficient measurement in the three directions orthogonal to the 〇, the test material for thermal conductivity measurement (25 mm x 25 mm X 1 mm), and the strength test object (3 mm x 4 mm x 40 mm) were produced by grinding, and each test substance was used. Measuring the thermal expansion coefficient at a temperature of 25 ° C to 150 ° C by a thermal expansion meter (manufactured by Seiko Instruments Inc.; TMA300), measured by laser flash (manufactured by Rigaku Electric Co., Ltd.; LF/ TCM - 85 1 0B) The thermal conductivity at 25 ° C and the measurement of the three-point bending strength (according to JIS - R1601). In addition, the bulk density of the test material was measured by the Archimedes method to calculate the impregnation rate of the pores of the isotropic graphite material. 27- 201035377 [Table 2] Bulk Density (g/cm3) Impregnation Rate (%) Bending Strength (MPa) Thermal Conductivity (W/mK) Thermal Expansion Coefficient (X10VK> Average 値 Maximum/Minimum Average 値 Maximum/Minimum Example 1 2 . 2 2 8 3 8 5 18 5 1 . 1 7. 4 1. 1 Example 2 2. 2 1 8 1 8 0 2 0 0 1. 1 4. 3 1. 1 Note 1: Average of thermal conductivity and thermal expansion coefficient The average 値 of the 3 of the orthogonal three directions is 2: the ratio of the maximum 値 to the minimum 3 in the 30 direction in which the thermal conductivity is the largest/minimum of the thermal expansion coefficient. The plate-like aluminum-graphite composite of Example 1 The thickness of the material was measured with a caliper, and the surface roughness (Ra) of the cut surface was measured by a surface roughness meter, and then cut along the diagonal of each sample by mechanical processing, and 10 points were measured at equal intervals. The thickness in the diagonal direction of the aluminum alloy layer of the one main surface exposed by the cutting is calculated based on the average thickness of the plate surface calculated in the vertical direction. The results are shown in Table 3. On the other hand, the plate-shaped aluminum-graphite composite of Example 2 was obtained by using a sand sling tape coated with SiC abrasive grains of #120, and removing the aluminum alloy layers of the two main faces by a wet belt honing machine. The thickness and surface roughness (Ra) were measured. The results are shown in Table 3. [Table 3] Average A1 layer thickness plate thickness Ra (jum) (mm) (μm) Example 1 7 0 1. 6 0. 5 Example 2 - 1 . 4 1. 5 (Production example of LED light-emitting member) (1) Mixing bisphenol F-type epoxy resin (Epikote 807: epoxy equivalent = 173, manufactured by Shell Petroleum Epoxy Co., Ltd.) with 100 parts by weight as a general-purpose mixer Epoxy resin, decane coupling agent, v-glycidoxypropylmethyldiethoxy decane (AZ-6165: manufactured by Unica, Japan) 5 parts by mass, average particle diameter 5.2/zm Alumina (AS-50: manufactured by Showa Denko Co., Ltd.) 300 parts by mass of spherical alumina (AKP-15: manufactured by Sumitomo Chemical Co., Ltd.) as an inorganic ruthenium having an average particle diameter of 1.2/zm And blending and mixing polyoxypropylene amide (Ieffamine D-400: manufactured by Texaco Chemical Co., Ltd.) 25 parts by mass, polyoxypropylene amine (Jeffamine D2000: German) 20 parts by mass of Texaco Chemical Co., Ltd. as a hardener. (2) coating the mixture so that it is pre-hardened into a B-stage state so that the thickness of the insulative adhesive layer after hardening becomes 100 on the plate-shaped aluminum-graphite composite, using a laminator The electrolytic copper foil having a thickness of 35 μm was bonded, followed by 80 ° C x 2 hrs + 150 ° C x 3 hrs post-curing (after Q cure) to prepare a copper foil-containing composite having an insulating adhesive layer. The copper foil is etched again to form a desired circuit having a pad portion to form an aluminum-graphite composite circuit substrate. Next, after applying a white solder resist (PSR4000 - LEW1: manufactured by Sun Ink Co., Ltd.) to a specific circuit, the UV (ultraviolet) is hardened. Further, an uninsulated LED chip (1 mm2) was adhered to the exposed portion of the electrolytic copper foil with an Ag paste to obtain an LED light-emitting member as shown in Fig. 1. In addition, the C 〇 2 laser is used to remove the exposed portion of the insulating layer at the desired place, and the insulated LED chip (1 mm 2 ) is adhered to the portion by the Ag paste to obtain the image as shown in FIG. 3-29-201035377'. Constructed LED lighting member. (Examples 3 and 4) (Production Example of LED Light-Emitting Member) (1) On a plate-shaped aluminum-graphite composite obtained in Examples 1 and 2, copper having a thickness of 35 μm was electrolytically plated. The layer is formed on one side of the composite. An aluminum-graphite composite with copper bumps is formed by etching away the copper layer other than the desired place by etching. In addition, on the other hand, 100 parts of bisphenol F-type epoxy resin (EP1kote 807: cyclic oxime equivalent = 173, manufactured by Shell Petroleum Epoxy Co., Ltd.) was mixed with a general-purpose mixer. Epoxy resin, decane coupling agent, v-glycidoxypropylmethyldiethoxy decane (AZ-6165: manufactured by Japan Unika Co., Ltd.) 5 parts by mass, alumina having an average particle diameter of 5 /zm (AS-50: manufactured by Showa Denko Co., Ltd.) 500 parts by mass as an inorganic ruthenium, and a mixed polyoxypropyleneamine (Jeffamine D-400: manufactured by Texaco Chemical Co., Ltd.) was added. Serve as a hardener. The coating was applied to a copper layer of 35 vm thick in a thickness of 100/z m to form a B stage state, and a copper foil with resin was formed. (2) The aluminum-graphite composite with copper bumps and the copper foil with resin attached were laminated and heated at 180 °C to be integrated. The copper foil where the copper bumps are convex is removed by etching, and the insulating layer (hardened portion of the B-stage sheet) is removed by a C〇2 laser to form a pattern as shown in FIG. Aluminum-graphite composite circuit board with copper bumps. Next, after applying a white solder resist (PSR4000 - LEW1: manufactured by Sun Ink -30-201035377) to a specific circuit, the UV (ultraviolet) is hardened. The residue of the insulating layer was removed from the circuit surface on the copper bump by #200 honing paper, and the surface was smoothly processed with #800 honing paper. The insulated LED chip (1 mm2) was adhered to the surface with an Ag paste. The structure is shown in Figure 2. (Examples 5 and 6) (Production Example of LED Light-Emitting Member) The composition of the plate-like aluminum-graphite composite obtained in Examples 1 and 2; 95% Al-4% Cu-1% Mg was used. 〇. 3mm alloy conjugate material; and 0.4mm thick A1 circuit in this order, as a group, through the spacers, overlapping 10 groups and stacked. This was pressurized from a pressure-type uniaxial pressurizing device outside the furnace by a pressure of 500 MPa in a direction perpendicular to the surface of the substrate made of the aluminum-graphite composite via a carbon pusher, at 4x10_3Pa. The aluminum-graphite composite circuit substrate was prepared by heating in a vacuum (batch furnace) at 610 ° C for 10 minutes and bonding. Next, a white solder resist (PSR4000 - LEW1: manufactured by Sun Ink Co., Ltd.) was screen-coated on a specific circuit to make it υν (ultraviolet) hardened. The insulated LED chip (1 mm2) was adhered to the A1 circuit by Ag paste to obtain an LED light-emitting member as shown in Fig. 1. (Examples 7 to 13 and Comparative Example 1) Various isotropic graphite materials (Examples 7 to 13) and extruded graphite materials (Comparative Example 1) shown in Table 4 were processed into a shape of 2 0 0 mm x 150 mm x 1.5 mm. In the same manner as in Example 1, except that the shape of the stripper was changed to 200 mm x 150 mm x 0.6 mm, an aluminum-graphite composite was produced. The obtained -31-201035377 aluminum-graphite composite was evaluated in the same manner as in Example 1. Table 5, 6 shows the results [Table 4] Bulk density Porosity thermal conductivity (W / mK) Thermal expansion coefficient (Xl 〇 - f ' / K > (g / cm3) (%) Average 値 maximum / minimum average値Max/Minimum Example 7 1. 7 6 2 0 115 1. 2 4. 5 1. 2 Example 8 1 . 9 8 10 110 1 . 1 3. 0 1. 1 Example 9 1.78 1 9 10 0 1 1 4. 0 1. 1 Example 1 0 1.83 17 2 0 0 1 . 1 2. 0 1. 3 Example 1 1 1.89 14 13 0 1. 3 3. 5 1. 2 Example 1 2 1.96 11 110 1. 1 2. 5 1. 2 Example 1 3 1.83 17 10 0 1. 1 4. 9 1 . 2 Comparative Example 1 1 . 7 B 2 0 16 0 1 . 7 4. 7 1. 6

Note 1: The average 値 of the three directions in which the average 値 of the thermal conductivity and the thermal expansion coefficient are orthogonal 値 Note 2: The ratio of the maximum 値 to the minimum 3 in the three directions in which the thermal conductivity is the maximum/minimum of the thermal expansion coefficient. 5] Bulk density (g/cra3) Impregnation rate (%) Bending strength (MPa) Thermal conductivity (W/mK) Thermal expansion coefficient (X10_6/K) Average 値 maximum/minimum average 値 maximum/minimum Example 7 2. 2 3 8 5 8 0 16 0 1. 1 7. 4 1. 1 Example 8 2.2 1 8 1 9 5 17 5 1 . 2 6. 2 1. 1 Example 9 2. 2 2 8 3 7 5 16 5 1. 2 6. 4 1 . 1 Example 10 2. 2 2 8 4 6 0 2 5 0 1.05 5. 3 1 . 1 Example 11 2. 2 2 8 5 9 0 19 5 1.05 6. 7 1.05 Example 12 2.2 1 8 2 13 5 15 0 1 . 1 5. 8 1. 1 Example 13 2. 19 7 6 10 0 18 0 1. 0 5 7. 3 1.05 Comparative Example 1 2. 2 5 9 0 2 5 2 5 5 1. 7 8. 0 1. 6 -32- 201035377 Note 1: The average 値 of the thermal conductivity and the coefficient of thermal expansion is the average of the three directions of 値. Note 2: The maximum/minimum of thermal conductivity and thermal expansion coefficient is The ratio of the maximum 値 to the minimum 正交 in the orthogonal 3 directions [Table 6] Average A1 layer thickness (μπι) plate thickness ( Mm) Ra (,α m) Example 7 6 5 1. 6 0. 5 Example 8 7 0 1. 6 0. 4 Example 9 7 5 1. 6 0. 5 Example 1 0 6 0 1 . 0. δ Example 1 1 6 5 1. 6 0. 4 Example 1 2 7 0 1. 6 0. 5 Example 1 3 7 5 1. 6 0. 5 Comparative Example 1 9 0 1. 6 0. 6 (Example 1 4 to 1 7) After the isotropic graphite material of Example 1 was processed into an outer shape of 200 mm × 200 mm, the sheet thickness was processed to 0.5 mm (Example 14) and 1.0 mm (Example 15). After 2.0 mm (Example 16) and 2.9 mm (Example 17), an aluminum-graphite composite was produced in the same manner as in Example 1. The obtained aluminum-graphite composite was subjected to characteristic evaluation in the same manner as in Example 1. The results are shown in Tables 7 and 8. -33- 201035377 [Table 7] Bulk Density Impregnation Rate Bending Strength Thermal Conductivity (W/mK) Thermal Expansion Coefficient (X10VK) (g/.cm3) (%) (MPa) Average 値 Maximum/Minimum Average 値 Maximum/Minimum Example 14 2· 2 1 8 1 7 5 17 5 1 . 1 7. 3 1. 1 Example 15 2. 2 2 8 3 7 5 18 0 1. 1 7. 3 1. 1 Example 16 2. 2 2 8 3 8 0 18 5 1 . 1 7. 4 1. 1 Example 17 2. 2 1 8 1 8 0 18 5 1. 1 7. 3 1. 1 Note 1: The average 値 of thermal conductivity and thermal expansion coefficient is orthogonal Average 値0 of the 3-direction 注0 Note 2: The ratio of the maximum 値 to the minimum 3 in the 3 directions in which the thermal conductivity is the maximum/minimum of the thermal expansion coefficient [Table 8] Average A1 layer thickness (/zm) Plate thickness ( Mm) Ra (β m) Example 1 4 8 0 0. 6 0. 6 Example 1 5 7 5 1. 1 0. 5 Example 1 6 7 5 2. 1 0. 5 Example 1 7 6 5 3 . 0 0. 4

(Examples 1 to 8 and Comparative Examples 2 to 6) After the laminate was produced in the same manner as in Example 1, except that the conditions shown in Table 9 were used, the isotropic graphite material was impregnated with aluminum alloy in the same manner as in Example 1. ' An aluminum-graphite composite was produced. In order to remove the deformation at the time of immersion, the obtained composite was subjected to an annealing treatment at a temperature of 50 (TC for 2 hours), and the evaluation was carried out in the same manner as in Example 1. The results are shown in Table 1. The comparative example 5 was released. The thickness of the aluminum alloy layer on the surface of the plate-shaped aluminum-graphite composite-34-201035377 becomes uneven, and the aluminum-graphite composite is greatly bent. Comparative Example 6 is a plate-shaped aluminum-graphite composite after demolding The crack with aluminum alloy was confirmed on the object. [Table 9] Mounting torque (Nm) Preheating temperature of aluminum alloy preheating atmosphere (0 〇 impregnation pressure (MPa) Example 18 20 AH 2% Si atmosphere 650 100 Example 19 20 AI-12% S\ Nitrogen atmosphere 650 20 Example 20 20 AI-12% Si Nitrogen atmosphere 650 50 Example 21 20 AI-12% Si 氡 atmosphere 600 100 Example 22 20 AI-3% Si Nitrogen atmosphere 750 100 Example 23 20 AI-20% Si Niobium 氱 650 100 Example 24 20 Αμΐ 2% 3Ι-3% Μβ Nitrogen atmosphere 650 100 Comparative Example 2 20 AI-12% Si 500 100 Comparative Example 3 20 AI-12% Si atmosphere Atmosphere 850 100 Comparative Example 4 20 AI-12% Si Nitrogen atmosphere 650 5 Comparative Example 5 0.5 AI-12% Si Nitrogen atmosphere 650 100 Comparison 6 100 AM2% Si nitrogen atmosphere 650100

G -35- 201035377 L 丄〇 丄〇 广 广 广 广 广 广 广 广 广 广 广 ρ ρ E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E Average 値CO T— 卜* CO 00 ϊ&lt; 令· &lt;Ώ &lt;d CO K CO CM cd T&quot; CO Bu: CO Thermal conductivity (W/mK) Maximum/minimum 1—T— Τ- 1 τ— Ί — t — r — τ·&quot; Average 値170 ΙΟ ΙΟ LT3 o CO o CNI oo CO ΙΟ to r^. τ—Bending strength (MPa) ΙΟ LO LO ο 00 ΙΟ LO 00 g § LO CO o LO LO Impregnation Rate (%) T - C0 σ &gt; CO CD C〇 inch c〇〇CO CO CO § CO Bulk density (g/cm3) 2.21 2.20 2.21 2.21 2.22 2.23 2.22 CO cq 2.18 2.16 2.22 2.20 I Example 18 I Example 19丨Example 20 I Example 21 1 Example 22 丨 Example 23 丨 Example 24 C\lmu CO m ϋ pair 3 ΙΛ AJ ς〇-36- 201035377 Note 1: The average 値 of thermal conductivity and thermal expansion coefficient is orthogonal The average 値 of the three directions of 値2: the ratio of the maximum 値 to the minimum 3 in the three directions in which the thermal conductivity is the largest/minimum of the thermal expansion coefficient (Examples 25 to 28) Example 2 For stripping the template, an iron plate not coated with a release material was used, and in Example 26, a stripper plate coated with a graphite release material on a stainless steel plate was used, and in Example 27, a stripper plate coated with boron nitride on a stainless steel plate was used. Example 2 An aluminum-graphite composite was produced by impregnating an isotropic graphite material with an aluminum alloy in the same manner as in Example 1 except that a graphite sheet having a thickness of 0.2 mm was used as the stripper. In order to remove the deformation at the time of immersion, the obtained composite was annealed at a temperature of 500 ° C for 2 hours, and then evaluated in the same manner as in Example 1. The results are shown in Tables 11 and 12. In Example 25, after compositing, the plate-shaped aluminum-graphite composite was difficult to release, and the surface roughness after demolding was remarkable. Further, in Example 28, the plate-shaped aluminum-graphite composite after the composite enthalpy was released, but the thickness of the aluminum alloy layer on the surface after demolding was not uniform. Therefore, in Example 25 and Example 28, the removal of the aluminum alloy layer on the surface was carried out in the same manner as in Example 2. [Table 11] Bulk Density (g/cm3) Impregnation Rate (%) Flexural Strength (MPa) Thermal Conductivity (W/mK) Thermal Expansion Coefficient (X10VK) Average 値 Maximum/Minimum Average 値 Maximum/Minimum Example 25 2. 2 1 8 1 8 0 1 B 0 1. 1 7. 3 1. 1 Example 26 2. 2 2 8 4 8 5 18 5 1. 1 7. 3 1. 1 Example 27 2.2 2 8 4 8 0 18 0 1. 1 7. 4 1. 1 Example 28 2.2 1 8 1 7 5 17 5 1 . 1 7. 3 1. 1 -37- 201035377 Note 1: The average 値 of thermal conductivity and thermal expansion coefficient are orthogonal to 3 directions The average 値 of the 値 2: the ratio of the maximum 最小 to the minimum 3 in the 3 directions orthogonal to the maximum/minimum of the thermal conductivity and the coefficient of thermal expansion [Table 12] Average A1 layer thickness Ra (μ m) (mm) ( Wm) Example 2 5 - 1. 4 1. 4 Example 2 6 7 0 1. 5 0. 6 Example 2 7 7 δ 1. 5 0. 7 Example 2 8 - 1. 4 1. 5 (Implementation Examples 29 and 30) After the plate-shaped aluminum-graphite composite of Example 1 (200 mm x 200 mm x 1.6 mm) was washed with water ultrasonic waves, an electroless Ni-P plating treatment having a film thickness of 3 &quot; m was performed. In Example 29, after electroless Ni-P plating, electroless Ni-B plating was performed with a film thickness of 1/im, and Example 30 was subjected to electroless Ni-P plating, and the film thickness: lym non-electrolytic Au was performed. Applying, a plating layer is formed on the surface of the Ming-graphite composite. The obtained plating product had no pinholes ** which were confirmed by the naked eye. Further, after applying a flux to the plating surface, it is immersed in a lead/tin eutectic solder. More than 99% of the plated surface is wetted with solder. In the same manner as in the first embodiment, an LED light-emitting member as shown in Fig. 1 was obtained for the uninsulated LED wafer. Further, the LED chip (1 mm2) which was insulated by Ag paste was bonded to obtain an LED light-emitting member as shown in Fig. 3. Further, in the same manner as in Example 5, the LED wafer (imm2) insulated with -38 - 201035377 was adhered by Ag paste to obtain an LED light-emitting member as shown in Fig. 2. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of an LED light-emitting member according to an embodiment of the present invention. Fig. 2 is a view showing the construction of an LED light-emitting member according to an embodiment of the present invention. Fig. 3 is a view showing the construction of an LED light-emitting member according to an embodiment of the present invention. [Main component symbol description] 1 Aluminum-graphite composite 2 LED chip 3 Metal circuit 4 Insulation layer 5 Solder resist 〇 6 Interlayer connection bumps 7 Active metal bonding material layer -39-

Claims (1)

201035377 - VII. Patent application scope: 1. A method for manufacturing an aluminum-graphite composite, which comprises the following steps (1) to (3) in sequence: (1) a thermal conductivity of a temperature of 25 ° C of 100 to 200 W / mK, the maximum 値/min 値 of the thermal conductivity in the three directions orthogonal to each other is 1 to 1.3, and the thermal expansion coefficient at a temperature of 25 ° C to 150 ° C is 2×10 0 to 6 χ 1 (Γ6/Κ, orthogonal thermal expansion coefficient in three directions) The maximum 値/min 値 is 1~1.3, 0 and the isotropic graphite material having a porosity of 10 to 20% by volume is processed into a plate shape having a plate thickness of 0.5 to 3 mm, and (2) the plate isotropic The step of depositing the graphite material by the delamination and laminating 'the mounting torque in the vertical direction with respect to the plate surface of the isotropic graphite material is 1 to 50 Nm, and (3) by the casting forging method,矽3 to 20% by mass of the aluminum alloy is impregnated with a pressure of 20 Μ P a or more, so that 70% or more of the pores of the isotropic graphite material are impregnated with an aluminum alloy, and in a plate-like isotropic stone Q ink A step of providing an aluminum alloy layer having an average thickness of 10 to 300 / / m on both main faces of the material. The method for producing an aluminum-graphite composite according to the ninth aspect of the invention, further comprising the step of removing the aluminum alloy layer disposed on the two main faces of the plate-like isotropic graphite material. 3. If the application scope is 丨 or 2 The method for producing aluminum-graphite composites wherein the isotropic graphite material is made of coke-based graphite. 4_ An aluminum-graphite composite having a surface roughness (Ra) of ο"~3 #m, Temperature 25. (: The thermal conductivity is 15 〇 ~ 3 〇〇 W / mK, the orthogonal 3 • 40 - 201035377 direction of the thermal conductivity of the maximum 値 / minimum 値 is 1 ~ 1.3, temperature 25 ° C ~ 150 ° C The coefficient of thermal expansion is 4χ1 (Γ6~7.5xl0_6/K, the maximum 値/min 値 of the thermal expansion coefficient in the orthogonal three directions is 1~1·3, and the bending strength at 3 points is 50~150 MPa. 5. The aluminum-graphite composite of the fourth aspect is formed by performing a shape such as a hole. 6. The aluminum-graphite composite according to claim 4 or 5, wherein a plating layer is formed on the surface. 7 - a heat dissipating component, which is an aluminum as in any one of claims 4 to 6 - One of the main faces or the two main faces of the graphite composite is formed by forming a metal circuit via an insulating layer. 8 _ - A heat dissipating component 'Aluminum-graphite according to any one of claims 4 to 6 One of the main surface or the two main surfaces of the composite is formed by forming a metal circuit through the active metal bonding material layer. 9 _ An LED light-emitting member which is mounted on the heat-dissipating component of the seventh or eighth aspect of the patent application Wafer and / or LED package. ❹ -41 -