JP5667467B2 - 合金材料、回路基板、電子デバイス及びその製造方法 - Google Patents

合金材料、回路基板、電子デバイス及びその製造方法 Download PDF

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JP5667467B2
JP5667467B2 JP2011033496A JP2011033496A JP5667467B2 JP 5667467 B2 JP5667467 B2 JP 5667467B2 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 5667467 B2 JP5667467 B2 JP 5667467B2
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mass
temperature
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melting point
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JP2012172178A5 (de
JP2012172178A (ja
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佐藤　了平
了平 佐藤
重信 関根
重信 関根
由莉奈 関根
由莉奈 関根
剛治 岩田
剛治 岩田
幸博 佐藤
幸博 佐藤
晃弘 塚田
晃弘 塚田
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有限会社 ナプラ
有限会社 ナプラ
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JP2011033496A 2011-02-18 2011-02-18 合金材料、回路基板、電子デバイス及びその製造方法 Active JP5667467B2 (ja)

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JP2012172178A JP2012172178A (ja) 2012-09-10
JP2012172178A5 JP2012172178A5 (de) 2014-03-06
JP5667467B2 true JP5667467B2 (ja) 2015-02-12

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Publication number Priority date Publication date Assignee Title
CN107405729A (zh) * 2015-03-31 2017-11-28 住友金属矿山股份有限公司 焊膏
WO2017065236A1 (ja) * 2015-10-15 2017-04-20 住友精密工業株式会社 充填方法および充填装置
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
JP7417696B1 (ja) 2022-08-01 2024-01-18 千住金属工業株式会社 金属及び電子装置

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* Cited by examiner, † Cited by third party
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JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
EP1705258A3 (de) * 2001-05-28 2007-01-17 Honeywell International, Inc. Zusammensetzungen; Verfahren und Vorrichtungen für bleifreies Hochtemperaturlötmittel
KR101088658B1 (ko) * 2005-11-11 2011-12-01 가부시키가이샤 무라타 세이사쿠쇼 솔더 페이스트와 땜납 이음매
EP2061625A1 (de) * 2006-09-13 2009-05-27 Honeywell International Inc. Modifizierte lötlegierungen für elektrische verbindungen sowie herstellungsverfahren dafür und anwendungen davon
JP4444995B2 (ja) * 2007-08-10 2010-03-31 有限会社ナプラ 基板配線用導電性組成物、回路基板及び電子デバイス
JP5194326B2 (ja) * 2008-12-27 2013-05-08 千住金属工業株式会社 Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金

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