JP2012172178A5 - - Google Patents
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- JP2012172178A5 JP2012172178A5 JP2011033496A JP2011033496A JP2012172178A5 JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012172178A JP2012172178A (ja) | 2012-09-10 |
JP2012172178A5 true JP2012172178A5 (de) | 2014-03-06 |
JP5667467B2 JP5667467B2 (ja) | 2015-02-12 |
Family
ID=46975373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011033496A Active JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5667467B2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107405729A (zh) * | 2015-03-31 | 2017-11-28 | 住友金属矿山股份有限公司 | 焊膏 |
WO2017065236A1 (ja) * | 2015-10-15 | 2017-04-20 | 住友精密工業株式会社 | 充填方法および充填装置 |
CN106001982A (zh) * | 2016-07-08 | 2016-10-12 | 重庆科技学院 | 一种高熔点无铅铋银锡钎料及其制备方法 |
JP7417696B1 (ja) | 2022-08-01 | 2024-01-18 | 千住金属工業株式会社 | 金属及び電子装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3671815B2 (ja) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
EP1705258A3 (de) * | 2001-05-28 | 2007-01-17 | Honeywell International, Inc. | Zusammensetzungen; Verfahren und Vorrichtungen für bleifreies Hochtemperaturlötmittel |
KR101088658B1 (ko) * | 2005-11-11 | 2011-12-01 | 가부시키가이샤 무라타 세이사쿠쇼 | 솔더 페이스트와 땜납 이음매 |
EP2061625A1 (de) * | 2006-09-13 | 2009-05-27 | Honeywell International Inc. | Modifizierte lötlegierungen für elektrische verbindungen sowie herstellungsverfahren dafür und anwendungen davon |
JP4444995B2 (ja) * | 2007-08-10 | 2010-03-31 | 有限会社ナプラ | 基板配線用導電性組成物、回路基板及び電子デバイス |
JP5194326B2 (ja) * | 2008-12-27 | 2013-05-08 | 千住金属工業株式会社 | Bi−Sn系リール巻きはんだ線およびはんだ線の製造方法 |
WO2012002173A1 (ja) * | 2010-06-30 | 2012-01-05 | 千住金属工業株式会社 | Bi-Sn系高温はんだ合金 |
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2011
- 2011-02-18 JP JP2011033496A patent/JP5667467B2/ja active Active
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