JP5658951B2 - 感圧センサー - Google Patents
感圧センサー Download PDFInfo
- Publication number
- JP5658951B2 JP5658951B2 JP2010199424A JP2010199424A JP5658951B2 JP 5658951 B2 JP5658951 B2 JP 5658951B2 JP 2010199424 A JP2010199424 A JP 2010199424A JP 2010199424 A JP2010199424 A JP 2010199424A JP 5658951 B2 JP5658951 B2 JP 5658951B2
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- JP
- Japan
- Prior art keywords
- conductive layer
- conductive
- electrode
- pressure
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 241000283690 Bos taurus Species 0.000 claims 1
- 239000010410 layer Substances 0.000 description 187
- 230000000052 comparative effect Effects 0.000 description 18
- 230000004043 responsiveness Effects 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000006229 carbon black Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000013034 phenoxy resin Substances 0.000 description 5
- 229920006287 phenoxy resin Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000013530 defoamer Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010199424A JP5658951B2 (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010199424A JP5658951B2 (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012057992A JP2012057992A (ja) | 2012-03-22 |
| JP2012057992A5 JP2012057992A5 (enExample) | 2013-10-17 |
| JP5658951B2 true JP5658951B2 (ja) | 2015-01-28 |
Family
ID=46055286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010199424A Active JP5658951B2 (ja) | 2010-09-06 | 2010-09-06 | 感圧センサー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5658951B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6514443B2 (ja) * | 2014-05-21 | 2019-05-15 | ニッタ株式会社 | 圧力分布センサシステム、圧力分布の測定方法、および圧力分布の測定プログラム |
| WO2016114272A1 (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| JP2016130736A (ja) * | 2015-01-13 | 2016-07-21 | ニッタ株式会社 | 感圧センサの製造方法 |
| CN107532953A (zh) * | 2015-03-31 | 2018-01-02 | 株式会社ＮｅｊｉＬａｗ | 带通电路径的部件和通电路径的图案化方法及部件变化测量方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH117857A (ja) * | 1997-06-17 | 1999-01-12 | Denso Corp | メンブレンスイッチ |
| JPH11238423A (ja) * | 1998-02-20 | 1999-08-31 | Porimatec Kk | 接点キースイッチおよびその製造法 |
| JP2000088670A (ja) * | 1998-09-10 | 2000-03-31 | Sony Corp | 温度検出用装置及び圧力検出用装置 |
| JP3882172B2 (ja) * | 2003-05-21 | 2007-02-14 | ニッタ株式会社 | 感圧センサー |
| JP2008256399A (ja) * | 2007-04-02 | 2008-10-23 | Shin Etsu Polymer Co Ltd | 感圧抵抗素子 |
-
2010
- 2010-09-06 JP JP2010199424A patent/JP5658951B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012057992A (ja) | 2012-03-22 |
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