JP5648588B2 - アルミニウム構造体の製造方法およびアルミニウム構造体 - Google Patents
アルミニウム構造体の製造方法およびアルミニウム構造体 Download PDFInfo
- Publication number
- JP5648588B2 JP5648588B2 JP2011124707A JP2011124707A JP5648588B2 JP 5648588 B2 JP5648588 B2 JP 5648588B2 JP 2011124707 A JP2011124707 A JP 2011124707A JP 2011124707 A JP2011124707 A JP 2011124707A JP 5648588 B2 JP5648588 B2 JP 5648588B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- plating
- conductive
- molded body
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims description 112
- 239000011347 resin Substances 0.000 claims description 112
- 229910052782 aluminium Inorganic materials 0.000 claims description 76
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 74
- 238000007747 plating Methods 0.000 claims description 68
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 58
- 150000003839 salts Chemical class 0.000 claims description 47
- 229910052799 carbon Inorganic materials 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 21
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 9
- 239000003973 paint Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 38
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000002184 metal Substances 0.000 description 22
- 239000000725 suspension Substances 0.000 description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 239000011149 active material Substances 0.000 description 19
- 239000007772 electrode material Substances 0.000 description 15
- 239000011230 binding agent Substances 0.000 description 13
- 239000011148 porous material Substances 0.000 description 13
- 239000006260 foam Substances 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 11
- 239000008096 xylene Substances 0.000 description 11
- -1 nickel metal hydride Chemical class 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 7
- 229910001416 lithium ion Inorganic materials 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- BMQZYMYBQZGEEY-UHFFFAOYSA-M 1-ethyl-3-methylimidazolium chloride Chemical compound [Cl-].CCN1C=C[N+](C)=C1 BMQZYMYBQZGEEY-UHFFFAOYSA-M 0.000 description 5
- 239000002612 dispersion medium Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- 229910000528 Na alloy Inorganic materials 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 150000004693 imidazolium salts Chemical class 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007774 positive electrode material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002518 antifoaming agent Substances 0.000 description 3
- 239000011195 cermet Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002482 conductive additive Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000007773 negative electrode material Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000005486 organic electrolyte Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- POKOASTYJWUQJG-UHFFFAOYSA-M 1-butylpyridin-1-ium;chloride Chemical compound [Cl-].CCCC[N+]1=CC=CC=C1 POKOASTYJWUQJG-UHFFFAOYSA-M 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- 229910012851 LiCoO 2 Inorganic materials 0.000 description 1
- 229910015643 LiMn 2 O 4 Inorganic materials 0.000 description 1
- 229910013290 LiNiO 2 Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- QHGJSLXSVXVKHZ-UHFFFAOYSA-N dilithium;dioxido(dioxo)manganese Chemical compound [Li+].[Li+].[O-][Mn]([O-])(=O)=O QHGJSLXSVXVKHZ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- CFJRPNFOLVDFMJ-UHFFFAOYSA-N titanium disulfide Chemical compound S=[Ti]=S CFJRPNFOLVDFMJ-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011124707A JP5648588B2 (ja) | 2011-06-03 | 2011-06-03 | アルミニウム構造体の製造方法およびアルミニウム構造体 |
CN201280026568.XA CN103582721B (zh) | 2011-06-03 | 2012-05-22 | 铝结构体的制造方法和铝结构体 |
KR1020137023605A KR20140018896A (ko) | 2011-06-03 | 2012-05-22 | 알루미늄 구조체의 제조 방법 및 알루미늄 구조체 |
DE112012002350.1T DE112012002350T5 (de) | 2011-06-03 | 2012-05-22 | Verfahren zur Herstellung einer Aluminiumstruktur und Aluminiumstruktur |
PCT/JP2012/063007 WO2012165214A1 (ja) | 2011-06-03 | 2012-05-22 | アルミニウム構造体の製造方法およびアルミニウム構造体 |
US13/648,680 US20130121873A1 (en) | 2011-06-03 | 2012-10-10 | Method for producing aluminum structure and aluminum structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011124707A JP5648588B2 (ja) | 2011-06-03 | 2011-06-03 | アルミニウム構造体の製造方法およびアルミニウム構造体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014222989A Division JP2015083716A (ja) | 2014-10-31 | 2014-10-31 | アルミニウム構造体を含む電極材料、それを用いた電池および電気二重層コンデンサ、ならびにアルミニウム構造体を用いた濾過フィルタおよび触媒担体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012251211A JP2012251211A (ja) | 2012-12-20 |
JP5648588B2 true JP5648588B2 (ja) | 2015-01-07 |
Family
ID=47259075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011124707A Active JP5648588B2 (ja) | 2011-06-03 | 2011-06-03 | アルミニウム構造体の製造方法およびアルミニウム構造体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130121873A1 (zh) |
JP (1) | JP5648588B2 (zh) |
KR (1) | KR20140018896A (zh) |
CN (1) | CN103582721B (zh) |
DE (1) | DE112012002350T5 (zh) |
WO (1) | WO2012165214A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015137378A (ja) * | 2014-01-21 | 2015-07-30 | 住友電気工業株式会社 | アルミニウム膜の製造方法及び製造装置 |
US20160343519A1 (en) * | 2014-01-31 | 2016-11-24 | Sumitomo Electric Industries, Ltd. | Conductive resin molded body, structure, aluminum porous body, method for producing aluminum porous body, current collector, electrode, non-aqueous electric double layer capacitor, and lithium ion capacitor |
CN108780672B (zh) * | 2016-04-21 | 2022-03-01 | 株式会社钟化 | 放射性同位素制造用支撑基板、放射性同位素制造用靶板、以及支撑基板的制造方法 |
US11261533B2 (en) * | 2017-02-10 | 2022-03-01 | Applied Materials, Inc. | Aluminum plating at low temperature with high efficiency |
JP6600869B1 (ja) * | 2017-12-15 | 2019-11-06 | 富山住友電工株式会社 | 金属多孔体の製造方法、及びめっき処理装置 |
WO2019116633A1 (ja) | 2017-12-15 | 2019-06-20 | 富山住友電工株式会社 | 金属多孔体の製造方法、及びめっき処理装置 |
EP3540096A4 (en) * | 2017-12-15 | 2021-07-21 | Sumitomo Electric Toyama Co., Ltd. | PROCESS FOR MANUFACTURING A POROUS METAL BODY, AND PLACING DEVICE |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4326931A (en) * | 1978-10-12 | 1982-04-27 | Sumitomo Electric Industries, Ltd. | Process for continuous production of porous metal |
US5098544A (en) * | 1989-08-07 | 1992-03-24 | Eltech Systems Corporation | Continuous electroplating of conductive foams |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
US5374491A (en) * | 1993-01-27 | 1994-12-20 | Eltech Systems Corporation | High density, high capacity battery electrode |
JPH07150270A (ja) * | 1993-11-30 | 1995-06-13 | Sumitomo Electric Ind Ltd | 金属多孔質材、その製造方法およびそれを用いた電池用電極 |
JPH07268682A (ja) * | 1994-03-28 | 1995-10-17 | Mec Kk | 非導電体表面に電気メッキする方法 |
JPH09102318A (ja) * | 1995-10-06 | 1997-04-15 | Sumitomo Electric Ind Ltd | 金属多孔体の製造方法及びそれにより得られた電池用電極基板用金属多孔体 |
US5804053A (en) * | 1995-12-07 | 1998-09-08 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
US6231619B1 (en) * | 1995-12-11 | 2001-05-15 | Shipley Company, L.L.C. | Electroplating process |
US6440331B1 (en) * | 1999-06-03 | 2002-08-27 | Electrochemicals Inc. | Aqueous carbon composition and method for coating a non conductive substrate |
US8110076B2 (en) * | 2006-04-20 | 2012-02-07 | Inco Limited | Apparatus and foam electroplating process |
JP2008195990A (ja) * | 2007-02-09 | 2008-08-28 | Dipsol Chem Co Ltd | 電気アルミニウムめっき浴及びそれを用いためっき方法 |
JP5598027B2 (ja) * | 2009-03-05 | 2014-10-01 | 日立金属株式会社 | アルミニウム多孔質材およびその製造方法、アルミニウム多孔質材を電極集電体として用いた蓄電デバイス |
JP2012007233A (ja) * | 2010-04-22 | 2012-01-12 | Sumitomo Electric Ind Ltd | アルミニウム構造体の製造方法およびアルミニウム構造体 |
-
2011
- 2011-06-03 JP JP2011124707A patent/JP5648588B2/ja active Active
-
2012
- 2012-05-22 CN CN201280026568.XA patent/CN103582721B/zh active Active
- 2012-05-22 KR KR1020137023605A patent/KR20140018896A/ko not_active Application Discontinuation
- 2012-05-22 WO PCT/JP2012/063007 patent/WO2012165214A1/ja active Application Filing
- 2012-05-22 DE DE112012002350.1T patent/DE112012002350T5/de not_active Withdrawn
- 2012-10-10 US US13/648,680 patent/US20130121873A1/en not_active Abandoned
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CN103582721A (zh) | 2014-02-12 |
JP2012251211A (ja) | 2012-12-20 |
KR20140018896A (ko) | 2014-02-13 |
US20130121873A1 (en) | 2013-05-16 |
DE112012002350T5 (de) | 2014-02-20 |
WO2012165214A1 (ja) | 2012-12-06 |
CN103582721B (zh) | 2016-03-30 |
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