JP5648588B2 - アルミニウム構造体の製造方法およびアルミニウム構造体 - Google Patents

アルミニウム構造体の製造方法およびアルミニウム構造体 Download PDF

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Publication number
JP5648588B2
JP5648588B2 JP2011124707A JP2011124707A JP5648588B2 JP 5648588 B2 JP5648588 B2 JP 5648588B2 JP 2011124707 A JP2011124707 A JP 2011124707A JP 2011124707 A JP2011124707 A JP 2011124707A JP 5648588 B2 JP5648588 B2 JP 5648588B2
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JP
Japan
Prior art keywords
aluminum
plating
conductive
molded body
resin molded
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Active
Application number
JP2011124707A
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English (en)
Japanese (ja)
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JP2012251211A (ja
Inventor
弘太郎 木村
弘太郎 木村
細江 晃久
晃久 細江
西村 淳一
淳一 西村
奥野 一樹
一樹 奥野
肇 太田
肇 太田
健吾 後藤
健吾 後藤
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2011124707A priority Critical patent/JP5648588B2/ja
Priority to CN201280026568.XA priority patent/CN103582721B/zh
Priority to KR1020137023605A priority patent/KR20140018896A/ko
Priority to DE112012002350.1T priority patent/DE112012002350T5/de
Priority to PCT/JP2012/063007 priority patent/WO2012165214A1/ja
Priority to US13/648,680 priority patent/US20130121873A1/en
Publication of JP2012251211A publication Critical patent/JP2012251211A/ja
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Publication of JP5648588B2 publication Critical patent/JP5648588B2/ja
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/42Electroplating: Baths therefor from solutions of light metals
    • C25D3/44Aluminium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/08Perforated or foraminous objects, e.g. sieves
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/66Electroplating: Baths therefor from melts
    • C25D3/665Electroplating: Baths therefor from melts from ionic liquids
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2011124707A 2011-06-03 2011-06-03 アルミニウム構造体の製造方法およびアルミニウム構造体 Active JP5648588B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011124707A JP5648588B2 (ja) 2011-06-03 2011-06-03 アルミニウム構造体の製造方法およびアルミニウム構造体
CN201280026568.XA CN103582721B (zh) 2011-06-03 2012-05-22 铝结构体的制造方法和铝结构体
KR1020137023605A KR20140018896A (ko) 2011-06-03 2012-05-22 알루미늄 구조체의 제조 방법 및 알루미늄 구조체
DE112012002350.1T DE112012002350T5 (de) 2011-06-03 2012-05-22 Verfahren zur Herstellung einer Aluminiumstruktur und Aluminiumstruktur
PCT/JP2012/063007 WO2012165214A1 (ja) 2011-06-03 2012-05-22 アルミニウム構造体の製造方法およびアルミニウム構造体
US13/648,680 US20130121873A1 (en) 2011-06-03 2012-10-10 Method for producing aluminum structure and aluminum structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011124707A JP5648588B2 (ja) 2011-06-03 2011-06-03 アルミニウム構造体の製造方法およびアルミニウム構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014222989A Division JP2015083716A (ja) 2014-10-31 2014-10-31 アルミニウム構造体を含む電極材料、それを用いた電池および電気二重層コンデンサ、ならびにアルミニウム構造体を用いた濾過フィルタおよび触媒担体

Publications (2)

Publication Number Publication Date
JP2012251211A JP2012251211A (ja) 2012-12-20
JP5648588B2 true JP5648588B2 (ja) 2015-01-07

Family

ID=47259075

Family Applications (1)

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JP2011124707A Active JP5648588B2 (ja) 2011-06-03 2011-06-03 アルミニウム構造体の製造方法およびアルミニウム構造体

Country Status (6)

Country Link
US (1) US20130121873A1 (zh)
JP (1) JP5648588B2 (zh)
KR (1) KR20140018896A (zh)
CN (1) CN103582721B (zh)
DE (1) DE112012002350T5 (zh)
WO (1) WO2012165214A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015137378A (ja) * 2014-01-21 2015-07-30 住友電気工業株式会社 アルミニウム膜の製造方法及び製造装置
US20160343519A1 (en) * 2014-01-31 2016-11-24 Sumitomo Electric Industries, Ltd. Conductive resin molded body, structure, aluminum porous body, method for producing aluminum porous body, current collector, electrode, non-aqueous electric double layer capacitor, and lithium ion capacitor
CN108780672B (zh) * 2016-04-21 2022-03-01 株式会社钟化 放射性同位素制造用支撑基板、放射性同位素制造用靶板、以及支撑基板的制造方法
US11261533B2 (en) * 2017-02-10 2022-03-01 Applied Materials, Inc. Aluminum plating at low temperature with high efficiency
JP6600869B1 (ja) * 2017-12-15 2019-11-06 富山住友電工株式会社 金属多孔体の製造方法、及びめっき処理装置
WO2019116633A1 (ja) 2017-12-15 2019-06-20 富山住友電工株式会社 金属多孔体の製造方法、及びめっき処理装置
EP3540096A4 (en) * 2017-12-15 2021-07-21 Sumitomo Electric Toyama Co., Ltd. PROCESS FOR MANUFACTURING A POROUS METAL BODY, AND PLACING DEVICE

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326931A (en) * 1978-10-12 1982-04-27 Sumitomo Electric Industries, Ltd. Process for continuous production of porous metal
US5098544A (en) * 1989-08-07 1992-03-24 Eltech Systems Corporation Continuous electroplating of conductive foams
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
US5374491A (en) * 1993-01-27 1994-12-20 Eltech Systems Corporation High density, high capacity battery electrode
JPH07150270A (ja) * 1993-11-30 1995-06-13 Sumitomo Electric Ind Ltd 金属多孔質材、その製造方法およびそれを用いた電池用電極
JPH07268682A (ja) * 1994-03-28 1995-10-17 Mec Kk 非導電体表面に電気メッキする方法
JPH09102318A (ja) * 1995-10-06 1997-04-15 Sumitomo Electric Ind Ltd 金属多孔体の製造方法及びそれにより得られた電池用電極基板用金属多孔体
US5804053A (en) * 1995-12-07 1998-09-08 Eltech Systems Corporation Continuously electroplated foam of improved weight distribution
US6231619B1 (en) * 1995-12-11 2001-05-15 Shipley Company, L.L.C. Electroplating process
US6440331B1 (en) * 1999-06-03 2002-08-27 Electrochemicals Inc. Aqueous carbon composition and method for coating a non conductive substrate
US8110076B2 (en) * 2006-04-20 2012-02-07 Inco Limited Apparatus and foam electroplating process
JP2008195990A (ja) * 2007-02-09 2008-08-28 Dipsol Chem Co Ltd 電気アルミニウムめっき浴及びそれを用いためっき方法
JP5598027B2 (ja) * 2009-03-05 2014-10-01 日立金属株式会社 アルミニウム多孔質材およびその製造方法、アルミニウム多孔質材を電極集電体として用いた蓄電デバイス
JP2012007233A (ja) * 2010-04-22 2012-01-12 Sumitomo Electric Ind Ltd アルミニウム構造体の製造方法およびアルミニウム構造体

Also Published As

Publication number Publication date
CN103582721A (zh) 2014-02-12
JP2012251211A (ja) 2012-12-20
KR20140018896A (ko) 2014-02-13
US20130121873A1 (en) 2013-05-16
DE112012002350T5 (de) 2014-02-20
WO2012165214A1 (ja) 2012-12-06
CN103582721B (zh) 2016-03-30

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