JP5645164B2 - フィルム剥離装置 - Google Patents
フィルム剥離装置 Download PDFInfo
- Publication number
- JP5645164B2 JP5645164B2 JP2011230327A JP2011230327A JP5645164B2 JP 5645164 B2 JP5645164 B2 JP 5645164B2 JP 2011230327 A JP2011230327 A JP 2011230327A JP 2011230327 A JP2011230327 A JP 2011230327A JP 5645164 B2 JP5645164 B2 JP 5645164B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- width direction
- substrate
- roller
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000001681 protective effect Effects 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 83
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000009194 climbing Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011230327A JP5645164B2 (ja) | 2011-10-20 | 2011-10-20 | フィルム剥離装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011230327A JP5645164B2 (ja) | 2011-10-20 | 2011-10-20 | フィルム剥離装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013089826A JP2013089826A (ja) | 2013-05-13 |
JP2013089826A5 JP2013089826A5 (zh) | 2013-08-29 |
JP5645164B2 true JP5645164B2 (ja) | 2014-12-24 |
Family
ID=48533433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011230327A Active JP5645164B2 (ja) | 2011-10-20 | 2011-10-20 | フィルム剥離装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5645164B2 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108891121B (zh) * | 2018-08-13 | 2024-05-31 | 深圳市伟鸿科科技有限公司 | 剥料机构及fpc预处理装置 |
-
2011
- 2011-10-20 JP JP2011230327A patent/JP5645164B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013089826A (ja) | 2013-05-13 |
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