JP5638396B2 - 微細要素の物質分析のためのシステムおよび方法 - Google Patents
微細要素の物質分析のためのシステムおよび方法 Download PDFInfo
- Publication number
- JP5638396B2 JP5638396B2 JP2010543626A JP2010543626A JP5638396B2 JP 5638396 B2 JP5638396 B2 JP 5638396B2 JP 2010543626 A JP2010543626 A JP 2010543626A JP 2010543626 A JP2010543626 A JP 2010543626A JP 5638396 B2 JP5638396 B2 JP 5638396B2
- Authority
- JP
- Japan
- Prior art keywords
- charged particle
- particle beam
- mode illumination
- area
- during
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004458 analytical method Methods 0.000 title claims description 91
- 239000000463 material Substances 0.000 title claims description 84
- 238000000034 method Methods 0.000 title claims description 36
- 239000002245 particle Substances 0.000 claims description 134
- 238000006073 displacement reaction Methods 0.000 claims description 74
- 238000005286 illumination Methods 0.000 claims description 39
- 230000004044 response Effects 0.000 claims description 35
- 239000000126 substance Substances 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 description 17
- 230000003993 interaction Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002493 microarray Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/263—Contrast, resolution or power of penetration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24571—Measurements of non-electric or non-magnetic variables
- H01J2237/24578—Spatial variables, e.g. position, distance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/25—Tubes for localised analysis using electron or ion beams
- H01J2237/2505—Tubes for localised analysis using electron or ion beams characterised by their application
- H01J2237/2511—Auger spectrometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/25—Tubes for localised analysis using electron or ion beams
- H01J2237/2505—Tubes for localised analysis using electron or ion beams characterised by their application
- H01J2237/2555—Microprobes, i.e. particle-induced X-ray spectrometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30455—Correction during exposure
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2255008P | 2008-01-22 | 2008-01-22 | |
| US61/022,550 | 2008-01-22 | ||
| PCT/IL2009/000094 WO2009093247A1 (en) | 2008-01-22 | 2009-01-22 | System and method for material analysis of a microscopic element |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011510321A JP2011510321A (ja) | 2011-03-31 |
| JP2011510321A5 JP2011510321A5 (enExample) | 2012-03-22 |
| JP5638396B2 true JP5638396B2 (ja) | 2014-12-10 |
Family
ID=40636883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010543626A Expired - Fee Related JP5638396B2 (ja) | 2008-01-22 | 2009-01-22 | 微細要素の物質分析のためのシステムおよび方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8546756B2 (enExample) |
| JP (1) | JP5638396B2 (enExample) |
| WO (1) | WO2009093247A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7276801B2 (en) | 2003-09-22 | 2007-10-02 | Intel Corporation | Designs and methods for conductive bumps |
| TWI794615B (zh) | 2019-07-26 | 2023-03-01 | 德商卡爾蔡司Smt有限公司 | 微加工裝置的自動運作控制 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0646550B2 (ja) * | 1985-08-19 | 1994-06-15 | 株式会社東芝 | 電子ビ−ム定位置照射制御方法および電子ビ−ム定位置照射制御装置 |
| JPS63190236A (ja) * | 1987-02-02 | 1988-08-05 | Matsushita Electric Ind Co Ltd | 電子プロ−ブ解析装置 |
| JP3454052B2 (ja) * | 1996-12-05 | 2003-10-06 | 株式会社日立製作所 | 電子線分析装置 |
| JP2000106121A (ja) * | 1998-07-29 | 2000-04-11 | Jeol Ltd | 電子顕微鏡あるいはその類似装置 |
| JP2000133567A (ja) | 1998-10-23 | 2000-05-12 | Advantest Corp | 電子ビーム露光方法及び電子ビーム露光装置 |
| JP2001168013A (ja) * | 1999-12-10 | 2001-06-22 | Nec Corp | 電子線露光方法 |
| JP2002286663A (ja) * | 2001-03-26 | 2002-10-03 | Jeol Ltd | 試料分析および試料観察装置 |
| JP4065847B2 (ja) * | 2001-11-21 | 2008-03-26 | 株式会社日立ハイテクノロジーズ | 試料像形成方法及び荷電粒子線装置 |
| US6924484B1 (en) * | 2002-11-19 | 2005-08-02 | Kla-Tencor Corporation | Void characterization in metal interconnect structures using X-ray emission analyses |
| US7018683B2 (en) * | 2004-06-15 | 2006-03-28 | Sii Nanotechnology Inc. | Electron beam processing method |
| JP2006173038A (ja) * | 2004-12-20 | 2006-06-29 | Hitachi High-Technologies Corp | 荷電粒子線装置、試料像表示方法及びイメージシフト感度計測方法 |
| JP3904021B2 (ja) * | 2005-04-05 | 2007-04-11 | 株式会社日立製作所 | 電子線分析方法 |
| JP4520426B2 (ja) * | 2005-07-04 | 2010-08-04 | 株式会社ニューフレアテクノロジー | 電子ビームのビームドリフト補正方法及び電子ビームの描画方法 |
| JP2007115587A (ja) * | 2005-10-21 | 2007-05-10 | Sii Nanotechnology Inc | 荷電粒子ビーム加工方法及び荷電粒子ビーム装置 |
-
2009
- 2009-01-22 JP JP2010543626A patent/JP5638396B2/ja not_active Expired - Fee Related
- 2009-01-22 WO PCT/IL2009/000094 patent/WO2009093247A1/en not_active Ceased
- 2009-01-22 US US12/864,215 patent/US8546756B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US8546756B2 (en) | 2013-10-01 |
| US20110024622A1 (en) | 2011-02-03 |
| WO2009093247A1 (en) | 2009-07-30 |
| JP2011510321A (ja) | 2011-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112219111B (zh) | 使用于晶片噪声公害识别的扫描式电子显微镜及光学图像相关 | |
| JP5164317B2 (ja) | 電子線による検査・計測方法および検査・計測装置 | |
| US8791414B2 (en) | Dynamic focus adjustment with optical height detection apparatus in electron beam system | |
| JP6253618B2 (ja) | Ebspパターンの取得方法 | |
| KR101685274B1 (ko) | 하전 입자선 장치 | |
| US8080790B2 (en) | Scanning electron microscope | |
| US6140644A (en) | Inspection apparatus and method using a particle beam | |
| NL2028949B1 (en) | Method for operating a multiple particle beam system with a mirror mode of operation and associated computer program product | |
| WO2010147104A1 (ja) | 荷電粒子顕微鏡装置及び荷電粒子ビーム制御方法 | |
| JP5638396B2 (ja) | 微細要素の物質分析のためのシステムおよび方法 | |
| JP6909859B2 (ja) | 荷電粒子線装置 | |
| US9460891B2 (en) | Inspection equipment | |
| JP5103253B2 (ja) | 荷電粒子線装置 | |
| CN112840433B (zh) | 用于选择性sem自动聚焦的系统和方法 | |
| CN108231513B (zh) | 用于操作显微镜的方法 | |
| JP2016502094A (ja) | 相対的なクリティカルディメンションの測定のための方法および装置 | |
| US10338367B2 (en) | Scanning microscope with controlled variable measurement parameters | |
| JP2003331769A (ja) | 粒子ビーム検査装置および検査方法並びに粒子ビーム応用装置 | |
| KR102800691B1 (ko) | 하전 입자선 장치 | |
| JP2006003370A5 (enExample) | ||
| JP2009294022A (ja) | 検査方法および装置 | |
| JP5174483B2 (ja) | 荷電粒子ビーム装置、及び試料の表面の帯電状態を知る方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120120 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120201 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130507 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130507 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130530 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131203 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140527 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140710 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140924 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141022 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5638396 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |