JP5638088B2 - 回路モジュールおよび当該回路モジュールを製造する方法 - Google Patents

回路モジュールおよび当該回路モジュールを製造する方法 Download PDF

Info

Publication number
JP5638088B2
JP5638088B2 JP2012542516A JP2012542516A JP5638088B2 JP 5638088 B2 JP5638088 B2 JP 5638088B2 JP 2012542516 A JP2012542516 A JP 2012542516A JP 2012542516 A JP2012542516 A JP 2012542516A JP 5638088 B2 JP5638088 B2 JP 5638088B2
Authority
JP
Japan
Prior art keywords
protective cover
circuit
electrical
protective
circuit module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012542516A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013513247A (ja
Inventor
マジング−デサイー シュテファン
マジング−デサイー シュテファン
ミヒャエル　ミュラー
ミュラー ミヒャエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2013513247A publication Critical patent/JP2013513247A/ja
Application granted granted Critical
Publication of JP5638088B2 publication Critical patent/JP5638088B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
JP2012542516A 2009-12-08 2010-12-07 回路モジュールおよび当該回路モジュールを製造する方法 Active JP5638088B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009047681A DE102009047681A1 (de) 2009-12-08 2009-12-08 Schaltungsmodul und Verfahren zur Herstellung eines solchen Schaltungsmoduls
DE102009047681.4 2009-12-08
PCT/EP2010/069072 WO2011070015A2 (de) 2009-12-08 2010-12-07 Schaltungsmodul und verfahren zur herstellung eines solchen schaltungsmoduls

Publications (2)

Publication Number Publication Date
JP2013513247A JP2013513247A (ja) 2013-04-18
JP5638088B2 true JP5638088B2 (ja) 2014-12-10

Family

ID=43534330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012542516A Active JP5638088B2 (ja) 2009-12-08 2010-12-07 回路モジュールおよび当該回路モジュールを製造する方法

Country Status (8)

Country Link
US (1) US9462696B2 (enExample)
EP (1) EP2510762B1 (enExample)
JP (1) JP5638088B2 (enExample)
CN (1) CN102668732B (enExample)
DE (1) DE102009047681A1 (enExample)
ES (1) ES2460625T3 (enExample)
IN (1) IN2012DN05096A (enExample)
WO (1) WO2011070015A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015207310A1 (de) * 2015-04-22 2016-10-27 Zf Friedrichshafen Ag Elektronikmodul und Verfahren zum Umkapseln desselben
JP6598511B2 (ja) * 2015-05-21 2019-10-30 キヤノン株式会社 電源装置及び画像形成装置
JP6464984B2 (ja) * 2015-10-13 2019-02-06 株式会社デンソー 電子装置
DE102015225099A1 (de) * 2015-12-14 2017-06-14 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen
CN112557710A (zh) * 2020-12-28 2021-03-26 武汉光迅科技股份有限公司 光器件的测试夹具及其测试装置
US12155313B2 (en) * 2021-02-10 2024-11-26 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter
US11916490B2 (en) 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter
US11923778B2 (en) * 2021-02-10 2024-03-05 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter and method for manufacturing the same
US11916488B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter
US11916005B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. Multi-functional PCB for assembling GaN-based power converter and method for manufacturing the same
US11916489B2 (en) * 2021-02-10 2024-02-27 Innoscience (Suzhou) Technology Co., Ltd. High efficiency and high density GaN-based power converter

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121514A (ja) 1985-11-22 1987-06-02 Mitsubishi Electric Corp 数値制御装置の診断方式
JPS62121514U (enExample) * 1986-01-24 1987-08-01
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US5001548A (en) * 1989-03-13 1991-03-19 Coriolis Corporation Multi-chip module cooling
DE4129238A1 (de) * 1991-09-03 1993-03-04 Bosch Gmbh Robert Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge
US5473512A (en) * 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
DE19626083C2 (de) 1996-06-28 2000-03-23 Siemens Ag Sensor-Bauelement
FI963872A7 (fi) * 1996-09-27 1998-03-28 It Innovations Finland Oy Suojaväline sähkölaitteen suojaamiseksi ympäristöolosuhteilta
JP2001102714A (ja) 1999-09-30 2001-04-13 Yazaki Corp 樹脂封止プリント配線基板
JP2001293752A (ja) 2000-04-10 2001-10-23 Denso Corp 樹脂のインサート成形方法
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6900383B2 (en) 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
DE10252755A1 (de) 2002-11-13 2004-05-27 Robert Bosch Gmbh Thermischer und mechanischer Schutz von diskreten Bauelementen in einem Schaltungsmodul
JP5007562B2 (ja) 2006-12-27 2012-08-22 セイコーエプソン株式会社 時計用文字板の製造方法、時計用文字板および時計
CN201233037Y (zh) * 2008-04-11 2009-05-06 浙江苏泊尔家电制造有限公司 一种防尘防虫防水防火的电磁炉

Also Published As

Publication number Publication date
CN102668732B (zh) 2015-06-17
US20130208433A1 (en) 2013-08-15
WO2011070015A3 (de) 2011-10-13
CN102668732A (zh) 2012-09-12
IN2012DN05096A (enExample) 2015-10-09
JP2013513247A (ja) 2013-04-18
ES2460625T3 (es) 2014-05-14
EP2510762B1 (de) 2014-02-26
DE102009047681A1 (de) 2011-06-09
US9462696B2 (en) 2016-10-04
WO2011070015A2 (de) 2011-06-16
EP2510762A2 (de) 2012-10-17

Similar Documents

Publication Publication Date Title
JP5638088B2 (ja) 回路モジュールおよび当該回路モジュールを製造する方法
US10829064B2 (en) Electronic control device
CN101107893B (zh) 控制模块
US10349540B2 (en) Mechatronic component and method for the production thereof
JP6105087B2 (ja) Ｍｅｍｓ部品を有するオーバーモールドされたデバイスおよび製造方法
JP2006303106A (ja) 電子回路装置
CN104114009B (zh) 利用包覆成型的车辆的电子控制装置及其制造方法
EP3176543B1 (en) Circuit board mounting structure and sensor using same
JP2002316597A (ja) 車両用制御ユニット構造
CN101112136B (zh) 控制设备的系统组件
US10964623B2 (en) Electronic module and method for encapsulation thereof
US10060819B2 (en) Pressure sensor module having a sensor chip and passive devices within a housing
JP6666443B2 (ja) 電子制御装置及びその組立方法
US20160276566A1 (en) Electrical Circuit and Method for Producing an Electrical Circuit
US11122700B2 (en) Electrical assembly
JP5294175B2 (ja) 自動車用制御装置
CN107079583B (zh) 用于在污染的介质中使用的变速器控制模块、用于在这种变速器控制模块中使用的tcu组件和用于制造这种变速器控制模块的方法
CN107954393A (zh) 具有唯一的电支承件的传感器
JP3842010B2 (ja) 複数基板を有する電子機器
JP2009231351A (ja) 電子部品の封止構造
JP4832469B2 (ja) 箱形電子モジュール
US11197382B2 (en) Electronic module for a transmission control unit, and transmission control unit
JP2013070487A (ja) Ｅｃｕの筐体
JP6083357B2 (ja) 電子装置

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130830

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130909

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131206

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140414

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140616

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140714

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140922

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141021

R150 Certificate of patent or registration of utility model

Ref document number: 5638088

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250