JP5633493B2 - 半導体装置及びマイクロフォン - Google Patents

半導体装置及びマイクロフォン Download PDF

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Publication number
JP5633493B2
JP5633493B2 JP2011202981A JP2011202981A JP5633493B2 JP 5633493 B2 JP5633493 B2 JP 5633493B2 JP 2011202981 A JP2011202981 A JP 2011202981A JP 2011202981 A JP2011202981 A JP 2011202981A JP 5633493 B2 JP5633493 B2 JP 5633493B2
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Japan
Prior art keywords
bump
microphone
bonding pad
circuit element
bonding
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Application number
JP2011202981A
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English (en)
Japanese (ja)
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JP2013066021A5 (enExample
JP2013066021A (ja
Inventor
直人 鞍谷
直人 鞍谷
前川　智史
智史 前川
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Omron Corp
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Omron Corp
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Publication date
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Priority to JP2011202981A priority Critical patent/JP5633493B2/ja
Priority to PCT/JP2012/073744 priority patent/WO2013039239A1/ja
Priority to EP12832532.1A priority patent/EP2757812A4/en
Priority to CN201280025569.2A priority patent/CN103583057A/zh
Priority to US14/126,531 priority patent/US20140367808A1/en
Publication of JP2013066021A publication Critical patent/JP2013066021A/ja
Publication of JP2013066021A5 publication Critical patent/JP2013066021A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/67—Seals characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
JP2011202981A 2011-09-16 2011-09-16 半導体装置及びマイクロフォン Active JP5633493B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011202981A JP5633493B2 (ja) 2011-09-16 2011-09-16 半導体装置及びマイクロフォン
PCT/JP2012/073744 WO2013039239A1 (ja) 2011-09-16 2012-09-14 半導体装置及びマイクロフォン
EP12832532.1A EP2757812A4 (en) 2011-09-16 2012-09-14 SEMICONDUCTOR AND MICROPHONE
CN201280025569.2A CN103583057A (zh) 2011-09-16 2012-09-14 半导体装置以及麦克风
US14/126,531 US20140367808A1 (en) 2011-09-16 2013-03-21 Semiconductor device and microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011202981A JP5633493B2 (ja) 2011-09-16 2011-09-16 半導体装置及びマイクロフォン

Publications (3)

Publication Number Publication Date
JP2013066021A JP2013066021A (ja) 2013-04-11
JP2013066021A5 JP2013066021A5 (enExample) 2014-04-24
JP5633493B2 true JP5633493B2 (ja) 2014-12-03

Family

ID=47883454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011202981A Active JP5633493B2 (ja) 2011-09-16 2011-09-16 半導体装置及びマイクロフォン

Country Status (5)

Country Link
US (1) US20140367808A1 (enExample)
EP (1) EP2757812A4 (enExample)
JP (1) JP5633493B2 (enExample)
CN (1) CN103583057A (enExample)
WO (1) WO2013039239A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8653670B2 (en) 2010-06-29 2014-02-18 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
US9570376B2 (en) * 2010-06-29 2017-02-14 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
CN104244152B (zh) * 2013-06-13 2018-11-06 无锡芯奥微传感技术有限公司 微机电系统麦克风封装及封装方法
JP6311376B2 (ja) * 2014-03-14 2018-04-18 オムロン株式会社 マイクロフォン
FR3025879B1 (fr) * 2014-09-15 2018-03-02 Valeo Equipements Electriques Moteur Capteur a ultrason de vehicule automobile pour mesure de distance, procede de fabrication correspondant et utilisation
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
KR101684526B1 (ko) * 2015-08-28 2016-12-08 현대자동차 주식회사 마이크로폰 및 그 제조 방법
KR102052899B1 (ko) * 2016-03-31 2019-12-06 삼성전자주식회사 전자부품 패키지
KR102418952B1 (ko) 2017-08-31 2022-07-08 삼성전자주식회사 음성인식 기능을 갖는 가전제품
US11012790B2 (en) * 2018-08-17 2021-05-18 Invensense, Inc. Flipchip package
CN109362013B (zh) * 2018-12-07 2023-11-14 潍坊歌尔微电子有限公司 组合传感器
CN215453270U (zh) * 2021-07-07 2022-01-07 瑞声声学科技(深圳)有限公司 麦克风

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340961A (ja) * 2004-05-24 2005-12-08 Matsushita Electric Works Ltd 音波受信装置
US7373835B2 (en) * 2005-01-31 2008-05-20 Sanyo Electric Industries, Ltd. Semiconductor sensor
JP2008002953A (ja) * 2006-06-22 2008-01-10 Yamaha Corp 半導体装置及びその製造方法
JP2008187607A (ja) * 2007-01-31 2008-08-14 Yamaha Corp 半導体装置
TWI359480B (en) * 2007-06-13 2012-03-01 Advanced Semiconductor Eng Semiconductor package structure, applications ther
JP2010183312A (ja) * 2009-02-05 2010-08-19 Funai Electric Co Ltd マイクロホンユニット
DE102009007837A1 (de) * 2009-02-06 2010-08-19 Epcos Ag Sensormodul und Verfahren zum Herstellen von Sensormodulen
CN201438743U (zh) * 2009-05-15 2010-04-14 瑞声声学科技(常州)有限公司 麦克风
CN101765047A (zh) * 2009-09-28 2010-06-30 瑞声声学科技(深圳)有限公司 电容麦克风及其制作方法
JP5302867B2 (ja) * 2009-12-07 2013-10-02 ホシデン株式会社 マイクロホン
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP5029727B2 (ja) * 2010-06-01 2012-09-19 オムロン株式会社 半導体装置及びマイクロフォン
US8666505B2 (en) * 2010-10-26 2014-03-04 Medtronic, Inc. Wafer-scale package including power source
US8476720B2 (en) * 2011-06-29 2013-07-02 Honeywell International Inc. Systems and methods for vertically stacking a sensor on an integrated circuit chip
JP5327299B2 (ja) * 2011-09-09 2013-10-30 オムロン株式会社 半導体装置及びマイクロフォン

Also Published As

Publication number Publication date
CN103583057A (zh) 2014-02-12
JP2013066021A (ja) 2013-04-11
WO2013039239A1 (ja) 2013-03-21
EP2757812A1 (en) 2014-07-23
US20140367808A1 (en) 2014-12-18
EP2757812A4 (en) 2015-05-06

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