JP5623708B2 - 層状の電子デバイスをフレキシブル基板上に製造する方法及び薄膜電子構造 - Google Patents
層状の電子デバイスをフレキシブル基板上に製造する方法及び薄膜電子構造 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
本明細書で説明する実施形態によって、高い内部応力を持つ多層膜のスタックを使用して薄膜トランジスタ(TFT)や類似のデバイスを作製できるようになる。具体的には、塑性変形したバッファ層を組み込んだものを、後の層堆積のための硬質基盤として使用する。バッファ層を効果的にするために、熱アニールを利用して第1のパターニングプロセスステップの前にバッファ層を塑性変形させる。基板は、塑性変形してもしなくてもよい。一実施形態では、基板は塑性変形せずに弾性変形した状態のままである。比較的軟らかい材料を基板に使用する場合、その材料は移動して塑性変形したバッファによって決定される位置に留まるであろう。しかしながら他の実施形態では、基板が塑性変形してもいいように材料のパラメータをある程度固定するならば、基板を塑性変形させることができる。一旦塑性変形が起こると横(側方)の寸法は機械的に「ロックされ」、後続の処理ステップによって可逆的な弾性変形のみが生じ、横の寸法はアニールした位置までとなる。
・ 出発材料−フレキシブル基板、例えば、ポリエチレンナフタレート(PEN)
・ フレキシブル基板にバッファ層を(真空破壊せずに)堆積させる。例えば、厚さ200〜400ナノメートル(nm)、好ましくは300nmの二酸化シリコン(SiO2)を、200〜400nm、好ましくは300nmの窒化シリコン(Si3N4)上に堆積させる。
・ 第1の金属層(ベース金属層)を堆積させ、バッファ上でパターニングする。例えば、厚さ100〜150nm、好ましくは120nmのタンタル(Ta)とする。
・ フレキシブル基板/バッファ層(フレキシブル)プラットフォーム上のヘテロ構造スタックをブランケットアニールする。例えば、Ta/SiO2/Si3N4/PENのスタックを180℃で30分間真空アニールする。
・ 第1の層を室温でパターニングする。例えば、Ta膜上にゲート層(レベル1)をパターニングし、続いて金属エッチングとレジストストリップを行う。
・ ブランケットアニール温度よりも低温で次以降の薄膜を堆積・処理する。
バリア(障壁)層34(以下、バッファ層をバリア層と言い換えて記載する)を高温で堆積させてから冷却すると、基板32とバリア層34の両方に応力が生じる。室温では、基板とバリア層の歪は同じであるが(力平衡ごとの)応力は異なる(逆である)。歪(変形)は、基板32を形成する材料とバリア層34を形成する材料との間の熱的不整合によって生じる。この上にTFT40を形成すると、スタックは縁部において完全に自由度があり、構造への曲げや伸張による応力を緩和することができる。各層における歪の増大は、中立面の位置、弾性特徴、各層の厚さの関数である。膜スタックの縁において自由度があるようにする(そうすることで全体として湾曲した状態にする)ためには、以下の力平衡を保つ必要がある。
Σσiti=0
式中、σiは各層の応力である。
Δε=Δεmisfit+Δεbending+Δεelastic
曲げ歪は、以下の式で与えられる。
Δεbending=−k×(y−s)
および
I. 初期加熱:初期応力は(堆積したままのTa内の固有の応力によって)−2.25ギガパスカル(GPa)と緊張した状態で、150℃まで加熱すると1.9GPaまで緩和した。
II. 初期冷却:最終的な応力状態は−2.05メガパスカル(MPa)で、初期状態とは著しく異なる。この応力の差が、基板/膜のスタックで弾性的に許容されなければならない。この応力の差は、矢印によって示されるように、Δεifnoannealで説明されている。
III. 2度目の加熱:曲線は、実質的に冷却曲線を繰り返している。これは、主に弾性変形の高温における緩和への傾向を示している。
IV. 2度目の冷却:第2の冷却後の最終的な応力状態は、第2のサイクル前の応力に非常に似ている。これは、第2の(および後続の)加熱/冷却サイクルの際、温度がアニール温度よりも低いままであった場合に、基板が非常に僅かなさらなる弾性歪を許容しなければならないことを意味する。
Claims (4)
- 層状の電子デバイスをフレキシブル基板上に製造する方法であって、
前記フレキシブル基板の上にバッファ層を形成し、
前記バッファ層とフレキシブル基板を、前記バッファ層及び前記フレキシブル基板が塑性変形する温度よりも高く、かつ電子デバイス形成工程での加熱温度よりも高いアニール温度まで加熱し、
前記バッファ層とフレキシブル基板を冷却し、
前記バッファ層とフレキシブル基板の上に、前記アニール温度を超えない温度で薄膜層状の電子デバイスを形成すること、を含む方法。 - 前記バッファ層が、厚さ200〜400nmの窒化シリコン層と、前記窒化シリコン層上に形成される厚さ200〜400nmの二酸化シリコン層となるように形成される、請求項1記載の方法。
- 前記加熱及び冷却の前に、後の薄膜堆積および処理のための基盤となるベース金属層を前記バッファ層の上に堆積させることをさらに含み、前記堆積の後に前記加熱・冷却ステップを実行する、請求項1又は2記載の方法。
- 請求項1〜3のいずれか一項に記載の方法で製造された、薄膜電子構造。
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US12/123,732 | 2008-05-20 | ||
US12/123,732 US8465795B2 (en) | 2008-05-20 | 2008-05-20 | Annealing a buffer layer for fabricating electronic devices on compliant substrates |
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JP2009283936A JP2009283936A (ja) | 2009-12-03 |
JP5623708B2 true JP5623708B2 (ja) | 2014-11-12 |
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US (2) | US8465795B2 (ja) |
JP (1) | JP5623708B2 (ja) |
KR (1) | KR101611811B1 (ja) |
TW (1) | TWI480955B (ja) |
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- 2009-05-15 JP JP2009118487A patent/JP5623708B2/ja active Active
- 2009-05-18 TW TW098116331A patent/TWI480955B/zh active
- 2009-05-20 KR KR1020090043873A patent/KR101611811B1/ko active IP Right Grant
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TW201003789A (en) | 2010-01-16 |
TWI480955B (zh) | 2015-04-11 |
US20090289333A1 (en) | 2009-11-26 |
JP2009283936A (ja) | 2009-12-03 |
KR20090121241A (ko) | 2009-11-25 |
US8465795B2 (en) | 2013-06-18 |
US20120205656A1 (en) | 2012-08-16 |
KR101611811B1 (ko) | 2016-04-12 |
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