JP5618298B2 - 白金めっき体 - Google Patents
白金めっき体 Download PDFInfo
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- JP5618298B2 JP5618298B2 JP2010268150A JP2010268150A JP5618298B2 JP 5618298 B2 JP5618298 B2 JP 5618298B2 JP 2010268150 A JP2010268150 A JP 2010268150A JP 2010268150 A JP2010268150 A JP 2010268150A JP 5618298 B2 JP5618298 B2 JP 5618298B2
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- Prior art keywords
- platinum
- plating
- film
- electroless
- plating film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims description 158
- 229910052697 platinum Inorganic materials 0.000 title claims description 85
- 238000007747 plating Methods 0.000 claims description 47
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 36
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 235000010323 ascorbic acid Nutrition 0.000 claims description 17
- 239000011668 ascorbic acid Substances 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 17
- 229960005070 ascorbic acid Drugs 0.000 claims description 15
- -1 platinum halide Chemical class 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 238000007772 electroless plating Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 24
- 239000007864 aqueous solution Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 5
- 239000002932 luster Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229940072107 ascorbate Drugs 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 description 1
- 108010022355 Fibroins Proteins 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- 229930003268 Vitamin C Natural products 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- KGRJUMGAEQQVFK-UHFFFAOYSA-L platinum(2+);dibromide Chemical compound Br[Pt]Br KGRJUMGAEQQVFK-UHFFFAOYSA-L 0.000 description 1
- SNPHNDVOPWUNON-UHFFFAOYSA-J platinum(4+);tetrabromide Chemical compound [Br-].[Br-].[Br-].[Br-].[Pt+4] SNPHNDVOPWUNON-UHFFFAOYSA-J 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000010378 sodium ascorbate Nutrition 0.000 description 1
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 description 1
- 229960005055 sodium ascorbate Drugs 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 235000019154 vitamin C Nutrition 0.000 description 1
- 239000011718 vitamin C Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Chemically Coating (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Description
本実施形態に係る無電解白金めっき液は、アスコルビン酸と白金ハロゲン化塩との2成分系からなることを特徴とする。
また、基材の形状は、特に制限されるものではなく、粉末、繊維、フィルム、成形体のいずれであってもよいが、導電性フィルムや導電性繊維等の製品を得るために、フィルム状、繊維状としておくことが好ましい。
20mM塩化パラジウム(II)と、0.1M塩化ナトリウムを含む水溶液(2.5ml)を、純水で94mlに希釈し、室温下で撹拌しながら、1%塩化ステアリルトリメチルアンモニウム水溶液(1ml)および40mM水素化ホウ素ナトリウム水溶液(5ml)を順次加え、一夜放置して、暗褐色透明なパラジウムヒドロゾル(100ml)を得た。ポリイミドフィルム(カプトン、厚さ125μm、2cm×4cm)を、1M水酸化ナトリウム水溶液中に、室温下で1分間浸漬した後、水洗し、さらに、上記のパラジウムヒドロゾル中に、室温下で30分間浸漬した後、水洗し、ポリイミドフィルムの表面にパラジウムを付与した。
得られためっき膜の断面を、透過型電子顕微鏡(TEM)により観察すると、図1に示すように、厚みが約50nmであり、また、数nmの白金粒子の凝集体であることがわかった。ここで、図1は、ポリイミドフィルム上に作製した白金めっき膜の断面TEM像を示す。図2は、めっき膜の高分解能TEM像であり、個々の白金微粒子の結晶構造に由来する格子像が観察された。
20mM塩化白金(IV)酸水溶液(2.5ml)および40mMクエン酸三ナトリウム水溶液(5ml)を、純水で100mlに希釈し、2時間還流加熱した後、冷却し、黒褐色透明な白金ヒドロゾル(100ml)を得た。ポリエステル布(日本規格協会、染色堅牢度試験用白布、2cm×4cm)を、0.1%塩化ステアリルトリメチルアンモニウム水溶液中に、室温下で数秒間浸漬した後、水洗し、さらに、上記白金ヒドロゾル中に、室温下で1時間浸漬した後、水洗・乾燥し、ポリエステル布の繊維表面に白金を付与した。
このめっき布は2.3mgの白金を含み、導電性を示した。めっき被膜は粘着テープによっても剥がれることなく、良好な密着性を示した。
20mM塩化パラジウム(II)と0.1M塩化ナトリウムを含む水溶液(2.5ml)を、純水で94mlに希釈し、蔗糖1gを溶解した後、室温下で撹拌しながら、40mM水素化ホウ素ナトリウム水溶液(5ml)を加え、暗褐色透明なパラジウムヒドロゾル(100ml)を得た。
Claims (4)
- 基材と、
前記基材上に設けられた白金めっき膜とを備え、
前記白金めっき膜は、粒径が3〜5nmの白金粒子の凝集体を備え、かつ、個々の白金粒子の結晶構造に由来する格子像が観察されることを特徴とする白金めっき体。 - 前記基材は、合成樹脂であることを特徴とする請求項1記載の白金めっき体。
- 前記白金めっき膜は、パラジウムが無電解めっき用触媒として付着された前記基材に対して、原料としての白金ハロゲン化塩、及び還元剤としてのアスコルビン酸を含む無電解白金めっき液を浸漬する無電解めっき法で作られることを特徴とする請求項1記載の白金めっき体。
- 前記白金めっき膜は、厚みが50nm以下であることを特徴とする請求項1又は3記載の白金めっき体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010268150A JP5618298B2 (ja) | 2010-12-01 | 2010-12-01 | 白金めっき体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010268150A JP5618298B2 (ja) | 2010-12-01 | 2010-12-01 | 白金めっき体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012117111A JP2012117111A (ja) | 2012-06-21 |
JP5618298B2 true JP5618298B2 (ja) | 2014-11-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010268150A Active JP5618298B2 (ja) | 2010-12-01 | 2010-12-01 | 白金めっき体 |
Country Status (1)
Country | Link |
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JP (1) | JP5618298B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3626857A4 (en) * | 2017-05-18 | 2021-07-14 | Japan Pure Chemical Co., Ltd. | SOLUTION FOR PLATING AUTOCATALYTIC PLATES AND PLATINUM FILM OBTAINED WITH THE SAID SOLUTION |
JP7573322B1 (ja) | 2023-10-30 | 2024-10-25 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与液、触媒付与方法、及び、無電解めっき方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0456939B1 (en) * | 1990-05-18 | 1995-02-22 | Japan Gore-Tex, Inc. | Hydrophilic porous fluoropolymer membrane |
AUPN705195A0 (en) * | 1995-12-08 | 1996-01-11 | Cardiac Crc Nominees Pty Limited | Electroless deposition of metallic coatings on non-conducting substrates |
JP3886000B2 (ja) * | 2002-03-08 | 2007-02-28 | 株式会社ビーエル | 金属コロイド粒子 |
JPWO2004066319A1 (ja) * | 2003-01-24 | 2006-05-18 | 東邦チタニウム株式会社 | 白金被覆粉末およびその製造方法、ならびに導電性ペースト |
JP2006169623A (ja) * | 2004-11-22 | 2006-06-29 | Hitachi Maxell Ltd | 機能性粒子及びその製造方法 |
JP2008056592A (ja) * | 2006-08-30 | 2008-03-13 | Kyoto Univ | 抗菌製品、抗菌処理液および抗菌処理方法 |
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2010
- 2010-12-01 JP JP2010268150A patent/JP5618298B2/ja active Active
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Publication number | Publication date |
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JP2012117111A (ja) | 2012-06-21 |
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