TW201136664A - Process for the surface-modification of flyash and industrial applications thereof - Google Patents
Process for the surface-modification of flyash and industrial applications thereof Download PDFInfo
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- TW201136664A TW201136664A TW99140999A TW99140999A TW201136664A TW 201136664 A TW201136664 A TW 201136664A TW 99140999 A TW99140999 A TW 99140999A TW 99140999 A TW99140999 A TW 99140999A TW 201136664 A TW201136664 A TW 201136664A
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- Prior art keywords
- fly ash
- ash particles
- particles
- titanium dioxide
- coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1868—Radiation, e.g. UV, laser
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B18/00—Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B18/04—Waste materials; Refuse
- C04B18/06—Combustion residues, e.g. purification products of smoke, fumes or exhaust gases
- C04B18/08—Flue dust, i.e. fly ash
- C04B18/082—Cenospheres
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B20/00—Use of materials as fillers for mortars, concrete or artificial stone according to more than one of groups C04B14/00 - C04B18/00 and characterised by shape or grain distribution; Treatment of materials according to more than one of the groups C04B14/00 - C04B18/00 specially adapted to enhance their filling properties in mortars, concrete or artificial stone; Expanding or defibrillating materials
- C04B20/10—Coating or impregnating
- C04B20/12—Multiple coating or impregnating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
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Abstract
Description
201136664 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於飛灰的表面改質方法及 其產業應用。更特別地,本發明係有關於一種用於飛 灰的表面改質方法,及其在使用於汽車產業以及催化 之導電聚合物、塗料(paints)、黏著劑(adhesives)、 塗封物(sealers)與樹脂,以及以鉛為主的複合物 (composites)上的產業應用。 【先前技術】 飛灰(固體並且中空的,亦知曉為空心微珠 (cenospheres)),是熱能設備的廢棄副產物,其包含有對環境 有害的氧化矽(Si〇2)、氧化鋁(Αία3)與鐵、鈣的氧化^ (CaO)、鎂,以及毒性重金屬(諸如砷、鉛以及鈷)並且在全世 界造成^要的處置問題。要這種廢棄㈣的首要缺點在 於目刚仍缺乏以飛灰為基礎的創意加值產品可供產業應 用。利用這種廢棄材料的次要缺點在於,可用來對飛灰粒子 的表面改質以使得它們可適用於產業應用的新方法仍然有 限(請參網站 http://edugreen.ter.res.in/expi〇re /air/ flyash.htm)。 一種用於將導電金屬(諸如銅(Cu)與銀(Ag))沉 積在飛灰粒子表面上的新無電鍍方法已被描述過。先 刖技藝需要藉由在具有氣化錫(II) (SnC12)的酸性水浴 (習知表面敏化浴)中攪拌飛灰粒子而令錫(11)離子 201136664 ⑴ (Sn2+)吸附至飛灰粒子的表面上 SnCl-y ~^ Sn~ + 2〇/·~ 接者在具有氣化絶心 GUIhPbCl2)的酸性水溶液(習 知的表面活化浴)中攪抹表I γ Μ 7| , +表面經敏化的飛灰粒子而利 用Pd團竊來活化飛灰极子的表面。201136664 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a surface modification method for fly ash and its industrial application. More particularly, the present invention relates to a surface modification method for fly ash, and to conductive polymers, paints, adhesives, sealers used in the automotive industry and catalysis. ) Industrial applications on resins, and on lead-based composites. [Prior Art] Fly ash (solid and hollow, also known as cenospheres), is a waste by-product of thermal energy equipment, which contains environmentally harmful cerium oxide (Si〇2) and alumina (Αία3). It is associated with iron, calcium oxidation (CaO), magnesium, and toxic heavy metals (such as arsenic, lead, and cobalt) and causes disposal problems around the world. The primary shortcoming of such abandonment (4) is that there is still a lack of fly-ash-based creative value-added products for industrial applications. A secondary disadvantage of using such waste materials is that new methods that can be used to modify the surface of fly ash particles to make them suitable for industrial applications are still limited (see http://edugreen.ter.res.in/) Expi〇re /air/ flyash.htm). A new electroless plating method for depositing conductive metals such as copper (Cu) and silver (Ag) on the surface of fly ash particles has been described. The prior art requires the adsorption of tin (11) ions 201136664 (1) (Sn2+) to fly ash particles by stirring fly ash particles in an acidic water bath (known surface sensitization bath) with vaporized tin (II) (SnC12). On the surface of SnCl-y ~^ Sn~ + 2〇/·~ The carrier is stirred in an acidic aqueous solution (known surface activation bath) with vaporized and derogatory GUIhPbCl2) (Table I Μ Μ 7| , + surface The sensitized fly ash particles utilize Pd cluster stealing to activate the surface of the fly ash pole.
Sn2++ Pd2+ Pd^ Sn4+ (2) 接著5在習知的益 φ x , “、、電鍵浴中授拌表面經活化的飛 灰粒子來塗鍍銅或銀,以斗 Λ生成表面經改質之以飛灰為 基礎的產物供產業應用,兮羽Α & 5亥習知的無電鍍浴是由具有 已溶解的金屬前驅物(諸t L, a * 丄 、巷如硝酸鹽、硫酸鹽或金屬的 氣化物)、安定劑(諸如、;西rh h //XT τ 咱石酸鈉鉀((NaK)C4H4〇6))、 pH控制劑(諸如氫氧化鈿 G納(NaOH)) ’以及還原劑(諸 如甲盤(HCHO))的驗性水溶液所構成。Sn2++ Pd2+ Pd^ Sn4+ (2) Next, 5 is coated with copper or silver by the activated fly ash particles in the well-known φ x , ", and the electric bond bath, and the surface of the buck is modified to Fly ash-based products for industrial applications, 兮羽Α & 5 Hai knows that the electroless plating bath is composed of dissolved metal precursors (t L, a * 丄, lanes such as nitrates, sulfates or metals) Gasification), stabilizer (such as; West rhh // XT τ sodium sulphate potassium ((NaK) C4H4 〇 6)), pH control agent (such as barium hydroxide G sodium (NaOH)) ' and reduction An aqueous solution of an agent such as a plate (HCHO) is used.
Cu2+ + 2e~ -» Cu° (3) 可以參考、、1由S知的無電錢方法而將銅沉積在雲母、石 墨、氧化摩2〇3)、氧切⑸〇2)以及二氧化鈦(Ti〇2)粒子 上’该無⑽方法湘知的Sn_pd催化織統與銅作為自 活化劑(Self-activator) ’〔請參下列文獻:s ShuWa and sCu2+ + 2e~ -» Cu° (3) can be deposited with mica, graphite, oxidized 2〇3), oxygen cut (5)〇2) and titanium dioxide (Ti〇) by reference to S. 2) On the particle, the (10) method is known as Sn_pd catalyzed weave with copper as a self-activator ([Please refer to the following documents: s ShuWa and s
Seal, Electroless Copper Coating of Zirconia utilizing Palladium Catalyst,,,J. Am. Cream. Soc. 86 (2)279-285 (2003) i S. Shukla, S. Seal, Z. Rahman, and K. Scammon, “Electroless Copper Coating of Cenospheres using Silver Nitrate Activator”,Mater. Lett. 57, 151-156 (2002), J. 201136664Seal, Electroless Copper Coating of Zirconia utilizing Palladium Catalyst,,,J. Am. Cream. Soc. 86 (2)279-285 (2003) i S. Shukla, S. Seal, Z. Rahman, and K. Scammon, “ Electroless Copper Coating of Cenospheres using Silver Nitrate Activator”, Mater. Lett. 57, 151-156 (2002), J. 201136664
Akesson,S. Seal,S. Shukla,and Z. Rahman,“Copper Copper Plating Process Control by SEM’’,Adv. Mater. Processes (AMP) 160(2), 33-35 (2002); S. Shukla, S. Seal, S. Schwarz, and D. Zhou, “Synthesis and Characterization of Nanocrystalline Silver Coating of Flyash Cenosphere Particles by Electroless Process’’,J. Nanosci. Nanotech. 1,417-424 (2001); S. Shukla, S. Seal, J. Akesson, R. Oder, R. Carter, and Z. Rahman, “Study of Mechanism of Electroless Copper Coating of Fly-Ash Cenosphere Particles”,App. Surf. Sci. 181(1-2) 35-50 (2001)〕。 先前技藝的第3個主要缺點在於,習知的錫-鉛催化劑系統 非常地昂貴。先前技藝的第4個主要缺點在於,沒有能夠敏 化飛灰粒子表面而讓它們塗鍍上金屬(諸如銅與銀)的替代方 法存在。先前技藝的第5個缺點在於,沒有能夠活化飛灰粒 子表面而讓它們塗鍍上金屬(諸如銅與銀)的替代方法存在 〔請參下列文獻:D. Deonath and P.K. Rohatgi,“Cast Aluminium Alloy Composites Containing Copper-Coated Ground Mica Particles”,J. Mater. Sci. 16(6),1599-1606 (1981); W. Lu, V.S. Donepudi, J. Prakash, J. Liu, and K. Amine,“Electrochemical and Thermal Behavior of Copper Coated Type MAG-20 Natural Graphite”,Electrochim. Acta 47(10), 1601-1606 (2002); J.F. Silvain, J.L. Bobet, and J.M. Heintz, “Electroless Deposition of Copper onto Alumina Sub-Micronic Powders and Sintering”,Composites A 33(10), 6 201136664 1387-1390 (2002);Y. Kobayashi, Υ. Tadaki, D. Nagao, and M. Konno, “Deposition of Gold Nanoparticles on Silica Spheres by Electroless Metal Plating Technique”,J. Colloid Interface Sci. 283(2), 601-604 (2005); K. Gopakumar, C. Pavithran, and P.K. Rohatgi, “Preparation of Copper Coated Titania Particles for Composites”,J. Mater. Sci. 15(6),1588-1592 (1980); K. Gopakumar, T.P. Murali, and P.K. Rohatgi, “Metal-Shell Char Particulate Composites using Copper Coated Particles”,J. Mater. Sci. 17(4), 1041-1048 (1982); K.G.K. Warrier and P.K. Rohatgi, “Mechanical,Electrical and Electrical Contact Properties of Copper Titania Composites”, J. Powder Metall. 29(1), 65 (1986)〕。 【發明内容】 有鑑於習知技術的諸多缺失,本發明的主要目的 乃在於,提供用於飛灰的表面改質方法及其產業應 用。 本發明的另一個目的在於,藉著二氧化鈦(Ti02) 光觸媒的溶膠-凝膠塗鍍經由新的表面敏化方法來對 飛灰粒子表面改質,其可供使用於諸如飛灰的銅-或 銀-鍍膜以及作為催化劑藉著將較長鏈的有機分子降 解成較小分子來淨化產業廢水的產業應用。 本發明的又一個目的在於,藉著沉積金屬團簇 (諸如銅(Cu ’自活化劑)、銀(Ag)、錯(pb)、金(Au)、 201136664 I白(Pt)或任種貝金屬經由新的表面活化步驟來對 經二氧化鈦(Ti〇2)·塗鍍的飛灰粒子表面改質。 本發明的更一個目的在於,藉著使用飛灰粒子經 由習知的無電鍍方法而將飛灰粒子的表面塗鍍上銅 (Cu)或銀(Ag),該等飛灰粒子是經由新的表面改質方 法而被表面敏化以及表面活化者,其可供各種不同的 產業應用,諸如製造以鉛(Pb)為主的複合物使用於汽 車產業,以及導電聚合物、塗料、黏著劑、塗封物以 及樹脂使用於電子裝置的電磁干擾(EMI)屏蔽。 發明之總論 因此,本發明提供一種用於飛灰的表面改質方法 及其產業應用。在本發明中,原有的飛灰粒子 (as-received flyash particles)首先藉著將這些粒子 經由/谷膠-凝膠(使用烧氧化物_前驅物溶解於無水醇 介裊中)塗鍍上一氧化鈦(Ti〇2)而予以表面敏化。接 著,經由受到連續紫外光(uv)輻射暴露在含有金屬離 子的驗性水溶液中擾拌表面經敏化的粒子,表面經敏 化的飛灰粒子藉由沉積金屬團簇(/M,)而被表面活 化’其中Μ可以是銅、銀、錯、金、细或任一種貴 金屬。繼而使用習知的無電鍍浴將銅或銀塗鍍在表面 經活化的飛灰粒子上。 在本發明的一個具體例中,一種用於飛灰的表面 改質方法’其中該方法包含有下列步驟: i於表面敏化浴内,在具有鈦(IV)酸正丙酯 201136664 (Ti(〇C3H7)4)(0.0:Ul 〇 M)的無水2丙酉享溶液(彻_颁 ml)中授掉飛灰粒子(1〇_5〇 g.L_i); 11同時製備具有無水2_丙醇(1〇〇_5〇〇叫以及 ^的溶液’其中水相對☆ Ti(〇C3H7)4的莫耳濃度的 最終比例是落在2至15的範圍内; .出豸步驟(ii)中所製備的溶液逐滴地加入步驟 ⑴中所製備的懸浮液内,其+2_丙醇相對於飛灰的 最終比例是落在25_100ml g·,的範圍内; iv攪拌如同步驟(iii)中所得到的懸浮液歷 2-6小時; v經由過濾將如同步驟(iv)中所得到的粒子從 溶液中分離出來並且在烘箱中於8〇_9(rc下乾燥歷時 J時以獲彳于經非晶-二氧化鈦(Ti〇2)塗錢的飛 灰粒子; vi在範圍介於400_60(rc的溫度下煅燒如同在 二驟(v)中所得到之塗鍍有非晶-二氧化鈦(以〇2)的飛 2子歷時—段範圍介於小時的期間,以獲得經 結晶-二氧化鈦(Ti〇2)塗鍍的飛灰粒子; νϋ在表面活化浴内,於具有金屬鹽類的水溶液 (呈pH〜10-12,使用水性Nh4〇h溶液(25_28%) 而獲付)中攪拌如同步驟(vi)中所得到的表面經敏化 的飛灰粒子; 受到連續紫外光(UV)、可見光或太陽輻射 而持續搜拌如同步驟(vii)中所得到的懸浮液歷時一 201136664 段介於4-6小時的期間,以使得金屬團簇沉積在表面 經敏化的飛灰粒子; ix經由過濾而將如同步驟(viii)中所得到之表 面經活化的^灰粒子分離出來,接著使用蒸餾水洗滌 數次而將非所欲的離子從表面移除; X在習知無電塗鍍浴(含有氫氧化鈉 (NaOH)(5-15 g.L-i)、酒石酸鉀納(NaKC4H4〇6)(3〇 6〇 g.L-i)以及金屬鹽類(1_1〇 g L·”的水性溶液)中攪拌 如同步驟(ix)中所得到之表面經活化的飛灰粒子; XI 慢慢地將 30-40 wt·% 曱醛(hch〇)(5-20 ml.L-i)作為還原劑加入如同步驟(χ)中所得到的溶液 内; y xii持續攪拌如同步驟(xi)中所得到的懸浮液直 到最開始的深藍色溶液褪色或者變成完全透明的; xiii經由過慮而將如同步驟(χϋ)中所得到之經 金屬塗鍍的飛灰粒子從懸浮液中分離開來並且在烘 箱中於80-9(TC下乾燥歷時1〇-12小時,以獲得表面 經改質的飛灰。 在本發明的另一個具體例中’將二氧化鈦(Ti〇2) 沉積在飛灰粒子表面上以供表面敏化的方法是選自 於由下列所構成的群組:濕式化學法(wet_chemical Process) ’ 包括共沉殿(co-precipitation)、溶膠-凝 勝、熱液(hydrothermal),以及微乳液(microemuision); 或任一種物理方法,包括濺鍍(sputtering)、化學蒸 201136664 氣沉積(chemical vapor dermdH 、 P〇Sltl〇n),以及熱蒸鍍 (thermal evaporation)。 在本發明的又一個具體例中,其十偏好溶膠-凝 膠法將二氧化鈦(Ti〇2)沉積於飛灰粒子的表面上。 在本發明的更-個具體例中,塗鍍在飛灰粒子表 面上的二氧化鈦(Ti〇2)是藉著測量並且比對原有以 及表面經敏化之飛灰粒子的光催化活性來確認其存 在,其涉及亞甲藍(MB)染料受到連續紫外光(uv卜轄 射暴露而在水溶液中分解的速率,它被視為一種經由 溶膠-凝膠而沉積的二氧化鈦(Ti〇2)數量的度量法。 在本發明的又另一個具體例中,用於表面活化步 驟的金屬鹽類是選自於由銅(Cu)、銀(Ag)、鉛(pd) ' 金(An)、鉑(Pt)或任何其他貴金屬的硝酸鹽、氣鹽或 硫酸鹽。 L 在本發明的又另一個具體例中,就表面活化而言 Μ烏好鋼(Cu)以及銀(Ag)金屬鹽類。 在本發明的更一個具體例中,就在習知無電鍍浴 中的Cu以及Ag塗鍍而言偏好銅(Cu)以及銀(Ag)金 屬鹽類(CuS〇4以及AgN〇3)。 在本發明的又更一個具體例中,步驟(vii)中的金 屬鹽類濃度是在範圍0.1-l.Og.L-i。 I;.; 在本發明的又另—個具體例中,其中¥驟(viii) 中所使用的輻射是連續紫外光(UV) (λ = 200-400 nm)、可見光(λ = 400-800 nm)或太陽光(入=200-800 201136664 nm)。 在本發明的又另一個具體例中,如同步驟(xUi) 中所得到之表面經改質的飛灰包含有(a)飛灰粒子; (b)光觸媒用於表面敏化,選自於由氧 化鋅(ZnO)、氧化錫(Sn〇2)、二氧化鈦(Ti〇2)、硫化 鋅(ZnS)、硫化鎘(Cds)或任何其他半導體材料所構成 的群組;⑷金屬團鎮(OHO wt.%)供用於表面活 7,沉積在表面經敏化的飛灰粒子上,選自於銅、銀、 金、鉑或任何其他貴金屬所構成的群組,以及 群組。 選自於由銅以及銀所構成的 飛户在i t明的又另一個具體例中’該表面經改質的 \ °亥飛灰粒子是由具有氧化矽(Si〇2)(40-50 (c^mr^(Al2〇3)(40·50 職%)、舞的氧化物 合物所構成敗/〇)以及二氧化欽(Ti〇2)(2·4社%)的混 飛灰在另一個具體例中,該表面經改質的― 在太称 人拉?是固體或中空的(空心微珠)。 飛灰,其中偏好_f 1中,該表面經改質的 光觸媒。 —氧化鈦(Tl〇2)作為用於表面敏化的 飛灰= =另—個具體例中,該表面經改質的 成較小的有以错著將較長鏈的有機分子降解 戍刀子來淨化工業廢水。 201136664 在本發明的又另一個具體例中,該表面經改賢 飛灰用於諸如製造導電聚合物、塗料、黏著劑1 : 物與樹脂供用於電子裝置的電磁干擾(EMI)屏蔽,^ 及用方' a車產業中以雜為主的複合物的產業應用。 在本發明的又另一個具體例中,飛灰粒子經過 的表面改質方法而在表面形態、表面化學以及表面社 構上的變化是經由掃描式電子顯微鏡(SEM)、1射 的忐散分析(EDX)、X-射線光電子光譜儀(xps)以及 X-射線繞射(XRD)來監測。 在本發明的又另一個具體例中,該表面經改質的 飛灰是導電的,而原有的飛灰是非導電的。 【實施方式】 本發明提供一種用於飛灰的表面改質方法,如同 圖1中所呈現之?方塊圖,及其產業應用。該方法包含 有經由在表面欽化浴中攪拌10_50 g.u的飛灰粒子 而敏化該等飛灰粒子的表面,其中逐滴地混合無水 100-500 ml之具有0.01·1〇 M異丙氧化欽(ιν)的2_ 丙醇溶液以及100-500 ml的2_丙醇水溶液 (尺=2_15,其中水相對於Τί(〇^7)4的莫耳濃度比例 是以來表示)。攪拌所形成的懸浮液歷時2_6小 時。接著,經由過濾將粒子從溶液中分離開來並且在 烘箱中於80-90°C下乾燥歷時1〇_12小時。經非晶-二 氧化鈦(Ti〇2)塗鍍的飛灰粒子接著在voodoo艽下锻 201136664 燒歷時1-4小時,以獲得經結晶-二氧化鈦(Ti〇2)塗鍍 的飛灰粒子,如同在圖9b中所示。 接著’表面經敏化的飛灰粒子經由在含有〇.1-1.0 g.L-i三水合硝酸鋼(n)(cu(N〇3)2.3H2〇)或硝酸銀 (AgN03)之水溶液(呈pH〜1〇_12,使用水性NH4〇H 溶液而得到)的表面活化浴中攪拌而被表面活化。受 到連續紫外光(UV) (λ =200_4〇0 nm)、可見光(λ =400-800 nm)和太陽輻射(λ =200_800 暴露,持續 攪拌懸浮液歷時4-6小時’以使得Cu或Ag的團簇 >儿積在飛灰粒子的表面上。經由過濾將表面經活化的 飛灰粒子分離開來並且以水洗務數次,以將非所欲的 離子從表面移除’如同圖9c中所示。 為了塗鍍銅(或銀)’在含有氫氧化鈉 (NaOH)(5-15 g.L-i)、NaKC4H4〇6 (30-60 g.L-i)以及 五水合硫酸銅(II)(CuS〇4.5H2〇,1-10 g.L-i)之水溶液 的S知無電鑛浴中授拌5新的表面經活化的飛灰粒 子。將5-20爪1.1^的3〇-4〇wt.%HCH〇作為還原劑 慢慢地加入這個懸浮液内。持續地攪拌所形成的懸浮 液直到最開始的深藍色溶液褪色或變成完全透明 的。接著,經由過濾將經銅塗鍍的飛灰粒子分離開來 並且在烘箱中於80-10CTC下乾燥過夜,如同圖9d中 所示》 下列實施例僅供例示說明本發明的步驟,並且不 應被理解為限制本發明的範圍。 201136664 實施例1 在本實施例中,Ti(OC3H7)4以及無水2-丙醇是 購自於Alfa Aesar (印度之商品名);NH4OH (含量 25-28 wt.%)、NaKC4H4〇6,以及硝酸銀(AgN03)是購 自於 S.D. Fine Chemicals Ltd.(印度之公司); Cii(N〇3)2.3H2〇是購自於 CDH Analytical Reagent (印度之公司);氫氧化鈉(NaOH)(含量97%)是購自於Akesson, S. Seal, S. Shukla, and Z. Rahman, "Copper Copper Plating Process Control by SEM'', Adv. Mater. Processes (AMP) 160(2), 33-35 (2002); S. Shukla, S. Seal, S. Schwarz, and D. Zhou, "Synthesis and Characterization of Nanocrystalline Silver Coating of Flyash Cenosphere Particles by Electroless Process', J. Nanosci. Nanotech. 1, 417-424 (2001); S. Shukla, S. Seal, J. Akesson, R. Oder, R. Carter, and Z. Rahman, "Study of Mechanism of Electroless Copper Coating of Fly-Ash Cenosphere Particles", App. Surf. Sci. 181(1-2) 35 -50 (2001)]. A third major drawback of the prior art is that conventional tin-lead catalyst systems are very expensive. A fourth major disadvantage of the prior art is that there is no alternative to the ability to sensitize the surface of the fly ash particles by coating them with metals such as copper and silver. A fifth disadvantage of the prior art is that there is no alternative to the ability to activate the surfaces of fly ash particles by coating them with metals such as copper and silver (see D. Deonath and PK Rohatgi, "Cast Aluminium Alloy" Composites Containing Copper-Coated Ground Mica Particles”, J. Mater. Sci. 16(6), 1599-1606 (1981); W. Lu, VS Donepudi, J. Prakash, J. Liu, and K. Amine, “Electrochemical And Thermal Behavior of Copper Coated Type MAG-20 Natural Graphite”, Electrochim. Acta 47(10), 1601-1606 (2002); JF Silvain, JL Bobet, and JM Heintz, “Electroless Deposition of Copper onto Alumina Sub-Micronic Powders And Sintering", Composites A 33(10), 6 201136664 1387-1390 (2002); Y. Kobayashi, Υ. Tadaki, D. Nagao, and M. Konno, “Deposition of Gold Nanoparticles on Silica Spheres by Electroless Metal Plating Technique J. Colloid Interface Sci. 283(2), 601-604 (2005); K. Gopakumar, C. Pavithran, and PK Rohatgi, “Preparation of Copper Coated Titania Particles for Co Mposites", J. Mater. Sci. 15(6), 1588-1592 (1980); K. Gopakumar, TP Murali, and PK Rohatgi, "Metal-Shell Char Particulate Composites using Copper Coated Particles", J. Mater. Sci 17(4), 1041-1048 (1982); KGK Warrier and PK Rohatgi, "Mechanical, Electrical and Electrical Contact Properties of Copper Titania Composites", J. Powder Metall. 29(1), 65 (1986)]. SUMMARY OF THE INVENTION In view of the many deficiencies of the prior art, it is a primary object of the present invention to provide a surface modification method for fly ash and an industrial application thereof. Another object of the present invention is to modify the surface of fly ash particles by a new surface sensitization method by sol-gel coating of titanium dioxide (Ti02) photocatalyst, which can be used for copper such as fly ash - or Silver-coated and industrial applications as catalysts for purifying industrial wastewater by degrading longer chain organic molecules into smaller molecules. Still another object of the present invention is to deposit a metal cluster (such as copper (Cu 'self-activator), silver (Ag), wrong (pb), gold (Au), 201136664 I white (Pt) or any kind of shellfish. The surface of the titanium dioxide (Ti〇2)-coated fly ash particles is modified by a new surface activation step. A further object of the invention is to use fly ash particles via conventional electroless plating methods. The surface of the fly ash particles is coated with copper (Cu) or silver (Ag), which are surface sensitized and surface activated by a new surface modification method, which can be used in various industrial applications. For example, the manufacture of lead (Pb)-based composites for the automotive industry, as well as conductive polymers, coatings, adhesives, sealants, and electromagnetic interference (EMI) shielding used by resins for electronic devices. The present invention provides a surface modification method for fly ash and its industrial application. In the present invention, the original as-received flyash particles are first passed through the / gluto-gel ( Use burnt oxide _ precursor dissolve Surface sensitization is carried out by coating with titanium oxide (Ti〇2) in an anhydrous alcohol medium. Then, by exposure to continuous ultraviolet (uv) radiation in an aqueous solution containing metal ions, the surface is sensitized. The particles, the surface sensitized fly ash particles are surface-activated by depositing metal clusters (/M,), where Μ can be copper, silver, gold, fine, or any precious metal. The electroless plating bath coats copper or silver on the surface activated fly ash particles. In one embodiment of the invention, a method for surface modification of fly ash, wherein the method comprises the following steps: In the surface sensitization bath, the fly ash is given in an anhydrous 2 propylene solution (Poly) in the presence of n-propyl titanium (IV) acrylate 201136664 (Ti(〇C3H7)4) (0.0:Ul 〇M). Particles (1〇_5〇g.L_i); 11 simultaneously prepared a solution with anhydrous 2-propanol (1〇〇_5 〇〇 and ^) where the water is relative to the molar concentration of ☆ Ti(〇C3H7)4 The final ratio falls within the range of 2 to 15. The solution prepared in the step (ii) is added dropwise to the solution prepared in the step (1). In the float, the final ratio of +2_propanol to fly ash falls within the range of 25-100 ml g·, iv is stirred as the suspension obtained in step (iii) for 2-6 hours; v via filtration The particles obtained in the step (iv) are separated from the solution and dried in an oven at 8 〇 9 (drying at rc for J) to obtain a fly from the amorphous-titanium dioxide (Ti〇2). Ash particles; vi calcined at a temperature in the range of 400_60 (rc) as in the second step (v) coated with amorphous-titanium dioxide (with 〇2) flying 2 sub-period range of hours During the period, a fly ash particle coated with crystal-titanium dioxide (Ti〇2) is obtained; νϋ is in a surface activation bath, and an aqueous solution having a metal salt (pH~10-12, using an aqueous Nh4〇h solution (25_28) %) and the obtained fly ash particles sensitized as the surface obtained in the step (vi); continuously subjected to continuous ultraviolet light (UV), visible light or solar radiation as obtained in the step (vii) The suspension lasts a period of 201136664 between 4-6 hours to allow metal cluster deposition The surface is sensitized fly ash particles; ix is separated by filtration from the activated ash particles obtained in step (viii), followed by washing with distilled water several times to remove undesired ions from the surface X is a conventional electroless plating bath (containing sodium hydroxide (NaOH) (5-15 gL-i), potassium tartrate (NaKC4H4〇6) (3〇6〇gL-i) and metal salts (1_1〇) The surface of the g L·" aqueous solution is stirred as activated fly ash particles obtained in step (ix); XI slowly 30-40 wt.% furfural (hch〇) (5-20 ml. Li) is added as a reducing agent to the solution obtained in the step (χ); y xii is continuously stirred as the suspension obtained in the step (xi) until the first dark blue solution fades or becomes completely transparent; xiii passes through The metal-coated fly ash particles obtained in the step (χϋ) are separated from the suspension and dried in an oven at 80-9 (TC for 1 〇 to 12 hours to obtain a surface modification). Quality fly ash. In another embodiment of the present invention, a method of depositing titanium dioxide (Ti〇2) on the surface of fly ash particles for surface sensitization is selected from the group consisting of wet chemical processes (wet_chemical process) ) ' includes co-precipitation, sol-gel, hydrothermal, and microemuision; or any physical method, including sputtering, chemical steaming 201136664 gas deposition (chemical Vapor dermdH, P〇Sltl〇n), and thermal evaporation. In still another embodiment of the present invention, a ten-preferential sol-gel method deposits titanium dioxide (Ti〇2) on the surface of the fly ash particles. In a more specific embodiment of the invention, the titanium dioxide (Ti〇2) coated on the surface of the fly ash particles is confirmed by measuring and comparing the photocatalytic activity of the original and surface sensitized fly ash particles. Its presence, which relates to the rate at which methylene blue (MB) dye is decomposed in aqueous solution by continuous ultraviolet light (UV exposure), which is considered as a quantity of titanium dioxide (Ti〇2) deposited via sol-gel. In still another embodiment of the present invention, the metal salt used in the surface activation step is selected from the group consisting of copper (Cu), silver (Ag), lead (pd) 'gold (An), platinum (Pt) or any other precious metal nitrate, gas salt or sulfate. L In yet another embodiment of the invention, in view of surface activation, the steel (Cu) and the silver (Ag) metal salts. In a further embodiment of the invention, copper (Cu) and silver (Ag) metal salts (CuS〇4 and AgN〇3) are preferred in the case of Cu and Ag coating in conventional electroless plating baths. In still another embodiment of the present invention, the metal salt concentration in the step (vii) is in the range of 0.1 to 1.0 g. In another embodiment of the present invention, wherein the radiation used in the step (viii) is continuous ultraviolet light (UV) (λ = 200-400 nm), visible light (λ = 400-800) Nm) or sunlight (in = 200-800 201136664 nm). In still another embodiment of the invention, the surface-modified fly ash obtained as in step (xUi) comprises (a) fly ash particles (b) Photocatalyst for surface sensitization, selected from zinc oxide (ZnO), tin oxide (Sn〇2), titanium dioxide (Ti〇2), zinc sulfide (ZnS), cadmium sulfide (Cds) or any other a group of semiconductor materials; (4) a metal cluster (OHO wt.%) for surface activity 7, deposited on surface sensitized fly ash particles, selected from copper, silver, gold, platinum or any other precious metal The group formed by the group and the group selected from the group consisting of copper and silver are in another specific example of the it's 'the surface of the modified \ ° Haifei ash particle is composed of yttrium oxide (Si〇2) (40-50 (c^mr^(Al2〇3) (40.50%), the oxide compound of the dance constitutes the defeat / 〇) and the bismuth (Ti〇2) (2 ·4%%) Mixed fly ash In another specific example, the surface is modified to be too solid or hollow (hollow microbeads). Fly ash, where preference _f 1 , the surface is modified Photocatalyst - Titanium oxide (Tl〇2) as fly ash for surface sensitization = = another specific example, the surface is modified to be smaller and deviate to degrade the longer chain organic molecules A knife is used to purify industrial wastewater. 201136664 In still another embodiment of the present invention, the surface is used for manufacturing electromagnetic conductive materials, coatings, adhesives, and resins for electromagnetic interference of electronic devices. (EMI) shielding, ^ and the industrial application of the compound-based compound in the vehicle industry. In still another embodiment of the present invention, the change in surface morphology, surface chemistry, and surface texture of the surface modification method of the fly ash particles is performed by scanning electron microscopy (SEM), 1 shot separation analysis. (EDX), X-ray photoelectron spectroscopy (xps) and X-ray diffraction (XRD) are used for monitoring. In still another embodiment of the invention, the modified fly ash of the surface is electrically conductive, and the original fly ash is non-conductive. [Embodiment] The present invention provides a surface modification method for fly ash, as shown in Fig. 1. Block diagram, and its industrial application. The method comprises sensitizing the surface of the fly ash particles by stirring 10 to 50 gu of fly ash particles in a surface aging bath, wherein 100-500 ml of anhydrous water is mixed dropwise with 0.01·1 〇M isopropanol (ιν) 2-propanol solution and 100-500 ml of 2-propanol aqueous solution (foot = 2_15, wherein the ratio of water to Τί(〇^7) 4 is expressed since the ratio). The resulting suspension was stirred for 2-6 hours. Next, the particles were separated from the solution by filtration and dried in an oven at 80-90 ° C for 1 〇 12 hours. The fly ash particles coated with amorphous-titanium dioxide (Ti〇2) are then burned under voodoo 2011 201136664 for 1-4 hours to obtain crystallization-titanium dioxide (Ti〇2) coated fly ash particles, as in This is shown in Figure 9b. Then, the surface sensitized fly ash particles are passed through an aqueous solution containing 〇.1-1.0 gL-i nitrate steel (n) (cu(N〇3)2.3H2〇) or silver nitrate (AgN03) (pH~) The surface activation bath of 1〇_12, obtained using an aqueous NH4〇H solution, was agitated to be surface-activated. Subjected to continuous ultraviolet (UV) (λ = 200_4 〇 0 nm), visible light (λ = 400-800 nm) and solar radiation (λ = 200_800 exposure, continuous stirring of the suspension for 4-6 hours) to make Cu or Ag Clusters> accumulate on the surface of the fly ash particles. The surface is activated by separating the activated fly ash particles and washing with water several times to remove undesired ions from the surface as in Figure 9c Shown. For coating copper (or silver) 'with sodium hydroxide (NaOH) (5-15 gL-i), NaKC4H4〇6 (30-60 gL-i) and copper (II) sulfate pentahydrate (II) 〇4.5H2〇, 1-10 gL-i) of the aqueous solution of S known non-electrical mineral bath to mix 5 new surface activated fly ash particles. 5-20 claws 1.1^ 3〇-4〇wt.% HCH is slowly added to the suspension as a reducing agent. The resulting suspension is continuously stirred until the initial dark blue solution fades or becomes completely transparent. Next, the copper coated fly ash particles are separated by filtration. Open and dry in an oven at 80-10 CTC overnight, as shown in Figure 9d. The following examples are merely illustrative of the steps of the present invention, and It is not to be construed as limiting the scope of the invention. 201136664 Example 1 In this example, Ti(OC3H7)4 and anhydrous 2-propanol were purchased from Alfa Aesar (trade name of India); NH4OH (content 25- 28 wt.%), NaKC4H4〇6, and silver nitrate (AgN03) are purchased from SD Fine Chemicals Ltd. (India); Cii(N〇3)2.3H2 is purchased from CDH Analytical Reagent (India) ); sodium hydroxide (NaOH) (content 97%) is purchased from
Hi Media Laboratories (印度之公司);CuS04.5H20 (含量 98.5%)是購自於 Nice Laboratory Reagent (印 度之公司);以及HCHO (37-41 w/v 〇/〇)是購自於Nice Chemicals (印度之公司)。呈粉末形式的飛灰粒子是 得自於 Unicorn Thermal Power Plant (位於塔米納 杜之印度公司)。所有的化學品以及粉末使用作為原 有狀態而沒有任何進一步的淨化。 在新的奉面敏化浴(由具有〇.〗Μ (最終濃度) 1^(〇03117)4的125 1111無水2-丙醇溶液所組成)中授拌 5.〇 g的飛灰粒子。將125 ml的2-丙醇與水(尺=2)溶 液逐滴地加入這個懸浮液中,並且攪拌所形成的懸浮 液歷時4小時。接著經由過濾將粒子從溶液中分離出 來並且在烘箱中於80°C下乾燥歷時12小時。繼而在 4〇〇°C下煅燒經非晶-二氧化鈦(Ti〇2)塗鍍的飛灰粒子 歷時2小時,以得到經結晶-二氧化鈦(Ti〇2)塗鍍的飛 灰粒子。接著,經由在新的表面活化浴(含有〇.48 g Cu(N03)2.3H2〇的水溶液’呈pH〜10.5,使用水性 201136664Hi Media Laboratories (india company); CuS04.5H20 (content 98.5%) is purchased from Nice Laboratory Reagent (india company); and HCHO (37-41 w/v 〇/〇) is purchased from Nice Chemicals ( Indian company). The fly ash particles in powder form were obtained from the Unicorn Thermal Power Plant (india company in Tamina Du). All chemicals and powders were used as they were without any further purification. In the new sensitizing bath (composed of 125 1111 anhydrous 2-propanol solution with 〇. Μ (final concentration) 1^(〇03117) 4), the fly ash particles of 5. g were mixed. 125 ml of a solution of 2-propanol and water (feet = 2) was added dropwise to the suspension, and the resulting suspension was stirred for 4 hours. The particles were then separated from the solution via filtration and dried in an oven at 80 ° C for 12 hours. The fly ash particles coated with amorphous-titanium dioxide (Ti〇2) were then calcined at 4 ° C for 2 hours to obtain fly ash particles coated with crystal-titanium dioxide (Ti 2 ). Next, via a new surface activation bath (aqueous solution containing 48.48 g Cu(N03)2.3H2 ’], pH ~10.5, using water 201153664
nh^oh》谷液而得到)中攪拌來表面活化表面經敏化 、舭火粒子文到連續紫外光(UV)輻射(λ =200-400 rnn)暴露持續鮮料液歷時4小時,以使得做為自 活化劑的銅沉積在飛灰粒子的表面上。表面經活化的 粒子經由過濾而被分離出來並且以蒸餾水洗滌數次 以將非所欲的離子從表面移除。接著,在含有NaOH (10 g.L 1)、NaKC4H4〇6 (5〇 g.L-y 以及 CuS04.5H20 (4.0 g.L ^之水溶液的f知無電鑛浴中㈣表面經活 化的飛灰粒子。將12心·1的HCHO作為還原劑緩 慢地加入至這個懸浮液中,並且持續地攪拌所形成的 懸泮液直到最開始的深藍色溶液褪色或變成完全透 明的。經Cu塗鑛的飛灰粒子繼而經由過遽而被分離 出來並且接著在烘箱中於8〇t下乾燥過夜。 原有飛灰粒子以及經銅塗鍍的飛灰粒子的表面 形態以及粒徑分布是使用電子顯微鏡(S l JSM-5600LV,日本) a枣)在15 kV下操作來測定;而總化 學組成是EDX分析來敎。存在於原有飛灰粒子以 及經銅塗㈣飛灰粒子中的不同相是使用χ_射線繞 射(XRD) (Phillips ’日本)來鑑定。寬能譜.掃描^ 射線繞射(XRD)分析典型是在1〇_8〇。的範圍内 使用Cu Ka X-輻射(入=^.542 A)來進行。經過新的表 面敏化以及表面活化步驟,飛灰粒子在表面化學上的Nh ^ oh "grain solution" was stirred to surface-activated surface sensitized, bonfire particles to continuous ultraviolet (UV) radiation (λ = 200-400 rnn) exposed continuous fresh liquid for 4 hours, so that Copper as a self-activator is deposited on the surface of the fly ash particles. The surface activated particles are separated by filtration and washed several times with distilled water to remove undesired ions from the surface. Next, the fly ash particles activated on the surface of the surface of the quaternary electroless mineral bath containing NaOH (10 gL 1 ), NaKC4H4 〇6 (5〇gL-y and CuS04.5H20 (4.0 gL ^). The HCHO of 1 is slowly added as a reducing agent to this suspension, and the resulting suspension is continuously stirred until the initial dark blue solution fades or becomes completely transparent. The Cu-coated fly ash particles are then passed through. It was separated and dried overnight in an oven at 8 ° t. The surface morphology and particle size distribution of the original fly ash particles and the copper-coated fly ash particles were measured using an electron microscope (S l JSM-5600LV, Japan) a date) is measured at 15 kV; the total chemical composition is EDX analysis. The different phases present in the original fly ash particles and the copper coated (four) fly ash particles are χ-ray diffraction ( XRD) (Phillips 'Japan) to identify. Wide-spectrum. Scanning ray diffraction (XRD) analysis typically uses Cu Ka X-radiation (in = ^.542 A) in the range of 1 〇 8 〇. Carry out. After new surface sensitization and surface activation steps, fly ash particles Surface chemistry
變化疋使用X-射線光電子光譜儀(xps)(VGChange 疋 using X-ray photoelectron spectroscopy (xps) (VG
Tech ESCA 3000,英國)在1〇·9托的底面墨力下使 201136664 用 Mg Ka X-輻射(1253 6 eV,線寬 〇 7 6”於 2〇〇 w 的電C下來I測。少量的飛灰粒子在xps分析的各 個步驟之後被移除,以了解飛灰粒子的鋼鍍膜的過 程,。全譜以及高解析度窄能譜這兩者是以5〇eV的電 子通此=及55。的掠出角來紀錄以達到最大光譜解 析度。窄能譜以及高解析度掃描是針對鈦(2p)以及銅 (2P3/2) ^進行,以了解這些元素在新的表面改質過程 期間於氧化狀態方面的變化。窄能譜掃描是使用 peak-fit軟體(XPSPEAK 41)來解迴旋,以顯示出鈦以 及銅存在於飛灰粒子表面上的不同形式。金(Au) 4f7"在84.0±〇·ι eV處的結合能(BE)被用來校正光譜 儀的BE標尺。在284.6 eV處使用參照外源碳譜的烴 4伤之C (Is) BE的BE標尺來小心地排除任何由樣 扣所產生的電荷位移。在移除背景後使用高斯/洛仁 子峰形表執行非線性最小平方曲線擬合法。 為T確認在飛灰粒子的表面敏化之後有二氧化 鈦(Ti〇2)鍍膜存在,藉由連續攪拌以及暴露於連續紫 外光(UV)輻射(λ =200-400 nm)下監測MB染料在含 有不同粉末粒子的水溶液中的分解來研究原有以及 表面經敏化的飛灰粒子的光觸媒活性。7 5 的MB染料完全地溶解在75ml的蒸餾水中。接著,Tech ESCA 3000, UK) Under the ink force of 1〇·9 Torr, the 201136664 was measured with Mg Ka X-radiation (1253 6 eV, line width 〇7 6” at 2〇〇w of electricity C. The fly ash particles are removed after each step of the xps analysis to understand the process of the steel coating of the fly ash particles. The full spectrum and the high resolution narrow energy spectrum are both 5 〇 eV electrons = 55 The sweep angle is recorded to achieve maximum spectral resolution. Narrow energy spectra and high resolution scans are performed for titanium (2p) and copper (2P3/2) ^ to understand these elements during the new surface modification process. Changes in oxidation state. Narrow energy spectrum scanning uses the peak-fit software (XPSPEAK 41) to solve the convolution to show the different forms of titanium and copper present on the surface of the fly ash particles. Gold (Au) 4f7 " at 84.0 The binding energy (BE) at ±〇·ι eV was used to correct the BE scale of the spectrometer. Use the BE scale of the hydrocarbon 4 in the exogenous carbon spectrum to inspect C (Is) BE at 284.6 eV to carefully exclude any The charge displacement generated by the sample buckle. Execute the Gauss/Luoren sub-peak table after removing the background. Nonlinear least square curve fitting method. It was confirmed by T that a titanium dioxide (Ti〇2) coating exists after surface sensitization of fly ash particles, by continuous stirring and exposure to continuous ultraviolet (UV) radiation (λ = 200-400). The photocatalytic activity of MB dyes in aqueous solutions containing different powder particles was monitored under nm) to study the photocatalytic activity of the original and surface-sensitized fly ash particles. The MB dye of 7 5 was completely dissolved in 75 ml of distilled water.
將0.4 g.L·1的原有以及表面經敏化的飛灰粒子分散 以製備兩種不同的懸浮液。該等懸浮液是藉由在黑暗 (未暴露於任一種輻射)中攪拌歷時工小時以使得MB 201136664 染料的表面吸附穩定下來而被校正。 在連續磁性攪拌下,使用含有15W電子管(飛利 浦G15T8)作為連續紫外光(UV)源的Rayonet光反應 器(荷蘭)以連續紫外光(UV)光照射安定的水性懸浮 液’該連續紫外光(UV)源發射波長範圍為200-400 nm (對應於3.07-6.14 e的光能範圍)的連續紫外光 (uv)-輕射。在連續紫外光(uv)輻射暴露之後,以各 30分鐘的時間間隔從連續紫外光(uv)箱中取出3 ml 的懸浮液歷時共計150分鐘的連續紫外光(uv)輻射 暴露,以獲得連續紫外光(UV)可見光吸收光譜。 使用離心機(R23, Remi Instruments IndiaThe original and surface sensitized fly ash particles of 0.4 g.L·1 were dispersed to prepare two different suspensions. The suspensions were corrected by stirring in the dark (not exposed to any of the radiation) for a period of hours to stabilize the surface adsorption of the MB 201136664 dye. Under continuous magnetic stirring, a stable aqueous suspension was irradiated with continuous ultraviolet (UV) light using a Rayonet photoreactor (Netherlands) containing a 15W electron tube (Philips G15T8) as a continuous ultraviolet (UV) source. UV) The source emits continuous ultraviolet (uv)-light shots with a wavelength range of 200-400 nm (corresponding to the optical energy range of 3.07-6.14 e). After exposure to continuous ultraviolet (uv) radiation, 3 ml of the suspension was taken from a continuous ultraviolet (uv) tank at intervals of 30 minutes for a total of 150 minutes of continuous ultraviolet (uv) radiation exposure to obtain continuous Ultraviolet (UV) visible light absorption spectrum. Using a centrifuge (R23, Remi Instruments India
Ltd·印度公司)將粒子從樣品懸浮液中過濾出來,而 渡液是使用紫外光(uv)可見光光譜儀(Shimadzu, UV-2401 PC’日本)來檢驗,以研究MB染料的分解。 在200-800 nm的範圍内取得MB染料溶液的吸收光 譜作為連續紫外光(uv)輻射暴露時間的函數。Mb染 料溶液在656 nm處的吸收波峰(A)強度被視為Mb染 料(C)的殘餘濃度的一種量度法。在暴露於連續紫外 光(UV)-|§射之前,未添加粉末粒子的mb染料溶、夜 的連續紫外光(UV)-可見光吸收光譜亦被紀錄作為對 應於起始MB染料濃度(C。)的參考光譜。接著,使用 具有下列形式的關係式而獲得經標準化的殘餘Mb 染料濃度, ' 201136664Ltd. India Company) filtered the particles from the sample suspension, which was examined using an ultraviolet (uv) visible light spectrometer (Shimadzu, UV-2401 PC' Japan) to study the decomposition of the MB dye. The absorption spectrum of the MB dye solution was obtained as a function of continuous ultraviolet (uv) radiation exposure time in the range of 200-800 nm. The absorption peak (A) intensity of the Mb dye solution at 656 nm is considered as a measure of the residual concentration of the Mb dye (C). The mb dye-soluble, night continuous ultraviolet (UV)-visible absorption spectrum of the powder without the addition of powder particles was also recorded as corresponding to the initial MB dye concentration (C.) before exposure to continuous ultraviolet (UV)-[§. Reference spectrum. Next, a standardized residual Mb dye concentration is obtained using a relationship having the following form, '201136664
C〇 ) MB (4)C〇 ) MB (4)
A 、th,ie:〇 J(、5(vm 亦在未添加粉末粒子的情況下進行光催化實驗 來確認MB染料在沒有飛灰粒子存在下受到連續紫 外光(UV)輻射暴露的安定性。在這個情況下,即便在 照射樣品歷時總計15〇分鐘之後’起始的mb染料濃 度(C0)仍維持不變。 原有飛灰粒子的典型電子顯微鏡(SEM)顯微照 片呈現於® 2⑷中。在f子顯微鏡(SEM)影像中可以 看到非球形以及球形兩種粒子。球形粒子的大小估笞 落在5’ _的範圍内。一個球形粒子的χ_射線能 散肿X)分析呈現於圖2(b)中。原有的飛灰粒子大部 分看起來含有氧化銘(Al2〇3)(48 〇赠%)以及氧化矽 (Sl〇2)(48.Gwt.%),有微量的 CaQ(1.4wt.%)以及二 氧=鈦(Ti〇2)(2.6 wt.%)。經銅(Cu)塗鍍的飛灰粒子 的電子顯微鏡(SEM)影像騎於圖3⑷中。在較 =率下(圖㈣’清楚看到Cu_錄膜的似桿形;(長 ΐ中二及見度〜100-200 nm),在原有的飛灰粒 子中沒有觀察到的。 :經標準化的殘餘MB染料漠度方 =續紫外光(U,射暴露時間的函數 :表:經敏化的飛灰粒子所得到者,呈現於圖V:) 中,而所得到用以決定、的對應曲線呈 中。…續紫外光(uv)轄射暴露,注意到原有的飛) 201136664 灰粒子在水溶液中對於分解MB染料展現出光催化 活性。注意到表面經敏化的飛灰粒子的光催化活性要 比原有飛灰粒子的還高。關於原有以及表面經敏化的 飛灰粒子的/:㈣估算為0.005分4以及〇 〇〇8分q。因 此,二氧化鈦(Ti〇2)在原有飛灰粒子的表面上的溶膠 :凝^鍍膜會增強其光催化活性。因而,光催化實驗 證實於新的表面敏化浴中攪拌飛灰粒子之後在飛灰 粒子表面有成功的二氧化鈦(Ti〇2)鍍膜^ *氧化鋁 (A1203) 在新的表面敏化、表面活化以&無電錢銅鍛膜步 驟之後,飛灰粒子表面的寬能譜掃描x_射線光電子 光譜儀(XPS)分析顯示於圖5中。在圖5(a)中,由原 有飛灰粒子表面所得到的寬能譜掃描光譜顯示有鋁 (A1)、矽(Si)、鈣(Ca)以及氧(〇)族的存在(在74 6、 103.4、347·5以及532.0 eV的BE位準處分別有對應 白“呂(2P)、,矽(2P)、鈣(2p)以及氧(1 s)波峰)。這暗‘ 著,原有飛灰的表面主要是由氧化紹(AW3)、氧化 石夕(Si〇2)以及Ca〇的混合氧化物所組成。在新的表面 敏化步驟之後(圖5(b)),可以在459〜的BE位準處 看到應於Ti (2P)的額外波峰。這暗示*,在新的表 面敏化浴中攪拌粒子之後’飛灰粒子塗錢有二氧化鈦 (Tl〇2) ’與光催化實驗(圖4)是一致的。 表面經敏化的飛灰粒子,當在新的表面活化浴中 檀拌時,在935 eV處顯示出有Cu (2ρ)波峰存在(圖 20 201136664 :),暗示著Cu·族存在於飛灰粒 ,以及物比較顯示,於新的表 : 皮峰強度上有降低,其伴隨著心:飛4 ^子表面上。表面經活化的飛灰粒子,在I電 二:拌之後’在Cu(2p)波峰強度上顯示有增加二 5時在Tl (2p)波峰強度上有降低(圖5(d))。 針對經過新的表面敏化以及表面活化 ^子’有關 Ti(2p)在 452_471eV 的 be^ ^能譜掃描XPS分析呈現於圖6中。針對原, :面經敏化、表面經活化以及經Cu塗鍍的飛灰粒 ^i^rT' 458" 458*3 ^ 457-9 ev^ ^ P3/2 BE位準’暗示著二氧化鈦(Ti〇2)存在於 飛火粒子的表面上。在不同處理步驟之後於Ti如2 波峰強度上的變化亦在圖6中注意到。儘管在寬能雄 掃描分析中沒有偵測到Ti (2?)波峰# -謝以析似乎暗示有微量的二氧化二= 方;原有飛灰粒子的表面(圖6⑷)。然而,Ti如2波 峰的強度在將原有飛灰粒子於新的表面敏化浴中攪 拌之後會增加(圖6(b)) ’其與寬能譜掃描分析(圖 5(b))以及光催化實驗(圖4)相符。受到連續紫外光 (UV)輻射暴露在新的表面活化浴中攪拌表面經敏化 的飛灰粒子之後(圖6(c)) ’以及隨後在習知的盔電鍍 浴(圖6(d))中,在Ti2p3/2波峰強度上注意到有漸進 式降低,其亦與寬能譜掃描分析(圖5(c)以及5(d)) 一 201136664 致。 射聂ΐ ί:在新的表面活化浴受到連續紫外光(uv)輻 知無電鑛浴㈣表面經敏化的飛 04 BF ρθ侍的關於CU 2PV2波峰在927-940 eV 以及w/r内的窄能譜掃描XPS分析呈現於圖7⑷ )〇c:u2P3/2光譜的解迴旋顯示出在932 7、 叮处以及935.1 6^/的BE位準處有3個次波峰存在, 二與出現在飛灰粒子表面的Μ、。。以及 7/U )2族有關。針對表面經活化的飛灰粒子(圖 ⑷)’ CU〇的相對數量似乎要比Cu〇與Cu(OH)2還 多然而’在習知無電鑛浴中授摔表面經活化的粒子 之後三CU〇的數量相對於Cu〇與Cu(〇H)2增加。因 此,寬能譜掃描以及窄能譜掃描xps分析確認原有 飛灰粒子經由新的表面敏化以&表面活化步驟而成 功地塗鍍銅。 二氧化鈦(Ti〇2)是一種具有寬能帶間隙(〜3 〇_3 2 eV)的半導體,需要適當波長的連續紫外光(uv)輻射 暴露以產生電子-電洞對。若連續紫外光(uv)所產生 的電子-電洞對的半衰期是高的,那麼它們可能會逃 離粒子表面並且參與氧化還原反應。習知上這個方 式被應用在使用二氧化鈦(Ti〇2)的光催化,透過形 成〇H自由基以及〇H自由基隨後的攻擊而將較長鍵 的有機分子(存在於空氣或水中)降解成較小的分 子,如同在圖8(a)中所簡述般。相反地,在本發明 22 201136664 的這個實施例中’在半導體二氧化鈦(Ti〇2)中受到 連續备'外光(UV)轄射暴露所產生的電子-電洞對已應 用來藉著還原中間物銅複合物(諸如[Cu(NH3)2] + )以 Cu團簇來表面活化飛灰粒子(圖8(b))。 [Cu{NH3)2T+e- -> Cu\a(,x)+2NHhaq)⑼ 因此’在這個表面活化的新步驟中,由溶膠-凝 膠所塗鍍的二氧化鈦(Ti〇2)光催化劑受到連續紫外 光(UV)輻射暴露而有效地被應用作為新的表面敏化 劑,而Cu〇作為自活化劑用以在習知無電鍍浴中獲得 飛灰粒子的Cu鍍膜。 經由新的表面敏化以及表面活化步驟,原有飛灰 粒子的銅鍍膜的整個途徑被歸納於圖9中。在^值 為2以及煅燒溫度為4〇〇。(:的情況下,原有飛灰粒子 百先在新的表面敏化浴中受到表面敏化,以得到經溶 膠-凝膠塗鍍的結晶二氧化鈦(Tic,2)(第9(a)以及9(b) 圖)。結果,當表面經敏化的飛灰粒子受到連續紫外 光(UV)輻射暴露在新的表面活化浴中攪拌時,它們在 經凝膠-溶膠塗鍍的半導體二氧化鈦(Ti〇2)内經由圖 8中所述的途徑產生電子-電洞對。產生的電子接著有 效地被用來將中間物銅(Cu)_複合物還原成Cu〇 (方 転式5) ’其隨後沉積在飛灰粒子的表面上。在新的表 面'舌化步驟期間,Cu◦以及Cu(〇H)2與Cu〇亦一起 f飛灰粒子的表面上形成。在表面活化步驟期間,CU 私可此以團簇的形式沉積(第9(c)圖),因為可以在寬 201136664 能譜掃描XPS分析中偵測到位在這層下的二氧化鈦 (Τι〇2)(第5(c)圖)。在習知的無電鍍浴中,更多的cu〇 以類似桿的形態沉積在飛灰粒子的表面(圖3(b)),使 得銅鍍膜更為連續(圖9⑷),其依次減低在X-射線光 電子光忐儀(XPS)分析中所偵測到的二氧化鈦(Ti〇2) 數量(圖5(d))。 、總之,在這個實施例中,新的表面敏化以及表面 活化方法已經成功地證明經由使用銅作為自活化劑 的習知無電鍍方法以銅來塗鍍飛灰粒子的表面。 實施例2 在本實施例中’在具有0.1 Μ (最終濃度) Ti(〇C3H7)4的125 ml無水2-丙醇溶液中攪拌5 〇 g 的原有飛灰粒子。將125 ml之具有無水2_丙醇以及 水的溶液逐滴地加入至這個懸浮液中。兩種不同的懸 浮液是以不同值(2以及5)來製備以供比對。攪拌 所形成的懸浮液歷時4小時,而接著經由過濾將粒子 從溶液中分離出來並且在8〇〇c下乾燥歷時12小時。 經非晶-二氧化鈦(Ti〇2)塗鍍的飛灰粒子接著在6〇〇 °C下煅燒歷時2小時,以獲得經結晶-二氧化鈦(Ti〇2) 塗鍍的飛灰粒子。該等表面經敏化的飛灰粒子接著經 由在新的表面活化浴(含有〇 48 8丄一 的水性 溶液,呈pH〜10.5,使用水性NH4〇h溶液而獲得) 中授拌而被表面活化。該懸浮液受到連續紫外光(uv) 輻射(λ = 200-400 ηιη)暴露而連續地攪拌歷時4小時, 24 201136664 以使得做為活化劑的*銀沉積在飛灰粒子的表面上。 該等表面經活化的飛灰粒子經由過濾而被分離出來 並且以水洗滌數次,以將非所欲的離子從表面移除。 接著在習知的無電鍍浴(含有Na〇H (i〇 g ^)、 NaKC4H4〇6 (50 g.L-i)以及 CuS〇4 5h2〇 (4 〇 g l ^ 的水溶液)中攪拌該等表面經活化的飛灰粒子。將乜 ml.L-i的HCHO作為還原劑緩慢地加入這個懸浮液 中,並且持續地攪拌所形成的懸浮液直到最開:的深 藍色溶液褪色或變成完全透明的。經銅塗鍍的飛灰粒 子接著經由過濾而被分離出來並且繼而在烘箱中於 80°C下乾燥過夜。 ' 在本實施例中’在新的表面敏化步驟期間,於 600 C下煅燒經非晶-二氧化鈦(Ti〇2)塗鍍的飛灰粒 子,該溫度略高於實施例^中所使用的溫度(4〇〇 °C )。此外,使用Ag團簇代替如同實施例2中所驗證 的銅團簇(自活化劑)來表面活化飛灰粒子。 [Ag(NH2)2] +e Ag°{ods)+2NH^a(/)⑹ 如同針對原有飛灰粒子(在600°C下煅燒歷時2 小時之後)以及經銅塗鍍的飛灰粒子所得到的,在 10-80°的2-Θ範圍内使用銅κα X-輕射(入= 1.542 所進行的寬能譜掃描χ_射線繞射(XRD)圖形呈現於 第10圖中。在第l〇(a)圖中’可以看到原有的飛灰粒 子(在600 °C下煅燒之後)本質上是結晶。藉由與 JCPDS卡# 83-0539比對繞射圖形鑑定出對應於矽(石 25 201136664 英)的繞射波峰。第10(b)圖以及第10(c)圖中的繞射 圖形,其為使用經銅塗鍍的飛灰粒子所得到者(其使 用兩種不同R值(2以及5)而被表面敏化),顯示對應 於(Ul)Cu以及(220)Cu的額外波峰,其等是藉由與 JCPDS卡# 04-0839比對所得到的繞射圖形而被鑑定 出(第10(d)圖)。因此,χ_射線繞射(XRD)分析清楚地 顯示使用銀作為表S活化劑的原有飛灰粒子的成功 Cu-鍍膜。因為主要波峰(111)cu的較高強度,與以r 值為2經表面敏化的飛灰粒子相較之下,以r值為$ 經表面敏化的飛灰粒子(第释)圖)可能展現出較大 的銅塗鍍厚度(第10(b)圖)。 一個球形之原有以及經銅塗鍍的飛灰粒子 的典型電子顯微鏡(SEM)影像呈現於第u (a)圖1、 及第U(b)圖中,其中在飛灰粒子的平凡表面型心 因為銅塗鍵的變化是清楚可見的。銅-鑛膜看起 由球形次微米大小卜胤200崎)的Cu粒子A, th, ie: 〇J (, 5 (vm also carried out photocatalytic experiments without adding powder particles to confirm the stability of MB dye exposure to continuous ultraviolet (UV) radiation in the absence of fly ash particles. In this case, the initial mb dye concentration (C0) remains unchanged even after a total of 15 minutes of irradiation of the sample. A typical electron microscopy (SEM) photomicrograph of the original fly ash particles is presented in ® 2(4) Non-spherical and spherical particles can be seen in the FF image. The size of the spherical particles is estimated to fall within the range of 5' _. The χ-ray energy of a spherical particle is dissipated X) In Figure 2(b), most of the original fly ash particles appear to contain oxidized inscriptions (Al2〇3) (48% donated) and cerium oxide (Sl〇2) (48.Gwt.%) with trace amounts. CaQ (1.4 wt.%) and dioxin = titanium (Ti〇2) (2.6 wt.%). Electron microscopy (SEM) images of copper (Cu) coated fly ash particles are shown in Figure 3 (4). Under the ratio = (Fig. 4), it is clear that the shape of the Cu_ film is rod-like; (the long sputum and the visibility ~ 100-200 nm), not in the original fly ash particles. Observed: Standardized residual MB dye inversion = continuous ultraviolet light (U, function of exposure time: Table: obtained by sensitized fly ash particles, presented in Figure V:), The corresponding curve obtained for decision is in the middle....Continuous ultraviolet (uv) radiation exposure, noting the original fly) 201136664 Ash particles exhibit photocatalytic activity for decomposing MB dye in aqueous solution. Note surface sensitization The photocatalytic activity of the fly ash particles is higher than that of the original fly ash particles. The /: (4) of the original and surface sensitized fly ash particles is estimated to be 0.005 minutes 4 and 〇〇〇 8 points q. Therefore, Titanium dioxide (Ti〇2) on the surface of the original fly ash particles: the condensed coating will enhance its photocatalytic activity. Therefore, photocatalytic experiments confirmed the stirring of fly ash particles in the new surface sensitization bath after the fly ash particles Successful titanium dioxide (Ti〇2) coating on the surface ^ Alumina (A1203) Wide-energy-scanning x-ray on the surface of fly ash particles after new surface sensitization, surface activation, & Photoelectron spectrometer (XPS) analysis is shown in Figure 5. In Fig. 5(a), the broad spectrum scanning spectrum obtained from the surface of the original fly ash particles shows the presence of aluminum (A1), strontium (Si), calcium (Ca) and oxygen (〇) groups ( At the BE levels of 74 6 , 103.4 , 347 · 5 and 532.0 eV , there are corresponding white "Lu (2P), 矽 (2P), calcium (2p) and oxygen (1 s) peaks respectively. The surface of the original fly ash is mainly composed of mixed oxides of AW3, Oxidation (Si〇2) and Ca〇. After the new surface sensitization step (Fig. 5(b)), additional peaks due to Ti (2P) can be seen at the BE level of 459~. This implies that * after stirring the particles in a new surface sensitizing bath, the fly ash particles are coated with titanium dioxide (Tl〇2)' in agreement with the photocatalytic experiment (Fig. 4). Surface sensitized fly ash particles, when sand mixed in a new surface activation bath, showed a Cu (2ρ) peak at 935 eV (Fig. 20 201136664:), suggesting that the Cu family exists in fly ash. The grain, as well as the material comparison shows that in the new table: there is a decrease in the peak intensity, which is accompanied by the heart: flying 4 ^ on the surface of the sub. The surface-activated fly ash particles showed a decrease in the Tl (2p) peak intensity when the increase in Cu(2p) peak intensity was shown to decrease in the intensity of the Cu(2p) peak (Fig. 5(d)). The XPS analysis of the be ^ ^ spectral scan of Ti(2p) at 452_471 eV with new surface sensitization and surface activation ^' is shown in Fig. 6. For the original,: surface sensitization, surface activation and Cu-coated fly ash particles ^i^rT' 458" 458*3 ^ 457-9 ev^ ^ P3/2 BE level ' implies titanium dioxide (Ti 〇 2) is present on the surface of the flying particles. Changes in the intensity of Ti such as 2 peaks after different processing steps are also noted in Figure 6. Although the Ti (2?) peak was not detected in the Kuannongxiong scan analysis, it seems to suggest that there is a trace of the dioxide dioxide = the surface of the original fly ash particles (Fig. 6(4)). However, the intensity of Ti such as 2 peaks increases after the original fly ash particles are stirred in a new surface sensitizing bath (Fig. 6(b)) 'which is compared with the broad spectrum scanning analysis (Fig. 5(b)) and The photocatalytic experiment (Fig. 4) was consistent. After being exposed to continuous ultraviolet (UV) radiation in a new surface activation bath to agitate the surface sensitized fly ash particles (Fig. 6(c))' and subsequently in the conventional helmet plating bath (Fig. 6(d)) In the Ti2p3/2 peak intensity, a gradual decrease is noted, which is also related to the broad spectrum scanning analysis (Fig. 5(c) and 5(d)), 201136664.射聂ΐ ί: In the new surface activation bath is subjected to continuous ultraviolet light (UV) to illuminate the surface of the electroless mineral bath (4). The surface of the CU 2PV2 peak is in the 927-940 eV and w/r. The narrow-spectral scanning XPS analysis is presented in Fig. 7(4). The 解c:u2P3/2 spectrum's untwisted rotation shows that there are three sub-peaks at 932, 叮 and at the BE level of 935.1 6^/, and two appear in The surface of the fly ash particles. . And 7/U) 2 related. The relative amount of surface-activated fly ash particles (Fig. (4)) 'CU〇 appears to be more than Cu〇 and Cu(OH)2. However, 'three CUs after the surface-activated particles are given in the conventional electroless mineral bath. The amount of niobium is increased relative to Cu(R) and Cu(〇H)2. Therefore, broad-spectrum scanning and narrow-spectral scanning xps analysis confirmed that the original fly ash particles were successfully coated with copper via a new surface sensitization & surface activation step. Titanium dioxide (Ti〇2) is a semiconductor with a wide band gap (~3 〇_3 2 eV) that requires continuous ultraviolet (uv) radiation exposure at the appropriate wavelength to produce an electron-hole pair. If the half-life of electron-hole pairs produced by continuous ultraviolet light (uv) is high, they may escape the particle surface and participate in the redox reaction. Conventionally, this method has been applied to the photocatalysis using titanium dioxide (Ti〇2), which decomposes longer-chain organic molecules (present in air or water) by subsequent formation of 〇H radicals and 〇H radicals. The smaller molecule is as outlined in Figure 8(a). Conversely, in this embodiment of the invention 22 201136664 'electron-hole pairs generated by continuous preparation of external light (UV) radiation exposure in semiconductor titanium dioxide (Ti〇2) have been applied by means of reduction intermediate The copper complex (such as [Cu(NH3)2] + ) surface-activates the fly ash particles with Cu clusters (Fig. 8(b)). [Cu{NH3)2T+e- -> Cu\a(,x)+2NHhaq)(9) Therefore 'in this new step of surface activation, titanium dioxide (Ti〇2) light coated by sol-gel The catalyst is effectively applied as a new surface sensitizer by continuous ultraviolet (UV) radiation exposure, and Cu is used as a self-activator to obtain a Cu coating of fly ash particles in a conventional electroless plating bath. Through the new surface sensitization and surface activation steps, the entire route of the copper coating of the original fly ash particles is summarized in Figure 9. The value was 2 and the calcination temperature was 4 Torr. (In the case of the original fly ash particles, the surface is sensitized in a new surface sensitizing bath to obtain sol-gel coated crystalline titanium dioxide (Tic, 2) (Section 9(a) and 9(b) Fig.) As a result, when the surface sensitized fly ash particles are subjected to continuous ultraviolet (UV) radiation exposure to a new surface activation bath, they are gel-sol coated semiconductor titanium dioxide ( An electron-hole pair is generated within Ti〇2) via the route described in Figure 8. The resulting electrons are then effectively used to reduce the intermediate copper (Cu)-complex to Cu(〇5) It is subsequently deposited on the surface of the fly ash particles. During the new surface 'tongue step, Cu ◦ and Cu(〇H) 2 are also formed on the surface of the fly ash particles together with the Cu 。. During the surface activation step, CU privately deposits this in the form of clusters (Fig. 9(c)) because titanium dioxide (Τι〇2) located under this layer can be detected in the broad 201136664 spectral scanning XPS analysis (section 5(c) Figure). In the conventional electroless plating bath, more cu〇 is deposited on the surface of the fly ash particles in a rod-like form (Fig. 3(b)). The copper coating is more continuous (Fig. 9(4)), which in turn reduces the amount of titanium dioxide (Ti〇2) detected in the X-ray photoelectron spectrometer (XPS) analysis (Fig. 5(d)). In this embodiment, new surface sensitization and surface activation methods have successfully demonstrated coating the surface of fly ash particles with copper via conventional electroless plating methods using copper as a self-activator. Example 2 In this example Mix 5 〇g of the original fly ash particles in a 125 ml anhydrous 2-propanol solution with 0.1 Μ (final concentration) Ti(〇C3H7)4. 125 ml of anhydrous 2-propanol and water The solution was added dropwise to this suspension. Two different suspensions were prepared for comparison at different values (2 and 5). The resulting suspension was stirred for 4 hours, and then the particles were filtered from The solution was separated and dried under 8 ° C for 12 hours. The fly ash particles coated with amorphous-titanium dioxide (Ti〇2) were then calcined at 6 ° C for 2 hours to obtain crystallized - Titanium dioxide (Ti〇2) coated fly ash particles. These surfaces are sensitized The fly ash particles are then surface activated by mixing in a new surface activation bath (aqueous solution containing 〇48 8 , pH~10.5, using an aqueous NH4〇h solution). The suspension is subjected to continuous UV Light (uv) radiation (λ = 200-400 ηιη) is exposed and continuously stirred for 4 hours, 24 201136664 to cause *silver as an activator to deposit on the surface of the fly ash particles. The particles are separated by filtration and washed several times with water to remove undesired ions from the surface. Next in the conventional electroless plating bath (containing Na〇H (i〇g ^), NaKC4H4〇6 ( The surface-activated fly ash particles were stirred in 50 gL-i) and CuS〇4 5h2〇 (4 〇 gl ^ in water). The HCHO of 乜ml.L-i was slowly added as a reducing agent to this suspension, and the resulting suspension was continuously stirred until the most open: dark blue solution faded or became completely transparent. The copper coated fly ash particles were then separated by filtration and then dried overnight in an oven at 80 °C. In the present embodiment, during the new surface sensitization step, amorphous-titanium dioxide (Ti〇2) coated fly ash particles were calcined at 600 C, which was slightly higher than that used in the examples. Temperature (4 ° ° C). Further, Ag clusters were used instead of the copper clusters (self-activators) as verified in Example 2 to surface-activate fly ash particles. [Ag(NH2)2] +e Ag°{ods)+2NH^a(/)(6) as for the original fly ash particles (after calcination at 600 ° C for 2 hours) and copper-coated fly ash particles The obtained broad-spectral scanning χ-ray diffraction (XRD) pattern using copper κα X-light shot (in = 1.542) in the 2-Θ range of 10-80° is presented in Fig. 10. In the first graph (a), it can be seen that the original fly ash particles (after calcination at 600 ° C) are essentially crystalline. By comparing with the JCPDS card # 83-0539, the diffraction pattern is identified corresponding to Diffraction peak of 矽(石25 201136664英). The diffraction pattern in Fig. 10(b) and Fig. 10(c), which is obtained by using copper-coated fly ash particles (they use two kinds) Different surface values (2 and 5) are surface sensitized), showing additional peaks corresponding to (Ul)Cu and (220)Cu, which are diffractions obtained by comparison with JCPDS card #04-0839 The pattern was identified (Fig. 10(d)). Therefore, χ-ray diffraction (XRD) analysis clearly shows the successful Cu-coating of the original fly ash particles using silver as the S activator. Because of the main peak (111)cu High strength, compared to fly ash particles with surface sensitization with r-value of 2, surface sensitized fly ash particles (expressed) with r value of $ may exhibit large copper plating Thickness (Fig. 10(b)). A typical electron microscopy (SEM) image of a spherical and copper-coated fly ash particle is presented in Figure u (a) Figure 1 and Figure U(b), where the virgin surface of the fly ash particles The heart is clearly visible because of the change in the copper bond. Copper-mineral film looks like Cu particles from spherical submicron size dip 200 崎)
成。經銅-塗鏟的飛灰粒子射線能散分析(EDX 顯示於第u⑷圖中,當與在第2(b)圖中對應於 飛灰粒子的波峰比對時,其顯示出鋼的額外波峰。; 因此,原有較粒子成功地藉由㈣2以及 種不同的R值來表面敏化它們’以及在銀作 3 化劑的情況下使用60CTC段燒溫度而塗鍍上:Λ 實施例3 又 在本實施例中 原有的飛灰粒子是以R值為15 26 201136664 來表面敏化、在60(TC下煅燒以及使用銀(Ag)來表面 活化。所有其他的處理參數維持類似於實施例2中所 述者β在這些處理條件下觀察到原有飛灰粒子的成功 銅鍍膜’其是藉由在f知無電鍍浴中於數分鐘内的顏 色變化(從最開始的深藍色至完全透明)來表明。亦藉 由X-射線繞射(XRD)分析確認鋼_鍍膜的存在(第12 圖)。觀察到繞射圖形類似於第1〇(b)圖以及第2 圖中所呈現者。 實施例4 原有的飛灰粒子亦是以介於3〇·15〇的較高r值 予以表面敏化。但是,在這些處理條件下,注意到有 it,鈦⑽2)粉末形成,…二氧化鈦 =私末的均質沉殿,無法經由溶膠-凝膠在飛灰粒 子表面上得到成功的:氧化鈦(Ti◦相膜。 總二’如上述般成功地經由實施例卜2以及3 可^著使用·本發明的新表面敏化以及表 到的錢在原有的飛灰粒子表面上。亦注意 灰粒子在其表面上含有足量的二氧 新的表面敏化步驟。魏物),可以略過 本發明的主要優點為: 金屬鍍ί,特:,:敏化飛灰粒子的新途徑以獲得 膜特別疋鋼或銀的金屬錢膜。 I提供一種表面活化飛灰粒子的新途徑以獲得 27 201136664 金屬鍍臈,特別是銅或銀的金屬鍍膜。 ^ 3.針對作為表面敏化劑之經溶膠-凝膠處理的二 氧化鈦(Ti〇2)提供一種新應用以供應用飛灰做為1 值產物。 ° 士栏!/尤使用二氧化欽(Ti〇2)的薄膜作為光催化劑而 :赫:—種呈飛灰粒子形式的新基質(基質),以藉由 化有機分子降解成較短鏈的有機分子來淨 化工業廢水。 r 面改tt由使用經濟上可實施且對環境友善的新表 面改貝步驟,針對飛灰提供一 衣to make. Fluorescence analysis of fly ash particles by copper-coated shovel (EDX is shown in Figure u(4), which shows additional peaks of steel when compared to peaks corresponding to fly ash particles in Figure 2(b) Therefore, the original particles were successfully surface-sensitized by (4) 2 and different R values, and coated with 60 CTC segmentation temperature in the case of silver as a catalyst: 实施 Example 3 The original fly ash particles in this example were surface sensitized with an R value of 15 26 201136664, calcined at 60 (TC under TC, and surface activated with silver (Ag). All other processing parameters were maintained similar to Example 2 The above-mentioned β observed the successful copper coating of the original fly ash particles under these treatment conditions, which is a color change in a few minutes by the known electroless plating bath (from the initial dark blue to completely transparent) To show that the presence of steel_coating was also confirmed by X-ray diffraction (XRD) analysis (Fig. 12). The diffraction pattern was observed to be similar to that shown in Fig. 1(b) and Fig. 2 Example 4 The original fly ash particles are also surfaced at a higher r value of 3 〇·15 〇. Sensitization. However, under these treatment conditions, it was noted that it, titanium (10) 2) powder formed, ... titanium dioxide = sterling homogeneous sink, can not be successful on the surface of fly ash particles via sol-gel: titanium oxide (Ti◦ phase film. The total two' can be successfully used as described above through the examples 2 and 3. The new surface sensitization of the present invention and the money of the present invention are on the surface of the original fly ash particles. The particle contains a sufficient amount of dioxin surface sensitization step on its surface. Weiwu), the main advantages of the invention can be skipped: Metal plating, special:,: A new way to sensitize fly ash particles The film is specially made of steel or silver metal film. I provides a new way to surface-activate fly ash particles to obtain 27 201136664 metal rhodium, especially copper or silver metal coating. ^ 3. For the surface sensitizer Sol-gel treated titanium dioxide (Ti〇2) provides a new application for the supply of fly ash as a 1-value product. ° 士士!/ Especially using a film of TiO2 as a photocatalyst: :-New in the form of fly ash particles A matrix (matrix) that purifies industrial wastewater by degrading organic molecules into shorter chain organic molecules. r Surface modification tt provides a new surface modification step for the fly ash by using an economically implementable and environmentally friendly new surface. clothes
屏蔽應用之導電聚合物、塗料=製造用於職I 樹脂的可能性。 2者劑、塗封物以及 6.提供一種以加值 環玲右宝— A ’ 式増高重複使用對 衣兄有害的飛灰的可能性。 28 201136664 【圖式簡單說明】 第1圖呈現說明新的表面改質方法的方塊圖, 該表面改質方法涉及新的表面敏化以及表面活化方 法以在習知的無電鍍浴中將飛灰粒子的表面塗錢諸 如銅(Cu)或銀(Ag)的金屬。'R'定義為水相^於 Ti(OC3H7)4的莫耳濃度比例。 、 第2圖呈現原有飛灰粒子的典型電子顯微鏡 (SEM)影像(a)以及EDX分析(b)。飛灰粒子是由諸如Conductive polymers and coatings for shielding applications = the possibility of manufacturing O-resin. 2 agents, sealants and 6. Provide a possibility to re-use the fly ash that is harmful to the brothers with the bonus ring Lingyou-A'. 28 201136664 [Simple Description of the Drawings] Figure 1 presents a block diagram illustrating a new surface modification method involving new surface sensitization and surface activation methods to fly fly ash in conventional electroless plating baths. The surface of the particles is coated with a metal such as copper (Cu) or silver (Ag). 'R' is defined as the molar concentration ratio of the aqueous phase to Ti(OC3H7)4. Figure 2 shows a typical electron microscope (SEM) image (a) and EDX analysis (b) of the original fly ash particles. Fly ash particles are made up of
Si〇2 (40-50 wt.%)、Al2〇3 (40-50 wt.%)、Ca〇 (1_3 wt.%)以及二氧化鈦(Ti〇2)(2_4 wt %)的氧化物混合 物所構成。 σ 第3圖呈現在無電鍍浴中攪拌表面經敏化(尺< 以及T = 400t)以及表面經活化(Cu作為自催化劑)的 飛灰粒子之後,經Cu塗鍍的飛灰粒子在較低(a)以及 較高(b)的放大率下的典型電子顯微鏡(SEM)影像。在 (b)中看到Cu-族的似·桿生長。 第4圖呈現針對原有(♦)以及表面經敏化 ()(尺=2以及T = 40(TC )的飛灰粒子,經標準化的殘餘 mb染料濃度作為連續紫外光(uv)_輕射暴露時間的 函數的典型變化⑷’ α及用m表觀一級反應速 率常速(&w)的曲線(b)。 第5圖呈現經過新的表面敏化以及表面活化步 驟的飛灰粒子表面的寬能譜掃描xps分析。(岣原有 的;(b)表面經敏化的(R==2以及T = 4〇〇t);⑷表面經 29 201136664 =的(CU作為自催化劑);以及⑷經Cu塗鑛的飛 及粒子。 第6圖呈現使用經過新的表面敏化以及表面活 二灰粒子所得到的解迴旋xps窄能譜掃描 P。光。曰⑷原有的;(b)表面經敏化的(尺=2以及 丁=響〇;⑷表面經活化的(Cu作為自催化劑);以 及(d)經Cu塗鑛的飛灰粒子。 第7圖呈現使用經過新的表面改質方法的飛灰 粒子所得到的解迴㉟xps窄能譜掃描Cu 2p"2光 譜。⑷表面經活化的(Cu作為自催化劑)以及(b)經Cu 塗鑛的飛灰粒子。在⑷與(b)巾,⑴Cu。;⑻Cu〇 ; 以及(iii) Cu(〇H)2 〇 …第8圖呈現叉到連續紫外光(uv)輻射暴露使用 半導脰一氧化鈦(Ti〇2)的光催化途徑0)以及使用經 溶膠-凝膠處理的二氧化鈦(Ti〇2)作為新的表面敏化 劑供隨後飛灰粒子的表面活化與Cu_鑛膜用的提議 途徑(b)。 第9圖呈現提供新的表面改質方法的圖示的簡 圖,該方法涉及新的表面敏化以及表面活化方法而在 無電鍍浴中將飛灰粒子的表面塗鍍諸如Cu*八§的 金屬。(1)原有的飛灰粒子表面;(ii)飛灰粒子之經溶 膠-凝膠塗鍍二氧化鈦(Ti〇2)的表面(新的表面敏化步 驟广(iii)連續紫外光(uv广輻射;(iv)金屬團簇受到 連續連續紫外光(UV)-輻射暴露而沉積,其中 201136664 可以是Cu、Ag、Pd、Au、Pt或任何其他貴金屬)(新 的表面活化步驟);(v)在習知無電鍍浴中攪拌表面經 活化的飛灰粒子之後,因為Cu族沉積而形成的Cu_ 鍍膜。 第10圖呈現使用A g作為表面活化劑所得到原 有的(a)(在600。(:下煅燒之後)以及經Cu塗鍍(b、c) 的飛灰粒子的X-射線繞射(XRD)分析。在(1))與(c) 中,在60CTC煅燒溫度的情況下,2以及5的尺_值使 用於飛灰粒子的新表面敏化中。在(a)中,標示為,·, 的波峰表示在飛灰粒子(基質_陶瓷)中對應於矽石(石 英)的繞射波峰。 第11(a)及11(b)圖呈現α個球形的原有以及經Oxide mixture of Si〇2 (40-50 wt.%), Al2〇3 (40-50 wt.%), Ca〇 (1_3 wt.%) and titanium dioxide (Ti〇2) (2_4 wt%) . σ Figure 3 shows the fly ash particles coated with Cu after sensitization (foot < and T = 400t) and surface activation (Cu as self-catalyst) in the electroless plating bath. Typical electron microscope (SEM) images at low (a) and higher (b) magnifications. The Cu-family rod growth was seen in (b). Figure 4 shows the normalized (♦) and surface sensitized () (foot = 2 and T = 40 (TC) fly ash particles, standardized residual mb dye concentration as continuous ultraviolet light (uv) _ light shot Typical changes in the function of exposure time (4) 'α and curve (b) of the first-order reaction rate constant velocity (&w) with m. Figure 5 shows the surface of the fly ash particles after a new surface sensitization and surface activation step Wide-spectral scanning xps analysis (岣 original; (b) surface sensitized (R==2 and T = 4〇〇t); (4) surface via 29 201136664 = (CU as self-catalyst); And (4) Cu-coated ore and particles. Figure 6 shows the use of a new surface sensitization and surface active ash particles to obtain a spin xps narrow energy spectrum scan P. 曰 (4) original; (b The surface is sensitized (feet = 2 and D = 〇; (4) the surface is activated (Cu as a self-catalyst); and (d) the Cu-coated fly ash particles. Figure 7 shows the use of a new surface The modified method of the fly ash particles obtained the solution back to the 35xps narrow energy spectrum scanning Cu 2p"2 spectrum. (4) The surface is activated (Cu as Catalyst) and (b) Cu-coated fly ash particles. In (4) and (b) towels, (1) Cu; (8) Cu〇; and (iii) Cu(〇H)2 〇... Figure 8 shows fork to continuous ultraviolet light (uv) radiation exposure using a semi-conductive titanium oxide (Ti〇2) photocatalytic route 0) and the use of sol-gel treated titanium dioxide (Ti〇2) as a new surface sensitizer for subsequent fly ash particles Surface activation and proposed route for Cu_mine film (b). Figure 9 presents a diagrammatic representation of a new surface modification method involving new surface sensitization and surface activation methods in electroless plating The surface of the fly ash particles is coated with a metal such as Cu*8 in the bath. (1) the surface of the original fly ash particles; (ii) the sol-gel coated titanium dioxide (Ti〇2) of the fly ash particles Surface (new surface sensitization steps are wide (iii) continuous ultraviolet light (uv broad radiation; (iv) metal clusters are deposited by continuous continuous ultraviolet (UV)-radiation exposure, where 201136664 can be Cu, Ag, Pd, Au, Pt or any other precious metal) (new surface activation step); (v) stirring in a conventional electroless plating bath After the activated fly ash particles, the Cu_ coating formed by the Cu group deposition. Fig. 10 shows the original (a) obtained after using Ag as a surfactant (after 600 (after calcination) and X-ray diffraction (XRD) analysis of Cu coated (b, c) fly ash particles. In (1)) and (c), at 60CTC calcination temperature, 2 and 5 scale values are used. In the new surface sensitization of fly ash particles, in (a), the peaks indicated as ·· represent the diffraction peaks corresponding to vermiculite (quartz) in the fly ash particles (matrix_ceramic). Figures 11(a) and 11(b) show the original and spherical
Cu塗鍍的飛灰粒子的典型電子顯微鏡(sem)影像。 紅Cu塗鍍的飛灰粒子是在習知無電鍍浴中攪拌表面 經敏化(R = 2以及.,T = 60(rc)以及表面經活化(使用A typical electron microscope (sem) image of Cu coated fly ash particles. Red Cu-coated fly ash particles are sensitized in a conventional electroless plating bath (R = 2 and ., T = 60 (rc) and the surface is activated (used
的飛灰粒子所得到。(c)如同(b)中所示之經&塗錄 的飛灰粒子的EDX分析。 X -第12圖呈現使用Ag作為表面活化劑而得到的 經Cu塗鍍的飛灰粒子的χ—射線繞射(xrd)分析。 6〇〇°C的煅燒溫度應用於以值為15而獲得之飛 的新表面敏化。 f 【主要元件符號說明】 益。 *The fly ash particles are obtained. (c) EDX analysis of & coated fly ash particles as shown in (b). X - Fig. 12 shows a x-ray diffraction (xrd) analysis of Cu-coated fly ash particles obtained using Ag as a surfactant. The calcination temperature of 6 ° C was applied to the new surface sensitization of the fly obtained with a value of 15. f [Key component symbol description] Benefit. *
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US5456840A (en) * | 1993-03-01 | 1995-10-10 | The Board Of Regents Of The University Of Oklahoma | Method for removing anions from water |
US6261986B1 (en) * | 1998-04-22 | 2001-07-17 | New Mexico Tech Research Foundation | Production and article of iron/surfactant-modified zeolite pellets to retain and destroy water pollutants |
US7309676B2 (en) * | 2002-03-22 | 2007-12-18 | Japan Envirochemicals, Ltd. | Remover for heavy metals contained in water |
US7056583B2 (en) * | 2003-06-04 | 2006-06-06 | International Pozzlan Coating Corp. | Flyash coating |
CN1244414C (en) * | 2004-09-07 | 2006-03-08 | 上海大学 | Treating method for city life garbage burning flyash |
US7510659B2 (en) * | 2006-03-10 | 2009-03-31 | Council Of Scientific & Industrial Research | Surface-modified zeolite and process for synthesis thereof for sequestration of anions |
CN101328035B (en) * | 2007-06-20 | 2010-09-01 | 中国矿业大学(北京) | Fly ash hollow microsphere surface modified whitening method |
-
2010
- 2010-11-11 AU AU2010348068A patent/AU2010348068B2/en not_active Ceased
- 2010-11-11 WO PCT/IN2010/000735 patent/WO2011111057A1/en active Application Filing
- 2010-11-11 CN CN2010800665787A patent/CN102869811A/en active Pending
- 2010-11-26 TW TW99140999A patent/TW201136664A/en unknown
- 2010-12-17 AR ARP100104718 patent/AR080573A1/en not_active Application Discontinuation
-
2012
- 2012-09-12 US US13/612,363 patent/US9080234B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103007931A (en) * | 2012-11-22 | 2013-04-03 | 嘉兴学院 | Method for preparing nano silver and titanium dioxide thin films on surfaces of hollow glass beads |
CN103007931B (en) * | 2012-11-22 | 2014-05-21 | 嘉兴学院 | Method for preparing nano silver and titanium dioxide thin films on surfaces of hollow glass beads |
Also Published As
Publication number | Publication date |
---|---|
CN102869811A (en) | 2013-01-09 |
WO2011111057A1 (en) | 2011-09-15 |
US9080234B2 (en) | 2015-07-14 |
AU2010348068B2 (en) | 2014-08-07 |
AR080573A1 (en) | 2012-04-18 |
AU2010348068A1 (en) | 2012-10-04 |
US20130095995A1 (en) | 2013-04-18 |
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