JP5612097B2 - 太陽電池封止材用シートの製造方法 - Google Patents
太陽電池封止材用シートの製造方法 Download PDFInfo
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- JP5612097B2 JP5612097B2 JP2012528762A JP2012528762A JP5612097B2 JP 5612097 B2 JP5612097 B2 JP 5612097B2 JP 2012528762 A JP2012528762 A JP 2012528762A JP 2012528762 A JP2012528762 A JP 2012528762A JP 5612097 B2 JP5612097 B2 JP 5612097B2
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- vinyl acetate
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- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000008393 encapsulating agent Substances 0.000 title claims description 14
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 38
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 38
- 238000004132 cross linking Methods 0.000 claims description 28
- 150000001451 organic peroxides Chemical class 0.000 claims description 21
- 239000003963 antioxidant agent Substances 0.000 claims description 20
- 239000003431 cross linking reagent Substances 0.000 claims description 20
- 230000003078 antioxidant effect Effects 0.000 claims description 19
- 239000006096 absorbing agent Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 238000000354 decomposition reaction Methods 0.000 claims description 15
- 238000004898 kneading Methods 0.000 claims description 15
- 239000004611 light stabiliser Substances 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 11
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 7
- 239000003566 sealing material Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 238000004383 yellowing Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 18
- 239000000654 additive Substances 0.000 description 12
- 230000000996 additive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- YWHMJMBYBJBHKE-UHFFFAOYSA-N (4-ethyl-2,2-dimethyloctan-3-yl) hydroxy carbonate Chemical compound CCCCC(CC)C(C(C)(C)C)OC(=O)OO YWHMJMBYBJBHKE-UHFFFAOYSA-N 0.000 description 4
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- -1 crosslinking aid Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- BRQMAAFGEXNUOL-LLVKDONJSA-N [(2R)-2-ethylhexyl] (2-methylpropan-2-yl)oxy carbonate Chemical compound CCCC[C@@H](CC)COC(=O)OOC(C)(C)C BRQMAAFGEXNUOL-LLVKDONJSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 2
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- XDDLRVYDQACVBC-UHFFFAOYSA-N 10-oxo-10-(1,2,2,6,6-pentamethylpiperidin-4-yl)oxydecanoic acid Chemical compound CN1C(C)(C)CC(OC(=O)CCCCCCCCC(O)=O)CC1(C)C XDDLRVYDQACVBC-UHFFFAOYSA-N 0.000 description 1
- GKJKFGJKZVODEH-UHFFFAOYSA-N 10-oxo-10-piperidin-1-yloxydecanoic acid Chemical compound OC(=O)CCCCCCCCC(=O)ON1CCCCC1 GKJKFGJKZVODEH-UHFFFAOYSA-N 0.000 description 1
- CXRXDDBPMBXXFT-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,4-dimethylhexane Chemical compound CC(C)(C)OOC(C)C(C)CC(C)(C)OOC(C)(C)C CXRXDDBPMBXXFT-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- IMMDDKSPKPABAW-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C.CO[Si](OC)(OC)CCCOC(=O)C(C)=C IMMDDKSPKPABAW-UHFFFAOYSA-N 0.000 description 1
- XBNLOTGSWNMQBY-UHFFFAOYSA-N CC1(NC(CC(C1)C(C(=O)O)(CCCCCCCC(=O)O)C1CC(NC(C1)(C)C)(C)C)(C)C)C.C(CCCCCCCCC(=O)OC1CC(NC(C1)(C)C)(C)C)(=O)OC1CC(NC(C1)(C)C)(C)C Chemical compound CC1(NC(CC(C1)C(C(=O)O)(CCCCCCCC(=O)O)C1CC(NC(C1)(C)C)(C)C)(C)C)C.C(CCCCCCCCC(=O)OC1CC(NC(C1)(C)C)(C)C)(=O)OC1CC(NC(C1)(C)C)(C)C XBNLOTGSWNMQBY-UHFFFAOYSA-N 0.000 description 1
- SEBUAOKKYATUTF-UHFFFAOYSA-N CN1C(CC(CC1(C)C)C(C(=O)O)(CCCCCCCC(=O)O)C1CC(N(C(C1)(C)C)C)(C)C)(C)C.C(CCCCCCCCC(=O)OC1CC(N(C(C1)(C)C)C)(C)C)(=O)OC1CC(N(C(C1)(C)C)C)(C)C Chemical compound CN1C(CC(CC1(C)C)C(C(=O)O)(CCCCCCCC(=O)O)C1CC(N(C(C1)(C)C)C)(C)C)(C)C.C(CCCCCCCCC(=O)OC1CC(N(C(C1)(C)C)C)(C)C)(=O)OC1CC(N(C(C1)(C)C)C)(C)C SEBUAOKKYATUTF-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 description 1
- YJBBDKQPEXEXNB-UHFFFAOYSA-N OC1(C(C(=O)C2=CC=CC=C2)C=CC(C1)(OC)OC)O.OC1(C(C(=O)C2=CC=CC=C2)C=CC(C1)(OC)OC)O Chemical compound OC1(C(C(=O)C2=CC=CC=C2)C=CC(C1)(OC)OC)O.OC1(C(C(=O)C2=CC=CC=C2)C=CC(C1)(OC)OC)O YJBBDKQPEXEXNB-UHFFFAOYSA-N 0.000 description 1
- GBLJCXQCIKHOPQ-UHFFFAOYSA-N S1C(NC2=C1C=CC=C2)C2=C(C(=CC(=C2)C)CCCCCCCCCCCC)O.S2C(NC1=C2C=CC=C1)C1=C(C(=CC(=C1)C)CCCCCCCCCCCC)O Chemical compound S1C(NC2=C1C=CC=C2)C2=C(C(=CC(=C2)C)CCCCCCCCCCCC)O.S2C(NC1=C2C=CC=C1)C1=C(C(=CC(=C1)C)CCCCCCCCCCCC)O GBLJCXQCIKHOPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2031/00—Use of polyvinylesters or derivatives thereof as moulding material
- B29K2031/04—Polymers of vinyl acetate, e.g. PVAc, i.e. polyvinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2331/00—Characterised by the use of copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, or carbonic acid, or of a haloformic acid
- C08J2331/02—Characterised by the use of omopolymers or copolymers of esters of monocarboxylic acids
- C08J2331/04—Homopolymers or copolymers of vinyl acetate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Photovoltaic Devices (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Hybrid Cells (AREA)
Description
表1の組成の通り、EVA樹脂(ビニルアセテート含量28重量%、溶融指数15g/10分、三星トータル製E280PV)100重量部に対して、酸化防止剤としてアデカ社のNaugard P(トリス(ノニルフェニル)ホスファイト)0.05重量部、UV吸収剤としてシバ社のChimassorb 81(2-ヒドロキシ-4-オキチルオキシ-ベンゾペノン)0.3重量部、UV安定剤としてシバ社のTinuvin 770(ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート)0.1重量部、架橋剤としてアルケマ社のLuperox TBEC(t-ブチル-2-エチルヘキシルモノパーオキシカーボネート)0.7重量部、架橋助剤としてエボニック社のTAICROS(トリアリルイソシアヌレート)0.5重量部、及びシランカップリング剤としてダウコニング社のOFS 6030(3-メタクリルオキシプロピルトリメトキシシロキサン)0.5重量部を混合した後、押出機の温度を90℃、T-ダイの温度を100℃にし、シートの先速度を分当り6.5mにして、厚さ0.45mmのシートを製造した後、シートの生産性及び外観を評価して、その結果を表1に示した。
T-ダイの温度を110℃にし、シートの先速度を分当り10mにしたことを除いては、比較例1と同一な方法でシートを製造した後、シートの生産性及び外観を評価して、その結果を表1に示した。
Luperox TBEC(t-ブチル-2-エチルヘキシルモノパーオキシカーボネート)を1.0重量部使用したことを除いては、比較例1と同一な方法でシートを製造した後、シートの生産性及び外観を評価して、その結果を表1に示した。
(単位:重量部)
実施例1 実施例2 実施例3 比較例1 比較例2 比較例3
EVA樹脂 100 100 100 100 100 100
Naugard P 0.05 0.05 0.05 0.05 0.05 0.05
Chimassorb 81 0.3 0.3 0.3 0.3 0.3 0.3
Tinuvin 770 0.1 0.1 0.1 0.1 0.1 0.1
Luperox TBEC 0.7 0.7 0.7 0.7 0.7 1.0
TAICROS 0.5 0.5 0.5 0.5 0.5 0.5
OFS 6030 0.5 0.5 0.5 0.5 0.5 0.5
シート生産性(m/分) 6.5 8.0 10 6.5 10 6.5
ダイ温度(℃) 100 100 110 100 110 100
シート外観 無色 無色 無色 薄い黄色 薄い黄色 薄い黄色
前記比較例1で製造されたシートを使用したことを除いては、実施例4と同一な方法で試片を製造して、同一な方法で観察、測定された物性評価の結果を表2に示した。
前記比較例2で製造されたシートを使用したことを除いては、実施例4と同一な方法で試片を製造した後、観察、測定された黄変度及び物性評価の結果を表2に示した。
前記比較例3で製造されたシートを使用したことを除いては、実施例4と同一な方法で試片を製造した後、観察、測定された黄変度及び物性評価の結果を表2に示した。
実施例4 実施例5 実施例6 比較例4 比較例5 比較例6
架橋度(%) 84.5 86.0 85.1 84.7 83.2 85.2
架橋後気泡 残存有無 無し 無し 無し 無し 無し 有
初期黄変度(YI) 1.46 1.53 1.58 1.68 1.92 2.4
黄変度差異(△ YI) 3.32 3.25 3.6 6.87 8.20 8.14
Claims (9)
- 次の段階を含む太陽電池封止材用シートの製造方法:
(1)エチレンビニルアセテート共重合体樹脂に酸化防止剤、UV吸収剤及び光安定剤を80〜220℃で溶融混練して、樹脂組成物を得る段階;及び
(2)前記(1)段階から得たエチレンビニルアセテート共重合体樹脂組成物に架橋剤として有機過酸化物、架橋助剤及びシランカップリング剤を、有機過酸化物の分解温度以下で溶融混練して、シートを成形する段階。 - 前記(2)段階で、(1)段階で得たエチレンビニルアセテート共重合体樹脂組成物に有機過酸化物、架橋助剤及びシランカップリング剤をブレンディングした後、有機過酸化物の分解温度以下で溶融混練して、シートを成形することを特徴とする請求項1に記載の太陽電池封止材用シートの製造方法。
- 前記(2)段階で、(1)段階で得たエチレンビニルアセテート共重合体樹脂組成物を押出機で有機過酸化物の分解温度以下で溶融させながら有機過酸化物 、架橋助剤及びシランカップリング剤の混合物を別途の原料供給装置を通じて前記押出機に供給して溶融混練して、シートを成形することを特徴とする請求項1に記載の太陽電池封止材用シートの製造方法。
- 前記(1)段階で、エチレンビニルアセテート共重合体樹脂100重量部に対して、酸化防止剤0.005〜0.1重量部、UV吸収剤0.1〜0.5重量部及び光安定剤0.01〜0.3重量部を溶融混練することを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
- エチレンビニルアセテート共重合体樹脂のビニルアセテート含量が25〜32重量%であり、溶融指数が6〜30g/10分であることを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
- 前記酸化防止剤は、フノール系酸化防止剤、ホスファイト系酸化防止剤及び硫黄系酸化防止剤から選ばれる1種以上であることを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
- 前記UV吸収剤は、ベンゾフェノン系UV吸収剤及びベンゾトリアゾール系UV吸収剤から選ばれる1種以上であることを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
- 前記光安定剤は、ヒンダードアミン系光安定剤であることを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
- 前記有機過酸化物として、分解温度が異なるものを2種以上使用することを特徴とする請求項1〜3の何れか1つの請求項に記載の太陽電池封止材用シートの製造方法。
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