JP5607400B2 - 半導体構造体の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 278
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000002070 nanowire Substances 0.000 claims description 73
- 239000000463 material Substances 0.000 claims description 44
- 239000003989 dielectric material Substances 0.000 claims description 42
- 230000003647 oxidation Effects 0.000 claims description 39
- 238000007254 oxidation reaction Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 30
- 239000013078 crystal Substances 0.000 claims description 26
- 239000002019 doping agent Substances 0.000 claims description 24
- 239000012212 insulator Substances 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 14
- 230000001590 oxidative effect Effects 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000001459 lithography Methods 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910001339 C alloy Inorganic materials 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 2
- AXQKVSDUCKWEKE-UHFFFAOYSA-N [C].[Ge].[Si] Chemical compound [C].[Ge].[Si] AXQKVSDUCKWEKE-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910021483 silicon-carbon alloy Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229940104869 fluorosilicate Drugs 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/122—Single quantum well structures
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
- H01L29/42392—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Description
ミラー指数に関して
は、以降−1と記載する。
逆もまた同様である。上部半導体層28は、真性半導体として設けられてもよく、又はp型ドーピング若しくはn型ドーピングを有するものとして設けられてもよい。第1のデバイス領域2と第2のデバイス領域が適切なドーピングでドープされることを保証するために、イオン注入又はプラズマドーピングの際にパターン付けされたイオン注入マスクを使用することができる。典型的には、ドープされた領域におけるドーパント濃度は5.0×1014/cm3から3.0×1017/cm3までの範囲内であるが、それを下回るドーパント濃度及び上回るドーパント濃度もまたここでは意図されている。ここで説明されている非限定的な例において、第1の導電性型はp型であり、第2の導電性型はn型であり、すなわち、第1のデバイス領域2はp型ドーパントでドープされ、第2のデバイス領域4はn型ドーパントでドープされる。
7:フォトレジスト
10:ハンドル基板
20:埋込絶縁体層
22:誘電体材料層
22A、22B、42A、42B:誘電体架台
28:上部半導体層
30A、50A:ソース側パッド
30B、50B:ドレイン側パッド
30C、50C:半導体リンク部
32A、52A:薄化されたソース側パッド
32B、52B:薄化されたドレイン側パッド
32C、52C:半導体ナノワイヤ
33、53:ソース領域
35、55:チャネル領域
36、56:ゲート誘電体
37、57:ドレイン領域
38、58:ゲート電極
42A、42B、48、62A、62B、68:コンタクト・ビア
80:MOL誘電体材料層
Claims (16)
- 半導体構造体を形成する方法であって、
第1の半導体リンク部を含む第1の半導体構造体をパターン形成するステップであって、前記第1の半導体構造体が、第1の幅w1によって隔てられた、酸化雰囲気中で第1の酸化速度を有する第1の面方位を有する第1の側壁対を有するものである、ステップと、
第2の半導体リンク部を含む第2の半導体構造体をパターン形成するステップであって、前記第2の半導体構造体が、第2の幅w2によって隔てられた、前記酸化雰囲気中で前記第1の酸化速度とは異なる第2の酸化速度を有する第2の面方位を有する第2の側壁対を有するものである、ステップと、
第3の幅w3を有する第1の半導体ナノワイヤを、前記第1の半導体リンク部を前記第1の酸化速度で薄化することによって形成するステップと、
第4の幅w4を有する第2の半導体ナノワイヤを、前記第2の半導体リンク部を前記第2の酸化速度で薄化することによって形成するステップと
を含み、
前記第3の幅w3及び前記第4の幅w4はサブリソグラフィ寸法である、方法。 - 前記第1の幅w1と前記第3の幅w3との間の差と、前記第2の幅w2と前記第4の幅w4との間の差との比が、前記第1の酸化速度と前記第2の酸化速度との比に等しく、
前記第1の幅w1及び前記第2の幅w2がリソグラフィ寸法である、請求項1に記載の方法。 - 前記第1の半導体構造体が、前記第1の幅w1よりも大きい幅を有する第1のソース側パッド及び第1のドレイン側パッドをさらに含み、前記第2の半導体構造体が、前記第2の幅w2よりも大きい幅を有する第2のソース側パッド及び第2のドレイン側パッドをさらに含む、請求項1または2に記載の方法。
- 前記第1のソース側パッド、前記第1のドレイン側パッド、前記第2のソース側パッド、及び前記第2のドレイン側パッド、並びに前記第1及び第2の半導体リンク部を同時に薄化するステップをさらに含む、請求項3に記載の方法。
- 前記第1のソース側パッド、前記第1のドレイン側パッド、前記第2のソース側パッド、及び前記第2のドレイン側パッドが、薄化の前に、前記第1及び第2の半導体リンク部と同じ厚さを有し、
薄化の後に、前記第1及び第2の半導体ナノワイヤと同じ厚さを有する、請求項4に記載の方法。 - 前記第1及び第2の半導体構造体をエッチングマスクとして利用して、前記第1及び第2の半導体構造体の下から誘電体材料層をエッチングするステップをさらに含み、前記誘電体材料層が、前記第1及び第2の半導体リンク部の下側でアンダーカットされる、請求項3〜5のいずれか1項に記載の方法。
- 前記第1及び第2の半導体リンク部が、前記誘電体材料層の残存部分の上に浮いた状態となり、前記第1及び第2の半導体構造体が、前記第1のソース側パッド、前記第1のドレイン側パッド、前記第2のソース側パッド、及び前記第2のドレイン側パッドの底面で前記誘電体材料層と接する、請求項6に記載の方法。
- 単結晶半導体層をパターン形成するステップをさらに含み、前記第1の半導体構造体及び前記第2の半導体構造体が、前記単結晶半導体層のパターン形成された部分によって形成される、請求項1〜7のいずれか1項に記載の方法。
- 前記第1の側壁対が、前記単結晶半導体層における全ての垂直面の中で正孔移動度が最大となる垂直面に平行であり
前記第2の側壁対が、前記単結晶半導体層における全ての垂直面の中で電子移動度が最大となる垂直面に平行である、請求項8に記載の方法。 - 前記第3の幅w3及び前記第4の幅w4が1nmから20nmである、請求項1〜9のいずれか1項に記載の方法。
- 前記第3の幅w3及び前記第4の幅w4のうち大きい方の、前記第3の幅w3及び前記第4の幅w4のうち小さい方に対する比が、1.0から10である、請求項10に記載の方法。
- 前記第1及び第2の半導体リンクの周縁部を酸化によって酸化物材料部分に変換するステップと、
前記酸化物材料部分を除去し、それによって前記第1及び第2の半導体リンクが薄化されるステップと
をさらに含む、請求項1〜11のいずれか1項に記載の方法。 - 前記第1及び第2の半導体構造体が誘電体材料層の上に形成され、前記誘電体材料層が半導体・オン・インシュレータ(SOI)基板の埋込絶縁体層であり、前記第1及び第2の半導体構造体が、前記SOI基板の上部半導体層のパターン形成によって形成される、請求項1〜12のいずれか1項に記載の方法。
- 前記第1の半導体ナノワイヤの周囲に第1のゲート誘電体を形成するステップと、
前記第2の半導体ナノワイヤの周囲に第2のゲート誘電体を形成するステップと、
前記第1のゲート誘電体の周囲に第1のゲート電極を形成するステップと、
前記第2のゲート誘電体の周囲に第2のゲート電極を形成するステップと
をさらに含む、請求項1〜13のいずれか1項に記載の方法。 - 前記第1の半導体構造体が、前記第1の幅w1よりも大きい幅を有する第1のソース側パッド及び第1のドレイン側パッドをさらに含み、前記第2の半導体構造体が、前記第2の幅w2よりも大きい幅を有する第2のソース側パッド及び第2のドレイン側パッドをさらに含み、前記方法が、
前記第1のソース側パッド及び前記第1のドレイン側パッドを第2の導電性型のドーパントでドーピングするステップと、
前記第2のソース側パッド及び前記第2のドレイン側パッドを第1の導電性型のドーパントでドーピングするステップと
をさらに含み、
前記第2の導電性型が前記第1の導電性型の反対である、請求項14に記載の方法。 - 前記第1の半導体ナノワイヤが前記第1の導電性型のドーピングを有し、前記第2の半導体ナノワイヤが前記第2の導電性型のドーピングを有する、請求項15に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US12/417,796 US7943530B2 (en) | 2009-04-03 | 2009-04-03 | Semiconductor nanowires having mobility-optimized orientations |
US12/417796 | 2009-04-03 |
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JP2010245522A JP2010245522A (ja) | 2010-10-28 |
JP5607400B2 true JP5607400B2 (ja) | 2014-10-15 |
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US (2) | US7943530B2 (ja) |
JP (1) | JP5607400B2 (ja) |
KR (1) | KR101143760B1 (ja) |
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KR101725112B1 (ko) * | 2010-12-14 | 2017-04-11 | 한국전자통신연구원 | 반도체 소자 및 이를 제조하는 방법 |
CN102169889A (zh) * | 2011-03-17 | 2011-08-31 | 复旦大学 | 超长半导体纳米线结构及其制备方法 |
JP5325932B2 (ja) | 2011-05-27 | 2013-10-23 | 株式会社東芝 | 半導体装置およびその製造方法 |
KR101631778B1 (ko) | 2011-12-23 | 2016-06-24 | 인텔 코포레이션 | 랩-어라운드 컨택트들을 가진 나노와이어 구조들 |
KR101271787B1 (ko) | 2012-03-13 | 2013-06-07 | 포항공과대학교 산학협력단 | 나노선 전계효과 트랜지스터 및 이의 제조방법 |
CN102637606B (zh) * | 2012-05-03 | 2014-08-27 | 上海华力微电子有限公司 | 基于SOI的后栅型积累模式Si-NWFET制备方法 |
US8823059B2 (en) * | 2012-09-27 | 2014-09-02 | Intel Corporation | Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack |
US20140264488A1 (en) * | 2013-03-15 | 2014-09-18 | Globalfoundries Inc. | Methods of forming low defect replacement fins for a finfet semiconductor device and the resulting devices |
US20140353761A1 (en) * | 2013-05-28 | 2014-12-04 | International Business Machines Corporation | Multi-orientation semiconductor devices employing directed self-assembly |
GB2526880A (en) | 2014-06-06 | 2015-12-09 | Univ Southampton | Melt-growth of single-crystal alloy semiconductor structures and semiconductor assemblies incorporating such structures |
KR102309342B1 (ko) * | 2014-12-24 | 2021-10-07 | 인텔 코포레이션 | 게르마늄 나노와이어들을 사용하는 전계 효과 트랜지스터 구조체들 |
CN108028275A (zh) * | 2015-09-25 | 2018-05-11 | 英特尔公司 | 纳米线晶体管设备架构 |
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CN107452793B (zh) | 2016-06-01 | 2020-07-28 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
CN106229256A (zh) * | 2016-07-29 | 2016-12-14 | 东莞华南设计创新院 | 一种硅锗纳米线的制作方法 |
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US7943530B2 (en) | 2011-05-17 |
US20110175063A1 (en) | 2011-07-21 |
US20100252814A1 (en) | 2010-10-07 |
CN101859707A (zh) | 2010-10-13 |
KR101143760B1 (ko) | 2012-05-11 |
US8299565B2 (en) | 2012-10-30 |
CN101859707B (zh) | 2012-07-04 |
KR20100110728A (ko) | 2010-10-13 |
JP2010245522A (ja) | 2010-10-28 |
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