JP5599703B2 - オキシ窒化物スパッタリングターゲット - Google Patents
オキシ窒化物スパッタリングターゲット Download PDFInfo
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- JP5599703B2 JP5599703B2 JP2010501562A JP2010501562A JP5599703B2 JP 5599703 B2 JP5599703 B2 JP 5599703B2 JP 2010501562 A JP2010501562 A JP 2010501562A JP 2010501562 A JP2010501562 A JP 2010501562A JP 5599703 B2 JP5599703 B2 JP 5599703B2
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- thin film
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- sputtering
- lithium
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- 238000005477 sputtering target Methods 0.000 title claims description 8
- 239000010409 thin film Substances 0.000 claims description 49
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 28
- 238000004544 sputter deposition Methods 0.000 claims description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 239000003792 electrolyte Substances 0.000 claims description 12
- 229910018119 Li 3 PO 4 Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 description 20
- 230000008021 deposition Effects 0.000 description 20
- 229910052744 lithium Inorganic materials 0.000 description 11
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 8
- 229910001416 lithium ion Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910013184 LiBO Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010416 ion conductor Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910012305 LiPON Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- -1 hafnium nitride Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002641 lithium Chemical class 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910001386 lithium phosphate Inorganic materials 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- RIUWBIIVUYSTCN-UHFFFAOYSA-N trilithium borate Chemical compound [Li+].[Li+].[Li+].[O-]B([O-])[O-] RIUWBIIVUYSTCN-UHFFFAOYSA-N 0.000 description 1
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C14/0641—Nitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
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- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
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- H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
- H01M50/409—Separators, membranes or diaphragms characterised by the material
- H01M50/431—Inorganic material
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Description
・ 30乃至40原子%の金属、特にリチウム、
・ 2乃至10原子%の窒素、
・ 35乃至50原子%の酸素、
・ 燐(P)、ホウ素(B)、ケイ素(Si)、ゲルマニウム(Ge)、ガリウム(Ga)、硫黄(S)、及びアルミニウム(Al)を含む群より選択される少なくとも1つの元素によって構成される、100%までの残部
を含む、新規な陰極スパッタリング金属オキシ窒化物ターゲットを完成させた。
本発明に適合する均質な組成Li3P1O3.1N0.6のスパッタリングターゲットを、圧力が0.8Pa、電力密度が4W/cm2、更にターゲットから基体への距離が10cmでの、50/50アルゴン/窒素気体混合物の高周波マグネトロン陰極スパッタリングによってスパッタリングする。組成Li2.8P1O3N0.6を有する均質な外観のガラス質の薄膜について、1時間あたり4μmの蒸着速度が得られ、この薄膜の常温でのリチウムイオン伝導性は2.5 E-6 Scm-1である。この電解質の1.5μmの薄膜は、リチウムマイクロバッテリーへのその挿入に、完全に十分である。
本発明に非適合性である均質な組成Li3PO4のスパッタリングターゲットを、圧力が0.8Pa、電力密度が4W/cm2、更にターゲットから基体への距離が10cmでの純窒素の高周波マグネトロン陰極スパッタリングによってスパッタリングする。表面の一部がガラス質であり、所々がマットな外観である薄膜について、1時間あたり3μmの蒸着速度が得られる。この薄膜は組成Li2.6P1O3.6N0.1を有し、その常温でのリチウムイオン伝導性は0.3 E-6 Scm-1である。この薄膜がマットな外観である部分は、顕微鏡下では粒状の外観を有して、電解質としては完全に使用不可能である。こうしたターゲットから出発してこの電力密度で得られた伝導性がこの材料に予期される値の約1/4倍から1/3倍である一方で、前記条件下で形成された薄膜の成長は、この薄膜のかなりの領域がそのマイクロバッテリー、エレクトロクロミック素子、またはスーパーコンデンサにおける電解質としてのその使用に不適当な柱状成長を呈するため、信頼性のある工業製品をもたらさない。
本発明に適合する均質な組成Li2.5P0.5Si0.5O2.7N0.5のスパッタリングターゲットを、圧力が0.6Pa、電力密度が3.5W/cm2、更にターゲットから基体への距離が10cmでの、50/50アルゴン/窒素気体混合物の高周波マグネトロン陰極スパッタリングによってスパッタリングする。得られた蒸着速度は1時間あたり3μmであり、ガラス質の薄膜が、均質な外観及び12 E-6 Scm-1の常温でのリチウムイオン伝導性を伴う組成Li2.4P0.5Si0.5O2.2N0.8をもって得られる。この電解質の1.5μmの薄膜は、リチウムマイクロバッテリーへのその挿入に、完全に十分である。
本発明に非適合性である均質な組成Li2.5P0.5Si0.5O3.5のスパッタリングターゲットを、圧力が0.6Pa、電力密度が3.5W/cm2、更にターゲットから基体への距離が10cmでの、50/50アルゴン/窒素気体混合物の高周波マグネトロン陰極スパッタリングによってスパッタリングする。得られた蒸着速度は1時間あたり2.5μmであり、膜中に小粒子を含むガラス質マトリックスの薄膜が得られる。薄膜の平均組成は組成Li2.4P0.5Si0.5O3.3N0.1であり、その常温でのリチウムイオン伝導性は2 E-7 Scm-1である。
この薄膜はマイクロバッテリー用の電解質として使用可能であるが、その伝導性はこのタイプの材料にしては低く、その膜の成長は、その工業化を十分に阻害しうる相分離でありうる現象を呈する。
モル組成(Li3PO4)0.6(B2O3)0.2(Li3N)0.3のターゲットが、三種類の粉末、Li3PO4;B2O3;Li3Nの、結合剤を用いる均質クラスタリングによって得られる。このターゲットの化学組成は、本発明に従う。このターゲットは、0.8Pa、電力密度が2W/cm2、更にターゲットから基体への距離が10cmでの、窒素の高周波マグネトロン陰極スパッタリングによってスパッタリングする。組成Li2.5P0.6B0.3O2.5N0.5を有するガラス質の薄膜について、1時間あたり2μmの蒸着速度が得られ、この薄膜の常温でのリチウムイオン伝導性は1.2 E-6 Scm-1である。この電解質の1.5μmの薄膜は、マイクロバッテリーへのその挿入に、完全に十分である。
二種類の粉末、Li3PO4;LiBO2の均質クラスタリングによって得られる、本発明に非適合性であるモル組成(Li3PO4)0.6(LiBO2)0.4のターゲットを、0.8Pa、電力密度が2W/cm2、更にターゲットから基体への距離が10cmでの、窒素の高周波マグネトロン陰極スパッタリングによってスパッタリングする。組成Li2.2P0.6B0.3O2.9N0.1を有するガラス質の薄膜について、1時間あたり1.6μmの蒸着速度が得られ、この薄膜の常温でのリチウムイオン伝導性は4 E-7 Scm-1である。実施例1a及び3aに見られるように、このタイプの材料を用いると、常温でのイオン電導性が約4倍優れた薄膜を得る可能性がある。
本発明に非適合性である組成Li2.2P1O2.4N0.8のターゲットを、0.8Pa、電力密度が2W/cm2、更にターゲットから基体への距離が10cmでの窒素の高周波マグネトロン陰極スパッタリングによってスパッタリングする。組成Li2.2P1O2.3N0.9を有するガラス質の薄膜について、1時間あたり2.6μmの蒸着速度が得られ、この薄膜の常温でのリチウムイオン伝導性は1 E-7 Scm-1である。得られた薄膜は、ソーダ石灰(sodocalcic)白色ガラスの基板に蒸着される場合は引張り応力の高い状態を示し、顕微鏡下での観察では薄膜中に局所層間剥離さえ観察することができ、これによってその張力の状態が確認される。
この薄膜に対する電気化学的安定性試験により、4ボルト超で偏光を適用した場合の初期損傷が示される。比較すると、同種の組成Li2.8P1O3N0.6の優れた材料は5V超に耐え、引張り応力の高い状態を示さない。このターゲットでは、実際に速い蒸着速度が得られるが、製造される薄膜の工業化と適合する特性は得られない。
非適合性である組成Li1P1O2.4N0.4のスパッタリングターゲットを、圧力が0.8Pa、電力密度が2W/cm2、更にターゲットから基体への距離が10cmでの50/50アルゴン/窒素気体混合物の高周波マグネトロン陰極スパッタリングによってスパッタリングする。組成Li1P1O2.3N0.4を有する均質な外観のガラス質の薄膜について、1時間あたり2μmの蒸着速度が得られ、この薄膜の常温でのリチウムイオン伝導性は1E-8 Scm-1である。この電解質の1.5μmの薄膜はリチウムマイクロバッテリーへのその挿入に使用可能であるが、その伝導性は、その工業化を目指すためには、実施例1aにおいて得られる現行基準とはかけ離れている。
Claims (3)
- 下式:
・ Li3P1O3.1N0.6;
・ Li2.5P0.5Si0.5O2.6N0.6;
・ (Li3PO4)0.6(B2O3)0.2(Li3N)0.3;
のいずれか1つを有することを特徴とする、陰極スパッタリングターゲット。 - 請求項1に記載のターゲットの、純窒素、場合によりそのアルゴンとの混合物によって構成されている雰囲気中での磁場補助陰極スパッタリングによる、金属-オキシ窒化物ベースの薄膜の製造方法。
- 請求項2に記載の方法にしたがって得られる薄膜の形態の電解質を備えた、マイクロバッテリー、エレクトロクロミック素子、またはマイクロスーパーコンデンサからなる電気化学的装置。
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