JP5596853B2 - Deposition equipment - Google Patents

Description

The present invention relates to an in-line type film forming apparatus, and more particularly to a film forming apparatus that improves a substrate transfer system, saves space, and improves production efficiency.
This application claims priority on April 11, 2011 based on Japanese Patent Application No. 2011-087583 for which it applied to Japan, and uses the content here.

  For example, in order to process a large glass substrate used in a plasma display or a liquid crystal display, multiple layers are formed by a heating process for raising the temperature to a desired temperature under vacuum, or by a processing means such as sputtering, CVD, or etching. Various film forming steps for film formation are necessary.

  Conventionally, various film forming apparatuses have been put into practical use. A film forming apparatus for forming a substrate in a horizontal state has a problem that when the substrate is enlarged, the apparatus is also enlarged. For this reason, in recent years, vertical type film forming apparatuses have been developed that perform film formation or the like with the substrate substantially upright.

FIG. 5 is a diagram showing a basic configuration of a conventional film forming apparatus.
A conventional film forming apparatus 100 includes a substrate attaching / detaching chamber 120, first to third three vacuum processing chambers (referred to as a heating chamber and a film forming chamber) 200, 220, 240 connected on one line. And an L / UL (Load / Unload) chamber 140 that conveys the substrate tray between the atmosphere side and the vacuum processing chambers 200, 220, and 240.

  In addition, in the L / UL chamber 140 and each of the vacuum processing chambers 200, 220, and 240, two transfer paths 160, a first transfer path (outward path) 160 and a second transfer path 180 (return path), 180 is provided. The first transfer path 160 is a forward path through which the substrate tray is transferred from the L / UL chamber 140 to the vacuum processing chambers 200, 220, and 240. The second transfer path 180 is a return path in which the substrate tray is transferred from each of the vacuum processing chambers 200, 220, and 240 to the L / UL chamber 140 through the heating chamber.

  Further, the third vacuum processing chamber 240 at the rearmost part of the film forming apparatus 100 is configured to transfer the substrate tray from the first transfer path (forward path) 160 to the second transfer path (return path) 180, and the two transfer paths 160 and 180. Is provided with a transfer mechanism (not shown) that moves in the horizontal direction. This transfer mechanism has a mechanism for once lifting the substrate tray on the first transfer path 160 and transferring it to the second transfer path 180.

  Note that an evacuation apparatus 300 is attached to the L / UL chamber 140. A heating device and a vacuum exhaust device 300 are attached to the heating chamber. In each of the vacuum processing chambers 200, 220, and 240, film forming units 210, 230, and 250 such as a sputtering device and a vacuum exhaust device 300 are attached, respectively.

The basic operation of such a conventional film forming apparatus 100 will be described.
When a substrate is placed on the substrate tray in the substrate attaching / detaching chamber 120, the substrate tray is transported to the L / UL chamber 140, and the L / UL chamber 140 is evacuated and evacuated to a vacuum. It is transported to the first transport path 160 that is prepared in the processing chamber 200 and serves as the forward path.
The substrate tray (substrate carrier) is subjected to vacuum processing such as heating and film formation in the vacuum processing chambers 200, 220, and 240 while being transported through the first transport path 160.

  After the substrate is vacuum processed in the vacuum processing chamber 240, the substrate tray is transferred to the second transfer path 180 serving as a return path by a transfer mechanism (not shown), and film formation is performed in the vacuum processing chambers 200, 220, and 240, respectively. Etc. are vacuum-processed. The substrate is removed from the substrate tray in the substrate attaching / detaching chamber 120 through the L / UL chamber 140 with the vacuum-treated substrate placed thereon.

  Incidentally, in general, in the L / UL chamber, in addition to transporting the substrate carrier, vacuum exhaust and atmospheric pressure release are performed. Therefore, the tact of the vacuum processing apparatus is affected by the exhaust / vent time of the L / UL chamber.

  However, in the conventional film forming apparatus, only a single substrate tray is disposed at the substrate replacement port in the L / UL chamber. Therefore, in the substrate attaching / detaching section, while the substrate tray is placing an unprocessed substrate or removing a processed substrate, the residence time during which the substrate cannot be loaded or removed in the L / UL chamber is increased, which adversely affects tact. This has a problem that the vacuum processing efficiency of the substrate is lowered.

  In the in-line type film forming apparatus, the substrate tray holding the substrate is transported in a row in a continuous vacuum chamber. Therefore, in order to increase the production amount, that is, the vacuum processing amount by the apparatus of the conventional example, it is necessary to increase the conveyance speed of the substrate tray or to add an apparatus. However, since the substrate tray is usually transported at a high speed as possible, it is difficult to further increase the transport speed. Therefore, although the remaining means is the expansion of the apparatus, the expansion of the apparatus has a problem that the apparatus cost is proportionally increased and the occupied area of the apparatus is increased accordingly.

Japanese Unexamined Patent Publication No. 2005-340425

  The present invention has been made in view of such a conventional situation, and aims to provide a film forming apparatus that saves space, improves a substrate transfer system, and improves productivity. To do.

The film forming apparatus according to the first aspect of the present invention includes an L / UL chamber, an H chamber communicating with the L / UL chamber, an independent first space and a second space communicating with the H chamber. Independently of the partitioned SP chamber, the film forming units respectively disposed in the first space and the second space, the L / UL chamber, the H chamber, the first space, and the second space An evacuation device for evacuating the interior of each of them, through the L / UL chamber and the H chamber, and from the forward path and the return path disposed in the first space and the second space, respectively. The four lines and the object to be processed are carried along the forward path from the L / UL chamber through the H chamber to the inside of the first space and the second space, respectively, and along the return path. From the inside of the first space and the second space, through the H chamber A transfer device to L / UL chamber carrying the object to be processed, the inside of the first space and the second space, wherein a moving mechanism for the conveying apparatus from said forward transfer to return the film forming device including a Because
The L / UL chamber is also connected to an RT mechanism through two door valves, and the RT mechanism includes a first RT mechanism, a second RT mechanism, and a third RT mechanism, and the third RT mechanism and the third RT mechanism. The object to be processed conveyed to the first space is processed between the 1RT mechanism and the object to be processed conveyed to the second space is processed between the third RT mechanism and the second RT mechanism. good.
Film forming apparatus according to the second aspect of the present invention, in the first state-like, the conveying device, the may carry vertical the object to be processed.
Film forming apparatus according to the third aspect of the present invention, Oite to the first or second state like, the film forming unit may be a cathode for sputtering.
Film deposition apparatus according to a fourth aspect of the present invention, Oite to the first or second state like, the film-forming unit may be an electrode of the parallel plate for CVD.
The film forming apparatus according to a fifth aspect of the present invention is the film forming apparatus according to any one of the first to fourth aspects, wherein the transfer device includes a cylindrical slide shaft at a lower portion thereof, and the line guides the transfer device. A plurality of rollers having a U-shaped groove, wherein at least a contact portion of one of the slide shaft or the roller is made of a bulk body containing silicon, aluminum, oxygen, and nitrogen, and the slide shaft or At least the other contact portion of the roller may be made of stainless steel.

  According to one embodiment of the present invention, it is possible to provide a film forming apparatus that saves space, improves a substrate transfer system, and improves productivity.

It is sectional drawing which shows typically the example of 1 structure of the film-forming apparatus of this invention. It is a perspective view which shows an example of the tray in which a board | substrate is mounted. It is a perspective view which shows an example of the lower support mechanism of a tray. It is sectional drawing which shows an example of the upper part support mechanism of a tray. It is sectional drawing which shows typically the example of 1 structure of the conventional film-forming apparatus.

  Hereinafter, a film forming apparatus according to an embodiment of the present invention will be described.

  FIG. 1 is a cross-sectional view schematically showing one configuration example of the film forming apparatus of the present invention, and is a view of the film forming apparatus as viewed from above. In FIG. 1, the depth direction of the paper surface is the direction of gravity. In the film forming apparatus shown in FIG. 1, a tray on which a substrate (object to be processed) is mounted is conveyed in a standing state (a state where a surface to be processed of the substrate is parallel to the direction of gravity). Therefore, the film forming apparatus 1 shown in FIG. 1 is a vertical transfer type apparatus.

  As shown in FIG. 1, a film forming apparatus 1 according to an embodiment of the present invention includes an L / UL chamber (Load / Unload) 10, an H chamber (heating chamber) 20, an SP chamber (a sputtering method). (Deposition chamber used) 30 are arranged in order. Further, in front of the L / UL chamber 10, a POS mechanism (attachment / detachment chamber for a substrate (object to be processed) to be attached to / detached from the tray) 40 and an RT mechanism (tray moving mechanism having a rotation mode) 50 are provided. And are arranged.

  The chambers communicate with each other through two door valves arranged in parallel. Two door valves 61 are provided between the RT mechanism 50 and the L / UL chamber 10. Similarly, two door valves 62 are provided between the L / UL chamber 10 and the heating chamber 20. Two door valves 63 are provided between the heating chamber 20 and the film forming chamber 30.

  The film forming chamber 30 is divided into an independent first space 30A and a second space 30B. At the same time, the evacuation devices 12, 22, 32 (32A, 32B) for evacuating the interior of the first space 30A and the second space 30B of the L / UL chamber 10, the heating chamber 20, and the film formation chamber 30, respectively. ) Are provided independently. In other words, in the independent first space 30A and second space 30B constituting the film forming chamber 30, vacuum evacuation devices 32A and 32B capable of exclusively exhausting the respective spaces are individually installed.

  The L / UL chamber 10 charges (loads in) and takes out (unloads) the tray 70 with the RT mechanism 50 in a state opened to atmospheric pressure. The L / UL chamber 10 is provided with an evacuation device 12 for evacuating the interior thereof. The L / UL chamber 10 is provided with a partition wall 11 at the center thereof. Thereby, the interior of the L / UL chamber 10 is divided into a first space 10A and a second space 10B. The first space 10 </ b> A handles the substrate (object to be processed) 2 transported to the first space 30 </ b> A of the film forming chamber 30. The second space 10 </ b> B handles the substrate (object to be processed) 2 transported to the second space 30 </ b> B of the film forming chamber 30.

FIG. 1 shows a configuration example in which the first space 10A and the second space 10B are completely partitioned by the partition wall 11 and are not mutually independent spaces, but are partially in communication with each other. However, although not shown in the drawing, the first space 10A and the second space 10B do not necessarily have to be in communication with each other, and the first space 10A and the second space 10B are independent from each other. As may be made, the partition wall 11 may be provided. In the case of the configuration in which the first space 10A and the second space 10B are communicated with each other, it is sufficient to have at least one vacuum exhaust device, so that a low cost system can be constructed.
In the case of a configuration in which the first space 10A and the second space 10B are independent spaces, instead of the configuration described above, a vacuum exhaust device may be separately provided in the first space 10A and the second space 10B. However, by providing a mechanism for switching the exhaust time zones of the first space 10A and the second space 10B according to the processing tact time, it is possible to use one vacuum exhaust device. Furthermore, since there is a merit that work such as vacuum processing and maintenance can be performed separately, a configuration in which the spaces are independent from each other may be employed.

The L / UL chamber 10 is connected via two door valves 61 to an RT mechanism 50 and a POS mechanism 40 arranged in front of the L / UL chamber 10 (front stage).
One of the door valves 61 is used when the tray 70A (70) passing through the first POS mechanism 40A and the first RT mechanism 51A is carried into and out of the L / UL chamber 10. The other of the door valves 61 is used when the tray 70B (70) is carried into and out of the L / UL chamber 10 via the second POS mechanism 40B and the second RT mechanism 51B.

The POS mechanism 40 includes a first POS mechanism 40A and a second POS mechanism 40B. The POS mechanism 40 attaches the substrate (object to be processed) 2 carried from the outside to the tray 70, and attaches the processed substrate 2 to the tray 70. Remove from 70 and carry outside.
The RT mechanism 50 includes a first RT mechanism 51A, a second RT mechanism 51B, and a third RT mechanism 51C, and transports the substrate 2 attached to the tray 70 in the POS mechanism 40 to the L / UL chamber 10. The processed tray 70 unloaded in the L / UL chamber 10 is conveyed to the POS mechanism 40.

  In the first POS mechanism 40A and the first RT mechanism 51A, the substrate 2 transported to the first space 10A of the L / UL chamber 10 is handled. In the second POS mechanism 40B and the second RT mechanism 51B, the substrate 2 transported to the second space 10B of the L / UL chamber 10 is handled.

  In the L / UL chamber 10, when the tray 70 is transported from the RT mechanism 50, it is opened to the atmospheric pressure. However, after the transport, the door valve 61 is closed and the vacuum exhaust device 12 exhausts the air to enter a high vacuum state. Then, the door valve 62 arranged between the heating chamber 20 is opened and the tray 70 is conveyed. After the tray 70 is transported to the heating chamber 20, the door valve 62 with the adjacent heating chamber 20 is closed, the pressure is returned to the atmospheric pressure again, and the next tray 70 is transported. At this time, the L / UL chamber 10 is opened to atmospheric pressure after the door valve 62 with the heating chamber 20 is closed. Therefore, the internal space of the heating chamber 20 is always kept in a high vacuum state.

  A heating device 23 is provided in the heating chamber (H chamber) 20 to raise the temperature of the substrate 2 to a temperature suitable for film formation. The heating chamber 20 is provided with an evacuation device 22 for evacuating the inside thereof. Similarly, the heating chamber 20 is provided with a partition wall 21 having a reflector (reflector) function at the center thereof, and the heating chamber is divided into a first space 20A and a second space 20B. The first space 20A handles the substrate (object to be processed) 2 transferred to the first space 30A of the film forming chamber 30, and the second space 20B is the substrate (processed) transferred to the second space 30B of the film forming chamber 30. Body) 2 is handled.

  In FIG. 1, the first space 20 </ b> A and the second space 20 </ b> B are completely partitioned by the partition wall 21 and are not independent from each other (not shown in the drawing, ) A configuration example is shown in which some of the components communicate with each other. However, although not shown in the drawing, the first space 20A and the second space 20B do not necessarily have to be in communication with each other, and the first space 20A and the second space 20B are independent of each other. In addition, a partition wall 21 may be provided. In the case of the configuration in which the first space 20A and the second space 20B are communicated with each other, it is only necessary to have at least one vacuum exhaust device, so that a low-cost system can be constructed. On the other hand, in the case of an independent space configuration, at least one vacuum evacuation device for evacuating each space is required individually, but operations such as vacuum processing and maintenance should be performed separately. Since there is a merit that can be achieved, a configuration in which the spaces are independent from each other may be employed.

The film forming chamber (SP chamber) 30 is connected to the heating chamber (H chamber) 20 via two door valves 63.
One of the door valves 63 carries the tray 70A (70) on which the substrate (object to be processed) 2 heat-treated in the heating chamber (H chamber) 20 is loaded into the first space 30A of the film forming chamber 30, or This is used when the tray 70A (70) after film formation is carried out from the first space 30A of the film formation chamber 30 to the heating chamber (H chamber) 20. Similarly, the other of the door valves 63 carries the tray 70B (70) on which the substrate (object to be processed) 2 heat-treated in the heating chamber (H chamber) 20 is loaded into the second space 30B of the film forming chamber 30. Or, it is used when the tray 70B (70) after film formation is carried out from the second space 30B of the film formation chamber 30 to the heating chamber (H chamber) 20.

In the film forming chamber (SP chamber) 30, the substrate 2 is subjected to film forming processing by the film forming unit 33.
In particular, in the film forming apparatus 1 according to the embodiment of the present invention, the film forming chamber 30 is divided into the independent first space 30A and the second space 30B, and the vacuum exhaust device 32 is used to evacuate the interior of each. And the film-forming unit 33 is arrange | positioned for every space. That is, the vacuum exhaust device 32A and the film forming unit 33A are for the first space 30A, and the vacuum exhaust device 32B and the film forming unit 33B are for the second space 30B.

The film forming apparatus according to the embodiment of the present invention can perform the film forming process in each of the independent first space 30A and second space 30B. Therefore, film formation can be performed simultaneously (in parallel) on two substrates (objects to be processed), and productivity can be improved. In addition, since the film forming chamber 30 is divided into two independent spaces, it is not necessary to add an apparatus, and the apparatus can be reduced in cost and space. Further, since the first space 30A and the second space 30B are independent from each other, one is performing vacuum processing (for example, film formation processing) while the other is performing maintenance processing (for example, target replacement). Can be performed simultaneously. Therefore, the film forming apparatus according to the embodiment of the present invention has a high degree of freedom in its operation and can realize a flexible operation state.
The film forming unit 33 is not particularly limited, and examples thereof include a cathode provided with a sputtering target and a parallel plate type electrode for CVD.

In such a film forming apparatus 1, the substrate 2, which is an object to be processed, is subjected to processing such as heating and film formation while being mounted on the transfer apparatus and being transferred.
The transport apparatus that transports the substrate 2 includes a tray 70 (carrier) that holds the substrate 2 and a line 80 that transports the tray 70 on which the substrate 2 is held. In addition, the transport device transports the substrate 2 vertically.

Here, the reason why the substrate 2 is placed vertically (vertical conveyance) is mainly that the substrate itself has become larger and thinner with the widespread use of large liquid crystal displays and plasma displays. When the substrate is placed horizontally, the installation area of the film forming apparatus itself increases accordingly, so that the vertical type is intended to save space. Further, in the case of horizontal placement, the substrate 2 is bent due to its own weight, and it is difficult to maintain flatness, and uniform film formation becomes difficult.
In addition, there is a method in which the substrate is placed horizontally on the support base and the film is formed by sputtering down. In this case, the film characteristics such as foreign matter adhering to the film formation surface and mixed in the film are also present. This is because it is better to refrain from adopting it because there is a risk of deteriorating the device characteristics.

In the film forming apparatus 1 according to the embodiment of the present invention, in the film forming chamber 30, the first space 30A and the second space 30B each include four lines 80 each composed of an outward path and a return path (outward path lines and There are two sets when the number of return lines is one set), and all of these four lines 80 are arranged to penetrate the L / UL chamber 10 and the heating chamber 20.
In the film forming apparatus 1 according to the embodiment of the present invention, a tray 70 is provided in the first space 30A and the second space 30B of the film forming chamber 30 from the L / UL chamber 10 through the heating chamber 20 and the first space 30A and the second space 30B. The first lines 81A and 81B serving as the forward paths transported to the second space 30B, and the return paths transported from the first space 30A and the second space 30B of the film forming chamber 30 to the L / UL chamber 10 through the heating chamber 20. Second lines 82A and 82B are provided. The first lines 81A and 81B and the second lines 82A and 82B are all disposed through the L / UL chamber 10 and the heating chamber 20.

  Further, the film forming apparatus 1 moves the tray 70 from the first lines 81A and 81B (outward path) to the second lines 82A and 82B (return path) in the lateral direction with respect to the lines (not shown). )). This moving mechanism has a mechanism that once lifts the tray 70 on the first lines 81A and 81B and transfers it to the second lines 82A and 82B.

FIG. 2 is a perspective view showing a schematic configuration of the tray 70.
As shown in FIG. 2, the tray 70 has a frame-like frame 71 made of aluminum or the like, a magnet 72 provided along the upper side of the frame 71, and a columnar shape provided along the lower side of the frame 71. Slider shaft 73, a substrate receiver 74 for receiving the load of the substrate 2 and maintaining the level of the substrate 2; a clamp 75 for holding the substrate 2 on the tray 70; And a mask 76 for covering the film region.

  The track 80 includes a lower support mechanism 84 configured to be able to transport the tray 70 while supporting the load of the tray 70, and an upper support mechanism 88 configured to be able to support the upper portion of the tray 70 in a non-contact manner. . The tray 70 is configured to be movable while being held substantially vertically by the lower support mechanism 84 and the upper support mechanism 88.

FIG. 3 is a perspective view showing the configuration of the lower support mechanism 84.
As shown in FIG. 3, the lower support mechanism 84 includes a motor 85 and a roller 86.
The roller 86 includes a U-shaped groove 86 a that guides the tray 70. When the motor 85 is driven, the roller 86 rotates and the tray 70 moves horizontally on the roller 86. Specifically, the slider shaft 73 provided at the lower portion of the tray 70 is engaged with the groove portion 86a of the roller 86, so that the tray 70 can be moved horizontally.

FIG. 4 is an explanatory diagram showing the configuration of the upper support mechanism 88.
As shown in FIG. 4, the upper support mechanism 88 is provided with a plurality of magnets 89. A magnet 72 is also attached to the upper side of the tray 70, and is arranged so that the magnet 89 and the magnet 72 face each other in the vertical direction and the magnets 89 and 72 are attracted to each other.

  With this configuration, the magnets 89 and 72 are attracted to each other, and the tray 70 can be held in a vertical state. That is, by holding the substrate 2 vertically, it is possible to suppress an increase in the installation area of the film forming apparatus 1 accompanying an increase in the size of the substrate 2 and to avoid the influence of the bending of the large substrate 2.

In particular, in the film forming apparatus 1 of the present embodiment, at least the contact portion of one of the slide shaft 73 or the roller 86 of the lower support mechanism 84 has silicon (Si), aluminum (Al), oxygen (O), and nitrogen (N). It is preferable that at least the other contact portion of the slide shaft 73 or the roller 86 is made of SUS (stainless steel).
By configuring the contact portion of the slide shaft 73 or the roller 86 with the material as described above, wear of the slide shaft 73 and the roller 86 can be suppressed, dust generation due to wear can be reduced, and the life of the apparatus can be extended. Can be achieved.

  In the film forming apparatus 1 according to the embodiment of the present invention, the substrate (object to be processed) 2 is moved from the L / UL chamber 10 by a tray (conveyance device) 70 that moves along the first lines (outward paths) 81A and 81B. Through the heating chamber 20, the film is carried into the first space 30 </ b> A and the second space 30 </ b> B of the film forming chamber 30, and the film is formed in the film forming chamber 30. Thereafter, the transfer device for placing the substrate 2 is moved from the first line (forward path) 81A, 81B to the second line (return path) 82A by the moving device in the first space 30A and the second space 30B, respectively. Moved to 82B. After that, along the second tracks 82A and 82B, the first space 30A and the second space 30B are transported to the L / UL chamber 10 through the heating chamber 20 from the inside.

  In the embodiment of the present invention, the substrate transfer efficiency can be improved by providing the forward path and the return path as described above. Moreover, the board | substrate can be prepared and taken out in the L / UL chamber 10 in a short time, and a tact can be shortened. Thereby, productivity can be improved in the film forming apparatus according to the embodiment of the present invention.

Next, the operation when forming a film on the substrate 2 using the film forming apparatus 1 according to the embodiment of the present invention will be described with reference to FIG.
In the following description, the movement of the substrate 2 on which the film formation process is performed in the first space 30A of the film formation chamber 30 will be described, but the substrate 2 on which the film formation process is performed in the second space 30B is also described. This is the same as in the case of the first space 30A.
First, the substrate 2 is transported from other places to the front of the POS mechanism 40 of the film forming apparatus 1 in a horizontal state. Then, after mounting the board | substrate 2 on the tray (not shown) made into the state of lying down (laid down), a tray is stood | started up so that it may become a vertical state. The tray 70 (2) shown in the POS mechanism 40 is in the raised state. At this time, the substrate 2 is in contact with the substrate receiver 74 of the tray 70, and the substrate 2 is held on the tray 70 by the clamp 75. (See FIG. 2).

  The tray 70 on which the substrate 2 is mounted is transported to the third RT mechanism 51C via the first RT mechanism 51A of the RT mechanism 50. In the third RT mechanism 51 </ b> C, the tray 70 is set in a direction in which the tray 70 can be conveyed to the first space 10 </ b> A of the L / UL chamber 10.

Then, after the door valve 61 of the L / UL chamber 10 is opened, the tray 70 is placed on the first line 81A serving as the forward path, and the tray 70 is placed in the first space of the L / UL chamber 10 on the first line 81A. Transport to 10A.
Further, as will be described later, in the L / UL chamber 10, the tray 70 on which the film-formed substrate 2 is placed is conveyed on the second line 82A (return path). Transport to 50.
When the tray 70 is conveyed to the L / UL chamber 10, the door valve 61 is closed, and then the chamber is evacuated by the vacuum exhaust device 12 to bring the L / UL chamber 10 into a vacuum state. After the inside of the L / UL chamber 10 is in a vacuum state, the door valve 62 with the adjacent heating chamber 20 is opened, and the tray 70 is transferred to the first space 20A of the heating chamber 20 through the first line 81A. .

  In the L / UL chamber 10, after the tray 70 is transported, the door valve 62 with the heating chamber 20 is closed, the pressure is returned to the atmospheric pressure again, and the next tray 70 is transported. At this time, since the L / UL chamber 10 is opened to the atmospheric pressure after the door valve 62 with the heating chamber 20 is closed, the high vacuum of the heating chamber 20 is maintained.

When the tray 70 is conveyed to the heating chamber 20, the door valve 62 is closed.
Thereafter, the substrate 2 is heated to a temperature suitable for film formation by the heating device 63. When the heating of the substrate 2 is completed, the door valve 63 to the film forming chamber 30 is opened, and the tray 70 is transferred to the film forming chamber 30 through the first line 81A. In addition, the tray 70 on which the substrate 2 that has been subjected to the film formation process in the film formation chamber 30 is carried by the second line 82A (return path).
After transporting the tray 70, the door valve 63 to the film forming chamber 30 is closed.

  In the film forming chamber 30, the substrate 2 is subjected to film forming processing by the film forming unit 33. Here, in this film forming apparatus 1, the film forming process in the film forming chamber 30 employs a fixed film forming method in which the film is formed with the tray 70 fixed and stationary. Further, since a mask 76 is disposed on the periphery of the substrate 2 (see FIG. 2), only a necessary region of the substrate 2 is formed.

  Here, in the film forming apparatus 1, the film forming chamber 30 is divided into an independent first space 30 </ b> A and a second space 30 </ b> B, and a film forming unit 33 is arranged for each space, and the first space. In the 30A and the second space 30B, four lines each including an outward path and a return path are arranged. That is, in the film forming chamber 30, the tray 70 is disposed in each of the first space 30A and the second space 30B, and the substrate 2 mounted on each tray 70 can be formed simultaneously (in parallel). .

When film formation is completed, the tray 70 is moved laterally with respect to the track by a moving mechanism (not shown), and transferred from the first track 81A serving as the forward route to the second track 82A serving as the return route.
Thereafter, the tray 70 is conveyed along the second line 82 </ b> A and guided from the film formation chamber 30 to the L / UL chamber 10 through the heating chamber 20.

The door valve 63 with the heating chamber 20 is opened, and the tray 70 is conveyed to the first space 20 </ b> A of the heating chamber 20.
Further, the tray 70 on which the substrate 2 before film formation is loaded is transported from the heating chamber 20 to the film formation chamber 30 via the first line 81A (outward path).
When the tray 70 is conveyed to the heating chamber 20, the door valve 63 is closed.

The door valve 62 with the L / UL chamber 10 is opened, and the tray 70 is transported to the first space 10 </ b> A of the L / UL chamber 10. In addition, the tray 70 on which the substrate 2 before film formation is loaded is conveyed to the heating chamber 20 from the L / UL chamber 10 through the first line 81A (outward path).
When the tray 70 is conveyed to the L / UL chamber 10, the door valve 62 is closed.

  When transporting the tray 70 from the heating chamber 20 to the L / UL chamber 10, the L / UL chamber 10 is maintained at a high vacuum by the vacuum exhaust device 12. The door valve 62 is closed, and then the L / UL chamber 10 is opened to atmospheric pressure. When the L / UL chamber 10 returns to atmospheric pressure, the tray 70 is transferred to the third RT unit 51C of the RT mechanism 50. At this time, since the L / UL chamber 10 is opened to the atmospheric pressure after the door valve 62 with the heating chamber 20 is closed, the high vacuum of the heating chamber 20 is maintained.

The tray 70 conveyed to the RT mechanism 51C is conveyed from the third RT unit 51C to the first POS mechanism 40A of the POS mechanism 40 via the first RT unit 51A.
Thereafter, in the POS mechanism 40 (first POS mechanism 40A), the film-formed substrate 2 is removed from the tray 70 and carried outside.

As described above, in the embodiment of the present invention, the substrate transfer efficiency can be improved by providing the forward path and the return path, respectively. In addition, preparation and removal of the object to be processed in the L / UL chamber can be performed in a short time, and the tact can be shortened.
Further, in the film forming apparatus according to the embodiment of the present invention, the film forming process can be performed in each of the first space and the second space independent in the film forming chamber. Film formation processing can be performed, and productivity can be improved. Further, since the film forming chamber is divided into two independent spaces, it is not necessary to add an apparatus, and the cost of the apparatus can be reduced and the space can be saved.
As a result, the film forming apparatus according to the embodiment of the present invention can save space, improve the substrate transfer system, and improve productivity.

In the film forming apparatus according to the embodiment of the present invention, the SP chamber is divided into an independent first space and a second space, and a film forming unit is arranged for each space. Since the film formation process can be performed in the independent first space and the second space, the film formation process can be performed simultaneously (in parallel) on two substrates (objects to be processed). Can be improved. In addition, since the SP room is divided into two independent spaces, it is not necessary to increase the number of devices, and the cost and space of the devices can be reduced.
Further, in the film forming apparatus according to the embodiment of the present invention, four lines each including an outward path and a return path are disposed through the L / UL chamber, the H chamber, and the SP chamber, and the object to be processed is placed in the outbound path. Along the L / UL chamber, through the H chamber, and into the first space and the second space, respectively, and after the film formation in the SP chamber, the object to be processed is the first space and the Inside the second space, it is moved from the forward path to the return path by the moving mechanism, and is carried along the return path from the first space and the second space to the L / UL chamber through the H chamber. By providing the forward path and the return path, the conveyance efficiency of the object to be processed can be improved. In addition, preparation and removal of the object to be processed in the L / UL chamber can be performed in a short time, and the tact can be shortened.

  The film forming apparatus according to the embodiment of the present invention has been described above. However, the present invention is not limited to this, and can be changed as appropriate without departing from the spirit of the invention.

  The present invention can be widely applied to an in-line film forming apparatus that vertically conveys a substrate.

DESCRIPTION OF SYMBOLS 1 Film-forming apparatus 2 Substrate (object to be processed)
10 L / UL room 20 Heating room (H room)
30 Deposition chamber (SP chamber)
40 POS mechanism 50 RT mechanism 70 Tray 81A, 81B First line (outward)
82A, 82B Second track (return)

Claims (5)

L / UL room,
H room communicating with the L / UL room;
An SP room that communicates with the H room and is divided into an independent first space and a second space;
A film forming unit disposed in each of the first space and the second space;
An evacuation device provided independently in the L / UL chamber, the H chamber, the first space, and the second space, for evacuating the interior of each,
Four lines that pass through the L / UL chamber and the H chamber, and that are respectively arranged in the first space and the second space, each consisting of an outward path and a return path,
The object to be processed is carried along the forward path from the L / UL chamber through the H chamber to the inside of the first space and the second space, respectively, and along the return path, the first space and the first space A transfer device for transferring the object to be processed from the inside of the two spaces to the L / UL chamber through the H chamber;
In the first space and the second space, a moving mechanism that moves the transfer device from the forward path to the return path;
A film forming apparatus comprising:
The L / UL chamber is connected to the RT mechanism through two door valves,
The RT mechanism includes a first RT mechanism, a second RT mechanism, and a third RT mechanism,
Between the third RT mechanism and the first RT mechanism, the object to be processed transported to the first space is processed,
A film forming apparatus characterized in that an object to be processed conveyed to the second space is processed between the third RT mechanism and the second RT mechanism . The film forming apparatus according to claim 1, wherein the transfer device transfers the object to be processed in a vertical type. The film forming unit, the film forming apparatus according to claim 1 or 2, characterized in that a cathode for sputtering. The film forming unit, the film forming apparatus according to claim 1 or 2, characterized in that an electrode of a parallel plate type for CVD. The transport device includes a cylindrical slide shaft at a lower portion thereof,
The track is a plurality of rollers provided with a U-shaped groove for guiding the conveying device,
At least the contact portion of one of the slide shaft or the roller is composed of a bulk body containing silicon, aluminum, oxygen, and nitrogen,
Wherein at least the contact portion other of the slide shaft or the roller, the film forming apparatus according to any one of claims 1 to 4, characterized in that it is constructed from stainless steel.

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