JP5581400B2 - 給電装置 - Google Patents
給電装置 Download PDFInfo
- Publication number
- JP5581400B2 JP5581400B2 JP2012547687A JP2012547687A JP5581400B2 JP 5581400 B2 JP5581400 B2 JP 5581400B2 JP 2012547687 A JP2012547687 A JP 2012547687A JP 2012547687 A JP2012547687 A JP 2012547687A JP 5581400 B2 JP5581400 B2 JP 5581400B2
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- Japan
- Prior art keywords
- electrode
- capacitor
- power supply
- movable body
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 claims description 40
- 238000012546 transfer Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 101710201952 Photosystem II 22 kDa protein, chloroplastic Proteins 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 102100021941 Sorcin Human genes 0.000 description 2
- 101000741271 Sorghum bicolor Phosphoenolpyruvate carboxylase 1 Proteins 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J5/00—Circuit arrangements for transfer of electric power between ac networks and dc networks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/05—Circuit arrangements or systems for wireless supply or distribution of electric power using capacitive coupling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (4)
- 可動体の構成部品に対して非接触式で給電する給電装置であって、
キャパシタと交流電源とを備え、キャパシタは、対向配置される一対の電極間で機械的に分離されたものであり、一方の電極を固定配置すると共にこの一方の電極に交流電源からの出力を接続し、上記構成部品に接続される他方の電極を、電極間距離を一定に維持しながら相対移動するように可動体に装着すると共に交流電源の負荷に接続したものにおいて、
整流素子と他のキャパシタとを有する整流回路を更に備え、他方の電極からの帰還回路を接続したことを特徴とする給電装置。 - 可動体の構成部品に対して非接触式で給電する給電装置であって、
キャパシタと交流電源とを備え、キャパシタは、対向配置される一対の電極間で機械的に分離されたものであり、一方の電極を固定配置すると共にこの一方の電極に交流電源からの出力を接続し、上記構成部品に接続される他方の電極を、電極間距離を一定に維持しながら相対移動するように可動体に装着すると共に交流電源の負荷に接続したものにおいて、
前記負荷は、前記キャパシタと共に直列共振回路を構成するインダクタであり、前記キャパシタの他方の電極を構成する部材表面に渦巻き状にインダクタを一体に形成してなることを特徴とする給電装置。 - 前記可動体は、回転軸と、この回転軸に連結され、静電チャック付きロボットハンドを有するロボットアームとを備えた搬送用ロボットであり、前記構成部品を静電チャックとし、前記インダクタの両端電圧を整流して当該静電チャックのチャック電極に吸着用の電圧を印加し得ることを特徴とする請求項2記載の給電装置。
- 可動体の構成部品に対して非接触式で給電する給電装置であって、
キャパシタと交流電源とを備え、キャパシタは、長さの異なる2本の筒状の電極を同心に配置することで両電極間が機械的に分離されたものであり、
一方の電極を固定配置すると共に前記一方の電極に交流電源からの出力を接続し、
上記構成部品に接続される他方の電極を、電極間距離を一定に維持しながら相対移動するように可動体に装着すると共に交流電源の負荷に接続したことを特徴とする給電装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012547687A JP5581400B2 (ja) | 2010-12-07 | 2011-11-29 | 給電装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010272224 | 2010-12-07 | ||
JP2010272224 | 2010-12-07 | ||
PCT/JP2011/006636 WO2012077296A1 (ja) | 2010-12-07 | 2011-11-29 | 給電装置 |
JP2012547687A JP5581400B2 (ja) | 2010-12-07 | 2011-11-29 | 給電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012077296A1 JPWO2012077296A1 (ja) | 2014-05-19 |
JP5581400B2 true JP5581400B2 (ja) | 2014-08-27 |
Family
ID=46206809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012547687A Active JP5581400B2 (ja) | 2010-12-07 | 2011-11-29 | 給電装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5581400B2 (ja) |
TW (1) | TW201240265A (ja) |
WO (1) | WO2012077296A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016194336A1 (ja) * | 2015-05-29 | 2016-12-08 | 株式会社アルバック | 静電チャック付き搬送ロボットの制御システム |
JP2018153909A (ja) * | 2016-08-31 | 2018-10-04 | 株式会社リューテック | 非接触給電ロボット |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09300270A (ja) * | 1996-05-21 | 1997-11-25 | Shinko Electric Co Ltd | 多関節ロボットのハンド部給電装置 |
JPH09312942A (ja) * | 1996-05-21 | 1997-12-02 | Hitachi Ltd | 非接触式集電方法およびその装置 |
JP3293891B2 (ja) * | 1992-08-14 | 2002-06-17 | 株式会社アルバック | 搬送用ロボットの試料把持部の静電チャックへの供電手段、及びその供電手段を有する搬送用ロボット |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5170054B2 (ja) * | 2009-10-07 | 2013-03-27 | 国立大学法人宇都宮大学 | 電力供給システム、及びそのための可動体と固定体 |
-
2011
- 2011-11-29 WO PCT/JP2011/006636 patent/WO2012077296A1/ja active Application Filing
- 2011-11-29 JP JP2012547687A patent/JP5581400B2/ja active Active
- 2011-12-02 TW TW100144380A patent/TW201240265A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3293891B2 (ja) * | 1992-08-14 | 2002-06-17 | 株式会社アルバック | 搬送用ロボットの試料把持部の静電チャックへの供電手段、及びその供電手段を有する搬送用ロボット |
JPH09300270A (ja) * | 1996-05-21 | 1997-11-25 | Shinko Electric Co Ltd | 多関節ロボットのハンド部給電装置 |
JPH09312942A (ja) * | 1996-05-21 | 1997-12-02 | Hitachi Ltd | 非接触式集電方法およびその装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201240265A (en) | 2012-10-01 |
JPWO2012077296A1 (ja) | 2014-05-19 |
WO2012077296A1 (ja) | 2012-06-14 |
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