JP5579177B2 - カプセル封入されたオプトエレクトロニクスデバイスおよびカプセル封入されたオプトエレクトロニクスデバイスの製造方法 - Google Patents

カプセル封入されたオプトエレクトロニクスデバイスおよびカプセル封入されたオプトエレクトロニクスデバイスの製造方法 Download PDF

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Publication number
JP5579177B2
JP5579177B2 JP2011517746A JP2011517746A JP5579177B2 JP 5579177 B2 JP5579177 B2 JP 5579177B2 JP 2011517746 A JP2011517746 A JP 2011517746A JP 2011517746 A JP2011517746 A JP 2011517746A JP 5579177 B2 JP5579177 B2 JP 5579177B2
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Prior art keywords
layer
optoelectronic device
electrode layer
diffusion barrier
deposited
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Japanese (ja)
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JP2011528156A5 (enExample
JP2011528156A (ja
Inventor
ホイザー カルステン
シュミート クリスティアン
シュレンカー ティルマン
グレッペル ペーター
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011517746A 2008-07-14 2009-06-19 カプセル封入されたオプトエレクトロニクスデバイスおよびカプセル封入されたオプトエレクトロニクスデバイスの製造方法 Expired - Fee Related JP5579177B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008033017A DE102008033017A1 (de) 2008-07-14 2008-07-14 Verkapseltes optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102008033017.5 2008-07-14
PCT/DE2009/000858 WO2010006571A1 (de) 2008-07-14 2009-06-19 Verkapseltes optoelektronisches bauelement und verfahren zu dessen herstellung

Publications (3)

Publication Number Publication Date
JP2011528156A JP2011528156A (ja) 2011-11-10
JP2011528156A5 JP2011528156A5 (enExample) 2012-06-28
JP5579177B2 true JP5579177B2 (ja) 2014-08-27

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JP2011517746A Expired - Fee Related JP5579177B2 (ja) 2008-07-14 2009-06-19 カプセル封入されたオプトエレクトロニクスデバイスおよびカプセル封入されたオプトエレクトロニクスデバイスの製造方法

Country Status (7)

Country Link
US (1) US8530928B2 (enExample)
EP (1) EP2301092B1 (enExample)
JP (1) JP5579177B2 (enExample)
KR (1) KR101554763B1 (enExample)
CN (1) CN102099943B (enExample)
DE (1) DE102008033017A1 (enExample)
WO (1) WO2010006571A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102029563B1 (ko) 2008-12-11 2019-10-07 오스람 오엘이디 게엠베하 유기발광다이오드 및 조명수단
DE102009035640A1 (de) 2009-07-31 2011-02-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Bauteils mit mindestens einem organischen Material und Bauteil mit mindestens einem organischen Material
DE102011076733B4 (de) 2011-05-30 2023-12-28 Pictiva Displays International Limited Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelements, Verwendung einer Glasfritte zur Kantenpassivierung einer Elektrode eines optoelektronischen Bauelements, und Verwendung einer Glasfritte zur Passivierung einer oder mehrerer metallischer Busleitungen eines optoelektronischen Bauelements
KR102113600B1 (ko) * 2012-12-07 2020-05-21 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
KR102113175B1 (ko) * 2013-08-19 2020-05-21 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102203447B1 (ko) * 2014-05-27 2021-01-18 엘지디스플레이 주식회사 유기발광 표시패널 및 그 제조방법
DE102015106631A1 (de) * 2015-04-29 2016-11-03 Osram Oled Gmbh Optoelektronisches Halbleiterbauteil
CN109768184B (zh) * 2019-02-18 2020-10-27 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制备方法

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US20020041916A1 (en) * 2000-10-06 2002-04-11 Burdick William E. Method for distributed production of beer and restaurant services
JP2003168571A (ja) * 2001-11-29 2003-06-13 Ulvac Japan Ltd 有機ｅｌ素子
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
EP1351321B1 (en) * 2002-04-01 2013-12-25 Konica Corporation Support and organic electroluminescence element comprising the support
US6710542B2 (en) * 2002-08-03 2004-03-23 Agilent Technologies, Inc. Organic light emitting device with improved moisture seal
WO2004014644A1 (ja) * 2002-08-07 2004-02-19 Kabushiki Kaisha Toyota Chuo Kenkyusho 密着層を備える積層体及び保護膜を備える積層体
JP4225030B2 (ja) * 2002-10-30 2009-02-18 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子
JP2004152664A (ja) * 2002-10-31 2004-05-27 Seiko Epson Corp 表示パネル及びその表示パネルを備えた電子機器並びに表示パネルの製造方法
JP2004192822A (ja) * 2002-12-06 2004-07-08 Konica Minolta Holdings Inc 有機エレクトロルミネッセンス素子およびその製造方法
JP2005085604A (ja) * 2003-09-09 2005-03-31 Seiko Epson Corp 有機金属化合物の薄膜形成方法、有機金属化合物薄膜、およびこれを備えた有機電子デバイスの製造方法、有機電子デバイス、有機エレクトロルミネッセンスの製造方法、有機エレクトロルミネッセンス、及び電子機器
JP2007535144A (ja) * 2004-04-22 2007-11-29 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 有機の電子的な素子のためのカプセル封止、カプセル封止の製作法ならびにカプセル封止の使用法
US8486487B2 (en) * 2005-02-17 2013-07-16 Konica Minolta Holdings, Inc. Gas barrier film, gas barrier film manufacturing method, resin substrate for organic electroluminescent device using the aforesaid gas barrier film, and organic electroluminescent device using the aforementioned gas barrier film
JP4946860B2 (ja) * 2005-02-17 2012-06-06 コニカミノルタホールディングス株式会社 ガスバリアフィルム及びその製造方法、並びに該ガスバリアフィルムを用いた、有機ｅｌ素子用樹脂基材、有機ｅｌ素子
JPWO2006092943A1 (ja) * 2005-03-02 2008-08-07 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子、表示装置及び照明装置
GB2439001B (en) * 2005-03-18 2011-03-09 Konica Minolta Holdings Inc Method of forming organic compound layer, method of manufacturing organic el element and organic el element
US9130183B2 (en) * 2005-08-18 2015-09-08 Konica Minolta, Inc. Organic electroluminescent element, displaying device and lighting device
WO2007032175A1 (ja) * 2005-09-12 2007-03-22 Idemitsu Kosan Co., Ltd. 導電性積層体及び有機ｅｌ素子
WO2007049427A1 (ja) * 2005-10-28 2007-05-03 Konica Minolta Holdings, Inc. 有機エレクトロルミネッセンス素子の製造方法及び製造装置
EP2463930B1 (en) * 2006-01-05 2017-04-12 Konica Minolta Holdings, Inc. Organic electroluminescent device, display and illuminating device

Also Published As

Publication number Publication date
CN102099943B (zh) 2016-03-09
US8530928B2 (en) 2013-09-10
US20110266590A1 (en) 2011-11-03
KR20110040750A (ko) 2011-04-20
WO2010006571A1 (de) 2010-01-21
DE102008033017A1 (de) 2010-01-21
EP2301092A1 (de) 2011-03-30
KR101554763B1 (ko) 2015-09-21
JP2011528156A (ja) 2011-11-10
EP2301092B1 (de) 2019-05-22
CN102099943A (zh) 2011-06-15

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