JP5574597B2 - Ｃｍｐスラリの注入のための方法及び機器 - Google Patents

Ｃｍｐスラリの注入のための方法及び機器 Download PDF

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JP5574597B2
JP5574597B2 JP2008300248A JP2008300248A JP5574597B2 JP 5574597 B2 JP5574597 B2 JP 5574597B2 JP 2008300248 A JP2008300248 A JP 2008300248A JP 2008300248 A JP2008300248 A JP 2008300248A JP 5574597 B2 JP5574597 B2 JP 5574597B2
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injector
slurry
polishing pad
polishing
pad
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JP2010114398A (ja
JP2010114398A5 (https=
Inventor
ボラッキー レオナルド
フィリポシアン アラ
サンプルノ ヤサ
ゼン シアン
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アラカ インコーポレイテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008300248A 2008-10-31 2008-11-25 Ｃｍｐスラリの注入のための方法及び機器 Active JP5574597B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/262,579 2008-10-31
US12/262,579 US8197306B2 (en) 2008-10-31 2008-10-31 Method and device for the injection of CMP slurry

Publications (3)

Publication Number Publication Date
JP2010114398A JP2010114398A (ja) 2010-05-20
JP2010114398A5 JP2010114398A5 (https=) 2012-01-19
JP5574597B2 true JP5574597B2 (ja) 2014-08-20

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ID=40139596

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JP2008300248A Active JP5574597B2 (ja) 2008-10-31 2008-11-25 Ｃｍｐスラリの注入のための方法及び機器

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US (1) US8197306B2 (https=)
JP (1) JP5574597B2 (https=)
KR (1) KR101394745B1 (https=)
GB (1) GB2464995A (https=)
TW (1) TWI486233B (https=)

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EP4272241A1 (en) 2021-02-16 2023-11-08 Araca Incorporated Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

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KR101710425B1 (ko) * 2015-06-02 2017-03-08 주식회사 케이씨텍 슬러리 공급 유닛 및 이를 구비하는 화학 기계적 기판 연마장치
US11077536B2 (en) 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
KR102070705B1 (ko) * 2018-02-13 2020-01-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치의 정반 홈파기 장치
KR102835295B1 (ko) 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4272241A1 (en) 2021-02-16 2023-11-08 Araca Incorporated Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Also Published As

Publication number Publication date
TWI486233B (zh) 2015-06-01
KR101394745B1 (ko) 2014-05-26
GB2464995A (en) 2010-05-05
KR20100048830A (ko) 2010-05-11
JP2010114398A (ja) 2010-05-20
US8197306B2 (en) 2012-06-12
GB0820451D0 (en) 2008-12-17
TW201034794A (en) 2010-10-01
US20100112911A1 (en) 2010-05-06

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