KR101394745B1 - Ｃｍｐ 슬러리의 주입을 위한 방법 및 장치 - Google Patents

Ｃｍｐ 슬러리의 주입을 위한 방법 및 장치 Download PDF

Info

Publication number
KR101394745B1
KR101394745B1 KR1020080115432A KR20080115432A KR101394745B1 KR 101394745 B1 KR101394745 B1 KR 101394745B1 KR 1020080115432 A KR1020080115432 A KR 1020080115432A KR 20080115432 A KR20080115432 A KR 20080115432A KR 101394745 B1 KR101394745 B1 KR 101394745B1
Authority
KR
South Korea
Prior art keywords
injector
slurry
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020080115432A
Other languages
English (en)
Korean (ko)
Other versions
KR20100048830A (ko
Inventor
렌 보루키
아라 필립포시안
야사 삼푸르노
시안 텡
Original Assignee
아라카 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라카 인코포레이티드 filed Critical 아라카 인코포레이티드
Publication of KR20100048830A publication Critical patent/KR20100048830A/ko
Application granted granted Critical
Publication of KR101394745B1 publication Critical patent/KR101394745B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020080115432A 2008-10-31 2008-11-19 Ｃｍｐ 슬러리의 주입을 위한 방법 및 장치 Active KR101394745B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/262,579 2008-10-31
US12/262,579 US8197306B2 (en) 2008-10-31 2008-10-31 Method and device for the injection of CMP slurry

Publications (2)

Publication Number Publication Date
KR20100048830A KR20100048830A (ko) 2010-05-11
KR101394745B1 true KR101394745B1 (ko) 2014-05-26

Family

ID=40139596

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080115432A Active KR101394745B1 (ko) 2008-10-31 2008-11-19 Ｃｍｐ 슬러리의 주입을 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US8197306B2 (https=)
JP (1) JP5574597B2 (https=)
KR (1) KR101394745B1 (https=)
GB (1) GB2464995A (https=)
TW (1) TWI486233B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160142000A (ko) * 2015-06-02 2016-12-12 주식회사 케이씨텍 슬러리 공급 유닛 및 이를 구비하는 화학 기계적 기판 연마장치
EP4272241A1 (en) 2021-02-16 2023-11-08 Araca Incorporated Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100494470B1 (ko) 2002-11-12 2005-06-10 삼성전기주식회사 광 마우스의 이미지 데이터 처리 장치 및 그 방법
JP6139188B2 (ja) * 2013-03-12 2017-05-31 株式会社荏原製作所 研磨装置および研磨方法
KR101444611B1 (ko) * 2013-07-08 2014-09-24 주식회사 엘지실트론 웨이퍼 연마장치
US9962801B2 (en) * 2014-01-07 2018-05-08 Taiwan Semiconductor Manufacturing Company Limited Systems and methods for performing chemical mechanical planarization
US11077536B2 (en) 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
KR102070705B1 (ko) * 2018-02-13 2020-01-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치의 정반 홈파기 장치
KR102835295B1 (ko) 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
CN117260475B (zh) * 2023-11-09 2025-10-17 中国十七冶集团有限公司 一种用于二衬台车模板打磨设备及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997392A (en) 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JP2002178260A (ja) 2000-12-15 2002-06-25 Nec Kansai Ltd ポリッシング装置
JP2005501753A (ja) 2001-09-10 2005-01-20 マルチプレーナーテクノロジーズ インコーポレーテッド 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3342652A (en) * 1964-04-02 1967-09-19 Ibm Chemical polishing of a semi-conductor substrate
US4549374A (en) * 1982-08-12 1985-10-29 International Business Machines Corporation Method for polishing semiconductor wafers with montmorillonite slurry
US4910155A (en) * 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
JPH0697132A (ja) * 1992-07-10 1994-04-08 Lsi Logic Corp 半導体ウェハの化学機械的研磨装置、同装置のプラテンへの半導体ウェハ研磨用パッドの取付け方法、および同装置の研磨用複合パッド
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
JPH07299738A (ja) * 1994-05-11 1995-11-14 Mitsubishi Materials Corp ウエハ研磨装置
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
JPH11114811A (ja) * 1997-10-15 1999-04-27 Ebara Corp ポリッシング装置のスラリ供給装置
US5964413A (en) * 1997-11-05 1999-10-12 Mok; Peter Apparatus for dispensing slurry
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
KR20000000583A (ko) 1998-06-01 2000-01-15 윤종용 화학 물리적 연마 장치
US6184139B1 (en) * 1998-09-17 2001-02-06 Speedfam-Ipec Corporation Oscillating orbital polisher and method
US6347979B1 (en) * 1998-09-29 2002-02-19 Vsli Technology, Inc. Slurry dispensing carrier ring
US6187681B1 (en) * 1998-10-14 2001-02-13 Micron Technology, Inc. Method and apparatus for planarization of a substrate
JP2000246621A (ja) * 1999-02-26 2000-09-12 Toshiba Circuit Technol Kk ウエーハ研磨装置
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6283840B1 (en) * 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
US6284092B1 (en) * 1999-08-06 2001-09-04 International Business Machines Corporation CMP slurry atomization slurry dispense system
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
JP2002217146A (ja) * 2001-01-16 2002-08-02 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
US6398627B1 (en) * 2001-03-22 2002-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dispenser having multiple adjustable nozzles
US6641461B2 (en) * 2001-03-28 2003-11-04 Multi Planar Technologyies, Inc. Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
US6523215B2 (en) * 2001-04-04 2003-02-25 Saint-Gobain Abrasives Technology Company Polishing pad and system
JP2002370168A (ja) * 2001-06-15 2002-12-24 Hitachi Ltd 研磨方法および研磨装置
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
TWI252791B (en) * 2002-01-18 2006-04-11 Promos Technologies Inc Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
US6686284B2 (en) * 2002-02-06 2004-02-03 Taiwan Semiconductor Manufacturing Co., Ltd Chemical mechanical polisher equipped with chilled retaining ring and method of using
US6947862B2 (en) * 2003-02-14 2005-09-20 Nikon Corporation Method for simulating slurry flow for a grooved polishing pad
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US7021099B2 (en) * 2003-06-12 2006-04-04 General Motors Corporation Extraction system for hot formed parts
US6984166B2 (en) * 2003-08-01 2006-01-10 Chartered Semiconductor Manufacturing Ltd. Zone polishing using variable slurry solid content
KR100506942B1 (ko) * 2003-09-03 2005-08-05 삼성전자주식회사 화학적 기계적 연마장치
US6929533B2 (en) * 2003-10-08 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Methods for enhancing within-wafer CMP uniformity
US7335239B2 (en) * 2003-11-17 2008-02-26 Advanced Technology Materials, Inc. Chemical mechanical planarization pad
US6908370B1 (en) 2003-12-04 2005-06-21 Intel Corporation Rinse apparatus and method for wafer polisher
US7008302B2 (en) * 2004-05-07 2006-03-07 United Microelectronics Corp. Chemical mechanical polishing equipment and conditioning thereof
US6945857B1 (en) * 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US7097542B2 (en) * 2004-07-26 2006-08-29 Intel Corporation Method and apparatus for conditioning a polishing pad
WO2006127780A2 (en) * 2005-05-24 2006-11-30 Entegris, Inc. Cmp retaining ring
KR100632468B1 (ko) * 2005-08-31 2006-10-09 삼성전자주식회사 리테이너 링, 연마 헤드 및 화학적 기계적 연마 장치
US7201634B1 (en) * 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
JP2007180309A (ja) * 2005-12-28 2007-07-12 Toshiba Corp 研磨装置および研磨方法
TW200736001A (en) * 2006-03-27 2007-10-01 Toshiba Kk Polishing pad, method of polishing and polishing apparatus
JP2008263120A (ja) 2007-04-13 2008-10-30 Iwate Toshiba Electronics Co Ltd ウエハ研磨装置
US20100216373A1 (en) * 2009-02-25 2010-08-26 Araca, Inc. Method for cmp uniformity control

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997392A (en) 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JP2002178260A (ja) 2000-12-15 2002-06-25 Nec Kansai Ltd ポリッシング装置
JP2005501753A (ja) 2001-09-10 2005-01-20 マルチプレーナーテクノロジーズ インコーポレーテッド 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160142000A (ko) * 2015-06-02 2016-12-12 주식회사 케이씨텍 슬러리 공급 유닛 및 이를 구비하는 화학 기계적 기판 연마장치
KR101710425B1 (ko) 2015-06-02 2017-03-08 주식회사 케이씨텍 슬러리 공급 유닛 및 이를 구비하는 화학 기계적 기판 연마장치
EP4272241A1 (en) 2021-02-16 2023-11-08 Araca Incorporated Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Also Published As

Publication number Publication date
TWI486233B (zh) 2015-06-01
GB2464995A (en) 2010-05-05
KR20100048830A (ko) 2010-05-11
JP2010114398A (ja) 2010-05-20
US8197306B2 (en) 2012-06-12
GB0820451D0 (en) 2008-12-17
JP5574597B2 (ja) 2014-08-20
TW201034794A (en) 2010-10-01
US20100112911A1 (en) 2010-05-06

Similar Documents

Publication Publication Date Title
KR101394745B1 (ko) Ｃｍｐ 슬러리의 주입을 위한 방법 및 장치
US8845395B2 (en) Method and device for the injection of CMP slurry
US20100216373A1 (en) Method for cmp uniformity control
US5791970A (en) Slurry recycling system for chemical-mechanical polishing apparatus
US5893753A (en) Vibrating polishing pad conditioning system and method
US20190054590A1 (en) Novel chemical-mechanical planarization system
US8579679B2 (en) Conditioning method and conditioning apparatus for polishing pad for use in double side polishing device
US6902470B2 (en) Apparatuses for conditioning surfaces of polishing pads
GB2326166A (en) Dressing tool for the surface of an abrasive cloth and its preparation
EP1579956A2 (en) Polishing apparatus and polishing method
US9296088B2 (en) Method and device for the injection of CMP slurry
KR20100051626A (ko) 슬러리의 수동적 제거를 제공하는 연마 어셈블리들을 구비한 ｃｍｐ 장치들
US6235635B1 (en) Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning
US5913715A (en) Use of hydrofluoric acid for effective pad conditioning
JPH09102475A (ja) 研磨装置
US20050164613A1 (en) Method of conditioning polishing pad for semiconductor wafer
KR100590513B1 (ko) 화학 기계적 연마 장치 및 방법
US6439977B1 (en) Rotational slurry distribution system for rotary CMP system
JPH11277411A (ja) 基板の研磨装置
KR20100044988A (ko) 화학적 기계적 연마 장비의 폴리싱 패드 이물질 제거장치
KR100799079B1 (ko) 폴리싱 패드 컨디셔너
JP2017196725A (ja) ラッピング研磨用定盤およびそれを用いる装置
KR100801842B1 (ko) 화학 기계적 연마장치의 슬러리 공급관 막힘 방지장치
WO2026010932A1 (en) Enhanced silicon grind using chemical additives in fluid during grinding process
KR20070033606A (ko) Ｃｍｐ장비의 컨디셔너

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170412

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180406

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20190502

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000