JP5573849B2 - 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 - Google Patents
物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 Download PDFInfo
- Publication number
- JP5573849B2 JP5573849B2 JP2011549367A JP2011549367A JP5573849B2 JP 5573849 B2 JP5573849 B2 JP 5573849B2 JP 2011549367 A JP2011549367 A JP 2011549367A JP 2011549367 A JP2011549367 A JP 2011549367A JP 5573849 B2 JP5573849 B2 JP 5573849B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding member
- exposure
- holding
- dimensional plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011549367A JP5573849B2 (ja) | 2009-08-20 | 2010-08-19 | 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009190654 | 2009-08-20 | ||
| JP2009190654 | 2009-08-20 | ||
| JP2011549367A JP5573849B2 (ja) | 2009-08-20 | 2010-08-19 | 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 |
| PCT/JP2010/064430 WO2011021723A1 (en) | 2009-08-20 | 2010-08-19 | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013502600A JP2013502600A (ja) | 2013-01-24 |
| JP2013502600A5 JP2013502600A5 (enExample) | 2013-09-05 |
| JP5573849B2 true JP5573849B2 (ja) | 2014-08-20 |
Family
ID=43063876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011549367A Active JP5573849B2 (ja) | 2009-08-20 | 2010-08-19 | 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110053092A1 (enExample) |
| JP (1) | JP5573849B2 (enExample) |
| KR (2) | KR101862234B1 (enExample) |
| CN (1) | CN102483580B (enExample) |
| TW (2) | TWI704640B (enExample) |
| WO (1) | WO2011021723A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
| US8598538B2 (en) | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US8941814B2 (en) * | 2011-06-20 | 2015-01-27 | Nikon Corporation | Multiple-blade holding devices |
| KR102226989B1 (ko) * | 2011-08-30 | 2021-03-11 | 가부시키가이샤 니콘 | 기판 처리 장치 및 기판 처리 방법, 노광 방법 및 노광 장치 그리고 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법 |
| JP2013054144A (ja) * | 2011-09-02 | 2013-03-21 | Nikon Corp | 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法 |
| JP6135664B2 (ja) * | 2012-03-07 | 2017-05-31 | 株式会社ニコン | マスク、マスクユニット、露光装置、基板処理装置、及びデバイス製造方法 |
| CN103019041B (zh) | 2012-11-26 | 2014-10-22 | 京东方科技集团股份有限公司 | 一种曝光机 |
| EP3183091B8 (en) * | 2014-08-19 | 2018-09-05 | Lumileds Holding B.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
| KR101715785B1 (ko) * | 2014-12-05 | 2017-03-13 | 프로미스 주식회사 | Fpd용 노광장치 |
| US10752449B2 (en) * | 2015-03-30 | 2020-08-25 | Nikon Corporation | Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method |
| CN107407893B (zh) * | 2015-03-31 | 2021-06-01 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法 |
| CN107924865B (zh) * | 2015-05-13 | 2022-03-11 | 亮锐控股有限公司 | 用于减少在管芯水平激光剥离期间机械损伤的蓝宝石收集器 |
| WO2016196105A1 (en) * | 2015-06-05 | 2016-12-08 | Applied Materials, Inc. | Susceptor position and rotation apparatus and methods of use |
| CN108139678B (zh) | 2015-09-30 | 2022-03-15 | 株式会社尼康 | 曝光装置、平面显示器的制造方法及元件制造方法 |
| CN111965948B (zh) * | 2015-09-30 | 2023-06-27 | 株式会社尼康 | 曝光装置、曝光方法、平面显示器的制造方法、及元件制造方法 |
| WO2017122763A1 (ja) * | 2016-01-15 | 2017-07-20 | 株式会社ナノテム | 非接触搬送装置および非接触搬送システム |
| WO2018062508A1 (ja) * | 2016-09-30 | 2018-04-05 | 株式会社ニコン | 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法 |
| TWI765918B (zh) | 2016-09-30 | 2022-06-01 | 日商尼康股份有限公司 | 搬運裝置、曝光裝置、曝光方法、平板顯示器的製造方法、元件製造方法以及搬運方法 |
| US20190377271A1 (en) | 2016-09-30 | 2019-12-12 | Nikon Corporation | Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method |
| CN108983552B (zh) * | 2017-05-31 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 一种移入移出机构及光刻机工件台移入移出装置 |
| CN118343498A (zh) * | 2018-03-01 | 2024-07-16 | 杭州孚亚科技有限公司 | 吸紧装置 |
| JP7114277B2 (ja) * | 2018-03-07 | 2022-08-08 | キヤノン株式会社 | パターン形成装置及び物品の製造方法 |
| JP7017239B2 (ja) * | 2018-06-25 | 2022-02-08 | 株式会社ブイ・テクノロジー | 露光装置および高さ調整方法 |
| KR102653016B1 (ko) | 2018-09-18 | 2024-03-29 | 삼성전자주식회사 | 척 구동 장치 및 기판 처리 장치 |
| TWI691715B (zh) * | 2019-06-17 | 2020-04-21 | 華矽創新股份有限公司 | 檢測矽晶圓缺陷的自動光學檢測機構及方法 |
| JP7185674B2 (ja) * | 2020-09-30 | 2022-12-07 | キヤノントッキ株式会社 | 成膜装置、調整方法及び電子デバイスの製造方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2007A (en) * | 1841-03-16 | Improvement in the mode of harvesting grain | ||
| KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
| JP3689949B2 (ja) * | 1995-12-19 | 2005-08-31 | 株式会社ニコン | 投影露光装置、及び該投影露光装置を用いたパターン形成方法 |
| EP0866375A3 (en) * | 1997-03-17 | 2000-05-24 | Nikon Corporation | Article positioning apparatus and exposing apparatus having the same |
| JP2001215718A (ja) * | 1999-11-26 | 2001-08-10 | Nikon Corp | 露光装置及び露光方法 |
| TW529172B (en) * | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
| US20030098965A1 (en) * | 2001-11-29 | 2003-05-29 | Mike Binnard | System and method for supporting a device holder with separate components |
| US6888620B2 (en) * | 2001-11-29 | 2005-05-03 | Nikon Corporation | System and method for holding a device with minimal deformation |
| TWI222423B (en) * | 2001-12-27 | 2004-10-21 | Orbotech Ltd | System and methods for conveying and transporting levitated articles |
| JP4378938B2 (ja) * | 2002-11-25 | 2009-12-09 | 株式会社ニコン | 露光装置、及びデバイス製造方法 |
| US7077019B2 (en) * | 2003-08-08 | 2006-07-18 | Photon Dynamics, Inc. | High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing |
| WO2005099350A2 (en) * | 2004-04-14 | 2005-10-27 | Coreflow Scientific Solutions Ltd. | Non-contact support platforms for distance adjustment |
| US20080013060A1 (en) * | 2004-07-23 | 2008-01-17 | Nikon Corporation | Support Apparatus, Stage Apparatus, Exposure Apparatus, And Device Manufacturing Method |
| US7440081B2 (en) * | 2004-11-05 | 2008-10-21 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and substrate table |
| KR101494115B1 (ko) * | 2005-03-29 | 2015-02-16 | 가부시키가이샤 니콘 | 노광 장치, 노광 장치의 제조 방법 및 마이크로 디바이스 제조 방법 |
| KR100949502B1 (ko) * | 2005-06-20 | 2010-03-24 | 엘지디스플레이 주식회사 | 액정표시장치 제조 공정용 기판 반송장치 |
| JP4553376B2 (ja) * | 2005-07-19 | 2010-09-29 | 東京エレクトロン株式会社 | 浮上式基板搬送処理装置及び浮上式基板搬送処理方法 |
| US7543867B2 (en) * | 2005-09-30 | 2009-06-09 | Photon Dynamics, Inc. | Vacuum gripping system for positioning large thin substrates on a support table |
| JP4702083B2 (ja) * | 2006-02-10 | 2011-06-15 | ウシオ電機株式会社 | XYθ移動ステージ |
| WO2007097379A1 (ja) | 2006-02-21 | 2007-08-30 | Nikon Corporation | パターン形成装置、マーク検出装置、露光装置、パターン形成方法、露光方法及びデバイス製造方法 |
| JP4318709B2 (ja) * | 2006-10-10 | 2009-08-26 | 東京エレクトロン株式会社 | 現像処理方法及び現像処理装置 |
| KR101590645B1 (ko) | 2007-03-05 | 2016-02-18 | 가부시키가이샤 니콘 | 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법 |
| JP4743716B2 (ja) * | 2007-03-06 | 2011-08-10 | 東京エレクトロン株式会社 | 基板処理装置 |
| US7607647B2 (en) | 2007-03-20 | 2009-10-27 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
| JP2009147240A (ja) * | 2007-12-18 | 2009-07-02 | Dainippon Printing Co Ltd | 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法 |
| JP5125739B2 (ja) * | 2008-05-08 | 2013-01-23 | 凸版印刷株式会社 | Xyステップ露光装置 |
| US20110042874A1 (en) * | 2009-08-20 | 2011-02-24 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
| US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
| US20120064460A1 (en) * | 2010-09-07 | 2012-03-15 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US20120064461A1 (en) * | 2010-09-13 | 2012-03-15 | Nikon Corporation | Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method |
-
2010
- 2010-08-19 KR KR1020127003908A patent/KR101862234B1/ko active Active
- 2010-08-19 WO PCT/JP2010/064430 patent/WO2011021723A1/en not_active Ceased
- 2010-08-19 CN CN201080036925.1A patent/CN102483580B/zh active Active
- 2010-08-19 JP JP2011549367A patent/JP5573849B2/ja active Active
- 2010-08-19 US US12/859,484 patent/US20110053092A1/en not_active Abandoned
- 2010-08-19 KR KR1020187014528A patent/KR102022841B1/ko active Active
- 2010-08-20 TW TW106114288A patent/TWI704640B/zh active
- 2010-08-20 TW TW099127837A patent/TWI587436B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| HK1166140A1 (en) | 2012-10-19 |
| TW201729331A (zh) | 2017-08-16 |
| KR102022841B1 (ko) | 2019-09-19 |
| TWI587436B (zh) | 2017-06-11 |
| CN102483580B (zh) | 2015-04-01 |
| KR101862234B1 (ko) | 2018-05-29 |
| JP2013502600A (ja) | 2013-01-24 |
| KR20120062711A (ko) | 2012-06-14 |
| CN102483580A (zh) | 2012-05-30 |
| WO2011021723A1 (en) | 2011-02-24 |
| KR20180059948A (ko) | 2018-06-05 |
| TW201138008A (en) | 2011-11-01 |
| TWI704640B (zh) | 2020-09-11 |
| US20110053092A1 (en) | 2011-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5573849B2 (ja) | 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法 | |
| JP6587160B2 (ja) | 移動体装置、物体処理装置、露光装置、露光方法、フラットパネルディスプレイの製造方法及びデバイス製造方法 | |
| JP5776923B2 (ja) | 物体処理装置、露光装置、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法 | |
| JP6304509B2 (ja) | 移動体装置、移動方法、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 | |
| HK1166140B (en) | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method | |
| HK1166141A (en) | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method | |
| HK1166142B (en) | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method | |
| HK1229440A1 (en) | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method | |
| HK1229441A1 (en) | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method | |
| HK1229531A1 (en) | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130717 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130717 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140124 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140424 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140603 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140616 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5573849 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |