TWI704640B - 物體處理裝置、物體處理方法、以及元件製造方法 - Google Patents

物體處理裝置、物體處理方法、以及元件製造方法 Download PDF

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Publication number
TWI704640B
TWI704640B TW106114288A TW106114288A TWI704640B TW I704640 B TWI704640 B TW I704640B TW 106114288 A TW106114288 A TW 106114288A TW 106114288 A TW106114288 A TW 106114288A TW I704640 B TWI704640 B TW I704640B
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TW
Taiwan
Prior art keywords
substrate
patent application
exposure
area
processing device
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Application number
TW106114288A
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English (en)
Chinese (zh)
Other versions
TW201729331A (zh
Inventor
青木保夫
Original Assignee
日商尼康股份有限公司
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Publication of TW201729331A publication Critical patent/TW201729331A/zh
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Publication of TWI704640B publication Critical patent/TWI704640B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106114288A 2009-08-20 2010-08-20 物體處理裝置、物體處理方法、以及元件製造方法 TWI704640B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2009-190654 2009-08-20
JP2009190654 2009-08-20

Publications (2)

Publication Number Publication Date
TW201729331A TW201729331A (zh) 2017-08-16
TWI704640B true TWI704640B (zh) 2020-09-11

Family

ID=43063876

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106114288A TWI704640B (zh) 2009-08-20 2010-08-20 物體處理裝置、物體處理方法、以及元件製造方法
TW099127837A TWI587436B (zh) 2009-08-20 2010-08-20 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW099127837A TWI587436B (zh) 2009-08-20 2010-08-20 物體處理裝置、曝光裝置及曝光方法、以及元件製造方法

Country Status (6)

Country Link
US (1) US20110053092A1 (enExample)
JP (1) JP5573849B2 (enExample)
KR (2) KR101862234B1 (enExample)
CN (1) CN102483580B (enExample)
TW (2) TWI704640B (enExample)
WO (1) WO2011021723A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8941814B2 (en) * 2011-06-20 2015-01-27 Nikon Corporation Multiple-blade holding devices
KR102226989B1 (ko) * 2011-08-30 2021-03-11 가부시키가이샤 니콘 기판 처리 장치 및 기판 처리 방법, 노광 방법 및 노광 장치 그리고 디바이스 제조 방법 및 플랫 패널 디스플레이의 제조 방법
JP2013054144A (ja) * 2011-09-02 2013-03-21 Nikon Corp 位置合わせ方法、露光方法、デバイス製造方法、及びフラットパネルディスプレイの製造方法
JP6135664B2 (ja) * 2012-03-07 2017-05-31 株式会社ニコン マスク、マスクユニット、露光装置、基板処理装置、及びデバイス製造方法
CN103019041B (zh) 2012-11-26 2014-10-22 京东方科技集团股份有限公司 一种曝光机
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR101715785B1 (ko) * 2014-12-05 2017-03-13 프로미스 주식회사 Ｆｐｄ용 노광장치
US10752449B2 (en) * 2015-03-30 2020-08-25 Nikon Corporation Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method
CN107407893B (zh) * 2015-03-31 2021-06-01 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
CN107924865B (zh) * 2015-05-13 2022-03-11 亮锐控股有限公司 用于减少在管芯水平激光剥离期间机械损伤的蓝宝石收集器
WO2016196105A1 (en) * 2015-06-05 2016-12-08 Applied Materials, Inc. Susceptor position and rotation apparatus and methods of use
CN108139678B (zh) 2015-09-30 2022-03-15 株式会社尼康 曝光装置、平面显示器的制造方法及元件制造方法
CN111965948B (zh) * 2015-09-30 2023-06-27 株式会社尼康 曝光装置、曝光方法、平面显示器的制造方法、及元件制造方法
WO2017122763A1 (ja) * 2016-01-15 2017-07-20 株式会社ナノテム 非接触搬送装置および非接触搬送システム
WO2018062508A1 (ja) * 2016-09-30 2018-04-05 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
TWI765918B (zh) 2016-09-30 2022-06-01 日商尼康股份有限公司 搬運裝置、曝光裝置、曝光方法、平板顯示器的製造方法、元件製造方法以及搬運方法
US20190377271A1 (en) 2016-09-30 2019-12-12 Nikon Corporation Exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, and exposure method
CN108983552B (zh) * 2017-05-31 2020-01-24 上海微电子装备（集团）股份有限公司 一种移入移出机构及光刻机工件台移入移出装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置
JP7114277B2 (ja) * 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP7017239B2 (ja) * 2018-06-25 2022-02-08 株式会社ブイ・テクノロジー 露光装置および高さ調整方法
KR102653016B1 (ko) 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
TWI691715B (zh) * 2019-06-17 2020-04-21 華矽創新股份有限公司 檢測矽晶圓缺陷的自動光學檢測機構及方法
JP7185674B2 (ja) * 2020-09-30 2022-12-07 キヤノントッキ株式会社 成膜装置、調整方法及び電子デバイスの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
TW200821522A (en) * 2006-10-10 2008-05-16 Tokyo Electron Ltd Developing processing method and developing processing apparatus
TW200846842A (en) * 2007-03-05 2008-12-01 Nikon Corp Motion body device, pattern forming device and forming method thereof, device production method, production method for a moving body device, and driving method for a moving body

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2007A (en) * 1841-03-16 Improvement in the mode of harvesting grain
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US20030098965A1 (en) * 2001-11-29 2003-05-29 Mike Binnard System and method for supporting a device holder with separate components
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
JP4378938B2 (ja) * 2002-11-25 2009-12-09 株式会社ニコン 露光装置、及びデバイス製造方法
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
WO2005099350A2 (en) * 2004-04-14 2005-10-27 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment
US20080013060A1 (en) * 2004-07-23 2008-01-17 Nikon Corporation Support Apparatus, Stage Apparatus, Exposure Apparatus, And Device Manufacturing Method
KR101494115B1 (ko) * 2005-03-29 2015-02-16 가부시키가이샤 니콘 노광 장치, 노광 장치의 제조 방법 및 마이크로 디바이스 제조 방법
KR100949502B1 (ko) * 2005-06-20 2010-03-24 엘지디스플레이 주식회사 액정표시장치 제조 공정용 기판 반송장치
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
US7543867B2 (en) * 2005-09-30 2009-06-09 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table
JP4702083B2 (ja) * 2006-02-10 2011-06-15 ウシオ電機株式会社 ＸＹθ移動ステージ
WO2007097379A1 (ja) 2006-02-21 2007-08-30 Nikon Corporation パターン形成装置、マーク検出装置、露光装置、パターン形成方法、露光方法及びデバイス製造方法
JP4743716B2 (ja) * 2007-03-06 2011-08-10 東京エレクトロン株式会社 基板処理装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP2009147240A (ja) * 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
JP5125739B2 (ja) * 2008-05-08 2013-01-23 凸版印刷株式会社 Ｘｙステップ露光装置
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098176A1 (en) * 2004-11-05 2006-05-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
TW200821522A (en) * 2006-10-10 2008-05-16 Tokyo Electron Ltd Developing processing method and developing processing apparatus
TW200846842A (en) * 2007-03-05 2008-12-01 Nikon Corp Motion body device, pattern forming device and forming method thereof, device production method, production method for a moving body device, and driving method for a moving body

Also Published As

Publication number Publication date
HK1166140A1 (en) 2012-10-19
JP5573849B2 (ja) 2014-08-20
TW201729331A (zh) 2017-08-16
KR102022841B1 (ko) 2019-09-19
TWI587436B (zh) 2017-06-11
CN102483580B (zh) 2015-04-01
KR101862234B1 (ko) 2018-05-29
JP2013502600A (ja) 2013-01-24
KR20120062711A (ko) 2012-06-14
CN102483580A (zh) 2012-05-30
WO2011021723A1 (en) 2011-02-24
KR20180059948A (ko) 2018-06-05
TW201138008A (en) 2011-11-01
US20110053092A1 (en) 2011-03-03

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