JP5572045B2 - シート貼付装置及び貼付方法 - Google Patents

シート貼付装置及び貼付方法 Download PDF

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Publication number
JP5572045B2
JP5572045B2 JP2010201863A JP2010201863A JP5572045B2 JP 5572045 B2 JP5572045 B2 JP 5572045B2 JP 2010201863 A JP2010201863 A JP 2010201863A JP 2010201863 A JP2010201863 A JP 2010201863A JP 5572045 B2 JP5572045 B2 JP 5572045B2
Authority
JP
Japan
Prior art keywords
adherend
adhesive sheet
sheet
support surface
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010201863A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012059928A (ja
Inventor
弘一 山口
陽太 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2010201863A priority Critical patent/JP5572045B2/ja
Priority to TW100130499A priority patent/TWI517291B/zh
Priority to KR1020110088771A priority patent/KR101854655B1/ko
Priority to CN201110279056.1A priority patent/CN102403196B/zh
Publication of JP2012059928A publication Critical patent/JP2012059928A/ja
Application granted granted Critical
Publication of JP5572045B2 publication Critical patent/JP5572045B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010201863A 2010-09-09 2010-09-09 シート貼付装置及び貼付方法 Expired - Fee Related JP5572045B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010201863A JP5572045B2 (ja) 2010-09-09 2010-09-09 シート貼付装置及び貼付方法
TW100130499A TWI517291B (zh) 2010-09-09 2011-08-25 Sheet attachment and attachment method
KR1020110088771A KR101854655B1 (ko) 2010-09-09 2011-09-02 시트 첩부 장치 및 첩부 방법
CN201110279056.1A CN102403196B (zh) 2010-09-09 2011-09-06 薄片粘贴装置及粘贴方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010201863A JP5572045B2 (ja) 2010-09-09 2010-09-09 シート貼付装置及び貼付方法

Publications (2)

Publication Number Publication Date
JP2012059928A JP2012059928A (ja) 2012-03-22
JP5572045B2 true JP5572045B2 (ja) 2014-08-13

Family

ID=45885282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010201863A Expired - Fee Related JP5572045B2 (ja) 2010-09-09 2010-09-09 シート貼付装置及び貼付方法

Country Status (4)

Country Link
JP (1) JP5572045B2 (ko)
KR (1) KR101854655B1 (ko)
CN (1) CN102403196B (ko)
TW (1) TWI517291B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5557352B2 (ja) 2012-04-20 2014-07-23 Ｎｅｃエンジニアリング株式会社 シート切断装置、チップ製造装置、シート切断方法、チップ製造方法及びシート切断プログラム
JP5918025B2 (ja) * 2012-05-22 2016-05-18 株式会社ディスコ 保護部材および保護テープ貼着方法
JP6045817B2 (ja) * 2012-05-28 2016-12-14 株式会社ディスコ 貼着方法
JP6145331B2 (ja) * 2013-06-19 2017-06-07 リンテック株式会社 シート貼付装置および貼付方法
JP6219197B2 (ja) * 2014-02-26 2017-10-25 リンテック株式会社 シート貼付装置および貼付方法
JP6543152B2 (ja) * 2015-09-30 2019-07-10 リンテック株式会社 シート貼付装置および貼付方法並びに接着シート原反
JP6550501B1 (ja) * 2018-05-08 2019-07-24 リンテック株式会社 シート貼付装置およびシート貼付方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4311522B2 (ja) * 2002-03-07 2009-08-12 日東電工株式会社 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP4447280B2 (ja) * 2003-10-16 2010-04-07 リンテック株式会社 表面保護用シートおよび半導体ウエハの研削方法
CN100547752C (zh) * 2005-05-19 2009-10-07 琳得科株式会社 粘附装置
JP4795743B2 (ja) * 2005-05-19 2011-10-19 リンテック株式会社 貼付装置
JP4452691B2 (ja) * 2005-08-04 2010-04-21 リンテック株式会社 シート切断装置及び切断方法
JP2007288010A (ja) * 2006-04-19 2007-11-01 Lintec Corp シート切断装置及び切断方法
JP4988640B2 (ja) * 2008-03-31 2012-08-01 リンテック株式会社 シート貼付装置及び貼付方法

Also Published As

Publication number Publication date
KR101854655B1 (ko) 2018-05-04
JP2012059928A (ja) 2012-03-22
TWI517291B (zh) 2016-01-11
TW201216402A (en) 2012-04-16
CN102403196B (zh) 2016-05-11
CN102403196A (zh) 2012-04-04
KR20120026450A (ko) 2012-03-19

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