JP5555971B2 - Linear light-emitting device and planar light-emitting device using the same - Google Patents

Linear light-emitting device and planar light-emitting device using the same Download PDF

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JP5555971B2
JP5555971B2 JP2006303518A JP2006303518A JP5555971B2 JP 5555971 B2 JP5555971 B2 JP 5555971B2 JP 2006303518 A JP2006303518 A JP 2006303518A JP 2006303518 A JP2006303518 A JP 2006303518A JP 5555971 B2 JP5555971 B2 JP 5555971B2
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light
emitting device
light emitting
phosphor layer
linear
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JP2008047851A (en
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正和 小谷
研二 滝根
大樹 ▲高▼橋
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Nichia Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Description

本発明は、線状発光装置およびそれを用いた面状発光装置に関する。   The present invention relates to a linear light emitting device and a planar light emitting device using the same.

近年、発光ダイオードの発光効率が向上し、CCFL(冷陰極管)に置き換わっている。CCFLが線状発光装置であるのに対して、発光ダイオードは点光源であるため、面状発光装置を構成した場合、構造的に輝度ムラが発生する問題があった。この問題を緩和する方法として、長方形状の実装基板に列状に複数の発光素子を高密度に実装し、封止樹脂で封止する技術が特許文献1に開示されている。
特開2002−299697号公報。
In recent years, the luminous efficiency of light emitting diodes has been improved and replaced with CCFLs (cold cathode fluorescent lamps). The CCFL is a linear light-emitting device, whereas the light-emitting diode is a point light source. Therefore, when a planar light-emitting device is configured, there is a problem that uneven luminance occurs structurally. As a method for alleviating this problem, Patent Document 1 discloses a technique of mounting a plurality of light emitting elements in a row on a rectangular mounting substrate at high density and sealing with a sealing resin.
Japanese Patent Application Laid-Open No. 2002-299697.

しかし、発光素子を高密度に実装するには特許文献1に開示してあるように、放熱性に優れたパッケージを使用しなければならない。このようなパッケージは、そのもの自体が高価であり、発光素子を高密度に実装するため、その分の費用も高価なものになり、全体として極めて高価になる。さらに高密度に実装した発光素子に電力供給をする必要があるため、電気代も高価になる。よってイニシャルコストもランニングコストもどちらの面においても高価になってしまう。   However, in order to mount the light emitting elements at a high density, as disclosed in Patent Document 1, a package having excellent heat dissipation must be used. Such a package itself is expensive, and since the light emitting elements are mounted at a high density, the cost of the package is also expensive, and the whole becomes extremely expensive. Furthermore, since it is necessary to supply power to the light emitting elements mounted at a high density, the electricity cost is also expensive. Therefore, both initial cost and running cost are expensive.

本発明は、少ない数の発光素子であっても輝度ムラの少ない線状発光装置とそれを用いて面状発光装置を得ることを目的とする。   An object of the present invention is to obtain a linear light-emitting device with little luminance unevenness even with a small number of light-emitting elements and a planar light-emitting device using the linear light-emitting device.

以上の目的を達成するため、本発明にかかる線状発光装置は、
長方形状の実装基板と、該実装基板上の長手方向に配された複数の発光素子と、少なくとも前記複数の発光素子を線状に覆う蛍光体層と、該蛍光体層を覆う封止樹脂と、を有する。
In order to achieve the above object, a linear light emitting device according to the present invention includes:
A rectangular mounting substrate, a plurality of light emitting elements arranged in the longitudinal direction on the mounting substrate, a phosphor layer covering at least the plurality of light emitting elements in a line, and a sealing resin covering the phosphor layer; Have.

このように複数の発光素子に対して、それらを覆うように線状に蛍光体層を形成することにより、発光素子だけでなく、発光素子間の蛍光体層も発光する。そのため少ない発光素子でも線状に発光する線状発光装置の実現が可能となる。またこれらを封止樹脂で覆うことにより機械的保護が可能となる。   Thus, by forming a phosphor layer in a linear shape so as to cover a plurality of light emitting elements, not only the light emitting elements but also the phosphor layers between the light emitting elements emit light. Therefore, it is possible to realize a linear light emitting device that emits light linearly with a small number of light emitting elements. Moreover, mechanical protection becomes possible by covering these with sealing resin.

ここで本願明細書において蛍光体層とは、少なくとも蛍光体と透光性樹脂からなるものをいい、拡散物質を含有するものも含むものとする。   Here, in the specification of the present application, the phosphor layer refers to a layer made of at least a phosphor and a translucent resin, and includes a substance containing a diffusing substance.

また本発明にかかる線状発光装置は、封止樹脂が半円柱状である。これにより光を線状に集光する効果を有する。   In the linear light emitting device according to the present invention, the sealing resin has a semi-cylindrical shape. This has the effect of condensing light in a linear fashion.

また本発明にかかる線状発光装置は、前記封止樹脂が実装基板の長手方向に延在する凸部と、該凸部の側方に延在する平坦部と、を有する。凸部を有することで配光特性の最適化が可能となる。   Moreover, the linear light-emitting device concerning this invention has the convex part in which the said sealing resin extends in the longitudinal direction of a mounting substrate, and the flat part extended to the side of this convex part. By having the convex portions, it is possible to optimize the light distribution characteristics.

また平坦部を有することで実装基板との接着面積が増加することにより密着性が向上する。ここで平坦部とは、凹凸を有しているものや曲面状のものも含む。   Further, by having the flat portion, the adhesion area is improved by increasing the adhesion area with the mounting substrate. Here, the flat portion includes those having irregularities and curved surfaces.

また本発明にかかる線状発光装置は、前記凸部が半円柱状である。これにより光を線状に集光する効果を有する。   In the linear light-emitting device according to the present invention, the convex portion has a semi-cylindrical shape. This has the effect of condensing light in a linear fashion.

ここで半円柱とは、円柱を長さ方向に切断した形状を言い、その曲面は円だけでなく、楕円や放物線の一部も含むものとする。   Here, the semi-cylinder means a shape obtained by cutting the cylinder in the length direction, and the curved surface includes not only a circle but also an ellipse and a part of a parabola.

また本発明にかかる線状発光装置は、前記蛍光体層が前記凸部の下方に配置される。これにより、蛍光体層での発光が効率よく、封止樹脂の半円柱状部を通過させることが可能となる。   In the linear light emitting device according to the present invention, the phosphor layer is disposed below the convex portion. Thereby, light emission in the phosphor layer can be efficiently performed and the semi-cylindrical portion of the sealing resin can be passed.

また本発明にかかる線状発光装置は、前記封止樹脂が半円柱状である。これにより光を線状に集光する効果を有する。   In the linear light emitting device according to the present invention, the sealing resin has a semi-cylindrical shape. This has the effect of condensing light in a linear fashion.

また本発明にかかる線状発光装置は、前記凸部が前記蛍光体層より幅が広い。これにより、蛍光体層での発光が効率よく、封止樹脂の半円柱状部を通過させることが可能となる。   In the linear light emitting device according to the present invention, the convex portion is wider than the phosphor layer. Thereby, light emission in the phosphor layer can be efficiently performed and the semi-cylindrical portion of the sealing resin can be passed.

また本発明にかかる線状発光装置は、前記蛍光体層が半円柱状である。これによって、蛍光体層と封止樹脂との界面にも光を線状に集光する効果を発現させることが可能となる。   In the linear light emitting device according to the present invention, the phosphor layer has a semi-cylindrical shape. As a result, it is possible to develop an effect of condensing light in a linear manner at the interface between the phosphor layer and the sealing resin.

また本発明にかかる線状発光装置は、前記封止樹脂の半円柱状の曲率半径が、蛍光体層の半円柱状の曲率半径より大きい。これにより蛍光体層の半円柱状部と封止樹脂との界面での屈折を最適化することが可能となる。   In the linear light emitting device according to the present invention, the semi-cylindrical curvature radius of the sealing resin is larger than the semi-cylindrical curvature radius of the phosphor layer. This makes it possible to optimize refraction at the interface between the semicylindrical portion of the phosphor layer and the sealing resin.

また本発明にかかる線状発光装置は、前記実装基板が長手方向に長方形状の凹部を有し、該凹部内に前記複数の発光素子と、前記蛍光体層と、を有する。これにより凹部がリフレクターの作用を有し、配光特性を制御することにより、導光板と光学的に接続された場合に光学的損失を軽減させ、発光効率を向上させることが可能となる。さらに凹部内に蛍光体層を形成することにより、蛍光体層の厚みを一定にすることが可能であり、線状発光装置ごとの色度ばらつきが低減させることが可能である。   In the linear light emitting device according to the present invention, the mounting substrate has a rectangular recess in the longitudinal direction, and the plurality of light emitting elements and the phosphor layer are included in the recess. As a result, the concave portion has the effect of a reflector, and by controlling the light distribution characteristics, it is possible to reduce the optical loss and improve the light emission efficiency when optically connected to the light guide plate. Furthermore, by forming the phosphor layer in the recess, it is possible to make the thickness of the phosphor layer constant, and it is possible to reduce the chromaticity variation for each linear light emitting device.

また本発明にかかる線状発光装置は、前記凹部は、該凹部を形成する壁を長手方向に有し、線状発光装置の短手方向の端面には凹部を形成する壁を有さない。これにより線状発光装置の短手方向は狭配光で、長手方向は広配光の特性を得ることが可能となる。   In the linear light emitting device according to the present invention, the concave portion has a wall that forms the concave portion in the longitudinal direction, and does not have a wall that forms the concave portion on the end surface in the short direction of the linear light emitting device. As a result, it is possible to obtain a narrow light distribution in the short direction and a wide light distribution in the longitudinal direction of the linear light emitting device.

さらにまた本発明にかかる面状発光装置は、入光部を有する導光板と、該導光板に光学的に接続された請求項1乃至10のいずれか1項に記載の線状発光装置と、を備えることを特徴とする。請求項1乃至10のいずれか1項に記載の線状発光装置を使用することにより、線状光源の実現が可能となるため、面状発光装置に利用した場合、輝度ムラ問題が発生しにくい。   Furthermore, the planar light emitting device according to the present invention includes a light guide plate having a light incident portion, and the linear light emitting device according to any one of claims 1 to 10 optically connected to the light guide plate. It is characterized by providing. Since the linear light source can be realized by using the linear light-emitting device according to any one of claims 1 to 10, the luminance unevenness problem hardly occurs when the linear light-emitting device is used in a planar light-emitting device. .

さらにまた本発明にかかる面状発光装置は、前記導光板の入光部が凹部を有し、該凹部と前記封止樹脂とが勘合する。これにより、線状発光装置と導光板の位置あわせが容易になる。   Furthermore, in the planar light emitting device according to the present invention, the light incident portion of the light guide plate has a concave portion, and the concave portion and the sealing resin are engaged with each other. Thereby, alignment of a linear light-emitting device and a light-guide plate becomes easy.

さらにまた本発明にかかる面状発光装置は、前記凹部が半円柱状である。これにより光学的損失を減少させることが可能となる。   Furthermore, in the planar light emitting device according to the present invention, the concave portion has a semi-cylindrical shape. This makes it possible to reduce optical loss.

本発明により、点状光源である発光素子を使用して安価で発熱の少ない線状発光装置およびそれを用いた面状発光装置の実現が可能となる。   According to the present invention, it is possible to realize an inexpensive linear light-emitting device that generates little heat using a light-emitting element that is a point light source and a planar light-emitting device using the linear light-emitting device.

本発明を実施するための最良の形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための導光板および面発光装置を例示するものであって、本発明は導光板および面発光装置を以下に限定するものではない。また、各図面に示す部材の大きさや位置関係などは説明を明確にするために誇張しているところがある。   The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light guide plate and the surface light-emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light guide plate and the surface light-emitting device below. . Further, the size and positional relationship of the members shown in the drawings are exaggerated for clarity of explanation.

<第1の実施の形態>
図1は、第1の実施の形態における線状発光装置1000を示す。内部構造を明確に示すために透光性を有する部分を透けた状態で示した。図3は、第1の実施の形態における線状発光装置の製造工程を示している。
<First Embodiment>
FIG. 1 shows a linear light-emitting device 1000 according to the first embodiment. In order to clearly show the internal structure, a transparent portion is shown. FIG. 3 shows a manufacturing process of the linear light-emitting device in the first embodiment.

101は発光素子を示す。発光素子形状は長方形状のものを図示しているが、それに限定されず正方形状等でも使用可能である。長方形状の発光素子は実装基板に対して図1,3,4,11,12に示すように長手方向を直交する方向に実装することも可能である。   Reference numeral 101 denotes a light emitting element. Although the light emitting element has a rectangular shape, the shape is not limited to this, and a square shape or the like can also be used. The rectangular light emitting element can be mounted in a direction perpendicular to the longitudinal direction as shown in FIGS.

この場合のメリットは発光素子と実装基板間に発生する応力を少なくできるところにある。   The merit in this case is that the stress generated between the light emitting element and the mounting substrate can be reduced.

図2に示すように実装基板に対して長手方向を揃える方向に実装することも可能である。   As shown in FIG. 2, it is also possible to mount in a direction in which the longitudinal direction is aligned with the mounting substrate.

この場合のメリットは発光素子をより細く配列させることが可能となり、蛍光体層の幅を細く形成することが可能となる。これにより、封止樹脂に円周方向に拡散していく光を線状に集光する効果を持たせる場合、光学設計が容易になる。   The merit in this case is that the light emitting elements can be arranged more finely, and the phosphor layer can be formed with a narrow width. This facilitates optical design when the sealing resin has an effect of condensing light that diffuses in the circumferential direction into a linear shape.

さらに図13に示すように実装基板に対して斜め方向に実装することも可能である。   Furthermore, as shown in FIG. 13, it is possible to mount in an oblique direction with respect to the mounting substrate.

この場合のメリットは隣接する発光素子同士の蛍光体層の膜厚を変化させることになり色度調整が可能になる。   In this case, the merit is that the thickness of the phosphor layer between the adjacent light emitting elements is changed, so that the chromaticity can be adjusted.

またさらに図14に示すように実装基板に対して長手方向を揃える方向に実装する発光素子と長手方向を直交する方向に実装する発光素子を交互に実装することも可能である。   Furthermore, as shown in FIG. 14, it is also possible to alternately mount light emitting elements mounted in a direction in which the longitudinal direction is aligned with the mounting substrate and light emitting elements mounted in a direction perpendicular to the longitudinal direction.

この場合のメリットは長手方向を揃える方向に実装する発光素子と長手方向を直交する方向に実装する発光素子とを一対として交互に実装することにより、互いの発光素子に対する蛍光体層の膜厚を変化させることになり、輝度ムラや色度ムラをより低減可能となる。   The merit in this case is that the thickness of the phosphor layer with respect to each light emitting element can be reduced by alternately mounting the light emitting element mounted in the direction in which the longitudinal directions are aligned and the light emitting element mounted in the direction perpendicular to the longitudinal direction. As a result, the luminance unevenness and the chromaticity unevenness can be further reduced.

図3で製造工程を説明する。斜視図と側面図を対応して併記している。図3(a)は実装基板303を図示したものである。   The manufacturing process will be described with reference to FIG. A perspective view and a side view are shown correspondingly. FIG. 3A illustrates the mounting substrate 303.

図3(b)は実装基板に発光素子301を実装した状態を示した図である。発光素子に対して放熱性を十分確保するには、発光素子を電極上に実装することが好ましい。この場合は、発光素子側に共晶金属を形成して電極との間で共晶結合を用いて実装するのが好ましい。一般的に電極は金属からなるため放熱性が高く、ヒートシンクとしての役割が可能であり、さらに電極という金属上への実装は樹脂で接着するよりも共晶金属で接合した方が接着強度が高いためである。   FIG. 3B is a diagram showing a state in which the light emitting element 301 is mounted on the mounting substrate. In order to ensure sufficient heat dissipation for the light emitting element, it is preferable to mount the light emitting element on the electrode. In this case, it is preferable that a eutectic metal is formed on the light emitting element side and mounted by using a eutectic bond with the electrode. Generally, the electrode is made of metal, so it has high heat dissipation and can serve as a heat sink. Furthermore, mounting on the metal called electrode has higher adhesive strength than bonding with eutectic metal rather than bonding with resin. Because.

その後、電極に電気的に接続するために、ワイヤーボンディングされる。   Thereafter, wire bonding is performed to electrically connect the electrodes.

また図11のように発光素子1101を電極上で無く、実装基板上に実装することも可能である。この場合は、ボンディング剤として樹脂を使用することが可能となるため、簡易かつ安価に実装することが可能となる。   In addition, as shown in FIG. 11, the light emitting element 1101 can be mounted on a mounting substrate instead of on an electrode. In this case, since it becomes possible to use resin as a bonding agent, it becomes possible to mount simply and inexpensively.

図3(c)は蛍光体層を形成した状態を図示したものである。蛍光体層をディスペンサーにより形成すると蛍光体層が半円柱状になる。蛍光体層の半円柱状部の曲率は透光性樹脂の粘性や表面張力、ワイヤーの高さ等によって設計可能である。蛍光体層の半円柱状部の曲率を小さくしようとすれば、粘度が高い樹脂を使用したり、表面張力が大きい樹脂を使用したり、ワイヤーの高さを高くすることで実現可能となる。この蛍光体層が通電時に線状発光することになる。線状発光の線の幅は蛍光体層の幅に起因することになる。   FIG. 3C illustrates a state where the phosphor layer is formed. When the phosphor layer is formed by a dispenser, the phosphor layer becomes a semi-cylindrical shape. The curvature of the semi-cylindrical portion of the phosphor layer can be designed according to the viscosity and surface tension of the translucent resin, the height of the wire, and the like. If the curvature of the semi-cylindrical portion of the phosphor layer is to be reduced, it can be realized by using a resin having a high viscosity, using a resin having a large surface tension, or increasing the height of the wire. This phosphor layer emits linear light when energized. The width of the line emission line is caused by the width of the phosphor layer.

ラインポッティングではなく、ライン印刷で蛍光体層を形成した場合は、図6に示すように蛍光体層が矩形状に形成される。これにより、発光素子を均一な厚みで蛍光体層により覆うことが可能となるため、色度ムラがさらに軽減できる。蛍光体層は印刷に使用するマスク形状や厚みで制御することが可能である。   When the phosphor layer is formed not by line potting but by line printing, the phosphor layer is formed in a rectangular shape as shown in FIG. Thereby, since it becomes possible to cover a light emitting element with a fluorescent substance layer by uniform thickness, chromaticity nonuniformity can further be reduced. The phosphor layer can be controlled by the mask shape and thickness used for printing.

蛍光体層の配置位置としては、図1等のように全ての発光素子を覆うように形成するのが最も好ましい。全ての発光素子からの光を蛍光体層で波長変換して、使用することが可能であるためである。また図12のように発光素子1201を複数の発光素子の一部を蛍光体層で覆わない構成も採用することが可能である。この構成にすることによって、面状発光装置を構成する場合、線状発光装置を導光板に勘合する場合、蛍光体層に覆われていない発光素子が位置合わせに使用可能となる。   As the arrangement position of the phosphor layer, it is most preferable to form the phosphor layer so as to cover all the light emitting elements as shown in FIG. This is because the light from all the light emitting elements can be used after being converted in wavelength by the phosphor layer. Further, as shown in FIG. 12, it is possible to adopt a structure in which the light emitting element 1201 does not cover a part of the plurality of light emitting elements with the phosphor layer. With this configuration, when the planar light emitting device is configured, when the linear light emitting device is fitted to the light guide plate, the light emitting element not covered with the phosphor layer can be used for alignment.

図3(d)は蛍光体層上に蛍光体層を覆う封止樹脂を形成した状態を示した図である。封止樹脂の形状は発光素子や蛍光体層を包み込む形状をしている。   FIG. 3D is a view showing a state in which a sealing resin that covers the phosphor layer is formed on the phosphor layer. The shape of the sealing resin is such that it encloses the light emitting element and the phosphor layer.

封止樹脂は、トランスファーモールド成形、圧縮成形、キャスティングモールド成形等で成形可能である。封止樹脂が半円柱状である場合や凸部が半円柱状である場合は光を線状に集光する効果を発現する。半円柱状の曲率は、蛍光体層の曲率よりも小さくすることが好ましい。光を線状に集光すると面状発光装置に応用した場合に導光板に効率良く、入光することが可能となる。封止樹脂の形状は図3(e)のように凸部が半円柱状であり、凸部の側方に平坦部を有していることが好ましい。平坦部を備えることで、実装基板との密着性が向上し、また、発光素子の側方から出射される色ズレした光を面状発光装置にした場合、使用しない構成が可能となる。さらには凸部を図9や図10のような側面視が長方形状や台形状を採用することも可能である。配光特性を目的に応じて最適化可能である。さらに図7や図8のように封止樹脂全体が半円柱状である構成も可能である。この場合、発光素子の側方から出射した光も有効に導光板内に入光可能である。図8のように実装基板を半円柱状部と対応させるだけの幅を持たせることにより、線状発光装置として細型化が可能であり、面状発光装置に使用した場合、薄型化が可能となる。   The sealing resin can be molded by transfer molding, compression molding, casting molding, or the like. When the sealing resin has a semi-cylindrical shape or the convex portion has a semi-cylindrical shape, an effect of condensing light in a linear shape is exhibited. The semi-cylindrical curvature is preferably smaller than the curvature of the phosphor layer. When the light is condensed linearly, it can be efficiently incident on the light guide plate when applied to a planar light emitting device. As for the shape of sealing resin, it is preferable that a convex part is a semi-columnar shape like FIG.3 (e), and has a flat part in the side of a convex part. By providing the flat portion, the adhesion with the mounting substrate is improved, and when the color-shifted light emitted from the side of the light-emitting element is used as the planar light-emitting device, a configuration that is not used is possible. Further, the convex portion may adopt a rectangular shape or a trapezoidal shape when viewed from the side as shown in FIGS. The light distribution characteristics can be optimized according to the purpose. Further, a configuration in which the entire sealing resin is a semi-cylindrical shape as shown in FIGS. 7 and 8 is also possible. In this case, the light emitted from the side of the light emitting element can also enter the light guide plate effectively. As shown in FIG. 8, the mounting substrate is wide enough to correspond to the semi-cylindrical portion, so that it can be thinned as a linear light emitting device, and can be thinned when used in a planar light emitting device. Become.

図3(e)は、図3(d)の透光性を有する部分を透けた状態で示した状態図である。   FIG. 3 (e) is a state diagram showing the transparent portion of FIG. 3 (d).

以下に、各構成部材について述べる。
(発光素子)
発光素子とは、基板上にGaAlN,ZnO,ZnSe,SiC,GaP,GaAlAs,AlN,InN,AlInGaP,InGaN,GaN,AlInGaN等の半導体を発光層として形成されたものをいう。
Each component will be described below.
(Light emitting element)
A light-emitting element is a device in which a semiconductor such as GaAlN, ZnO, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN is formed on a substrate as a light-emitting layer.

(実装基板)
実装基板の構成としては、実装面が長方形状であり、かつ、実装される発光素子に対して電気を供給できる電極があれば良い。基板の種類としては、セラミック基板、ガラスエポキシ基板、アルミベース基板、銅ベース基板、プリント基板、フレキシブル基板等がある。
(Mounting board)
As a configuration of the mounting substrate, it is only necessary that the mounting surface has a rectangular shape and an electrode that can supply electricity to the light emitting element to be mounted. Examples of the substrate include a ceramic substrate, a glass epoxy substrate, an aluminum base substrate, a copper base substrate, a printed substrate, and a flexible substrate.

(蛍光体層)
蛍光体層は透光性樹脂に蛍光体を混ぜたものを使用する。さらに好適には拡散材を含有する。蛍光体としては、発光素子からの光の少なくとも一部を吸収して異なる波長を有する光を発する蛍光体を含有するものを言う。特に発光素子からの光を、それより長波長に変換させるものの方が効率が良い。発光素子からの光がエネルギーの高い短波長の可視光の場合、アルミニウム酸化物系蛍光体の一種であるYAG:Ceが好適に用いられる。特に、YAG:Ce蛍光体は、その含有量によって発光素子からの青色系の光を一部吸収して補色となる黄色系の光を発するために、白色系の混色光を発する高出力の線状発光装置を比較的簡単に形成することができる。
(Phosphor layer)
As the phosphor layer, a mixture of a translucent resin and a phosphor is used. More preferably, a diffusing material is contained. As the phosphor, a phosphor containing a phosphor that emits light having different wavelengths by absorbing at least a part of light from the light emitting element. In particular, it is more efficient to convert light from the light emitting element into a longer wavelength. When the light from the light-emitting element is short-wavelength visible light with high energy, YAG: Ce, which is a kind of aluminum oxide phosphor, is preferably used. In particular, the YAG: Ce phosphor is a high-power line that emits white-colored mixed light because it emits yellow-colored light that partially absorbs blue-colored light from the light-emitting element depending on its content. The light emitting device can be formed relatively easily.

透光性樹脂としてはシリコーン樹脂、エポキシ樹脂、アクリル樹脂等が用いられる。好適にはゲル状シリコーンが用いられる。劣化が少なく、ワイヤーを機械的衝撃から保護できるためである。   As the translucent resin, silicone resin, epoxy resin, acrylic resin, or the like is used. Preferably, gelled silicone is used. This is because there is little deterioration and the wire can be protected from mechanical shock.

拡散材としては、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素、二酸化珪素、重質炭酸カルシウム、軽質炭酸カルシウム、及び、これらを少なくとも一種類以上含む混合物等が挙げられる。   Examples of the diffusing material include barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, and a mixture containing at least one of these.

(封止樹脂)
封止樹脂としてはシリコーン樹脂、エポキシ樹脂、アクリル樹脂等が用いられる。好適にはエポキシ樹脂が使用される。最適な条件は蛍光体層がシリコーン樹脂であり、封止樹脂がエポキシ樹脂である。屈折率の関係は、エポキシ樹脂の屈折率が、シリコーン樹脂の屈折率よりも大きいため、エポキシ樹脂の曲率を小さくすることにより光の配光特性を絞ることが可能となる。
(Sealing resin)
As the sealing resin, silicone resin, epoxy resin, acrylic resin or the like is used. Epoxy resins are preferably used. Optimum conditions are that the phosphor layer is a silicone resin and the sealing resin is an epoxy resin. Regarding the relationship between the refractive indexes, since the refractive index of the epoxy resin is larger than that of the silicone resin, it is possible to reduce the light distribution characteristic by reducing the curvature of the epoxy resin.

(電極)
電極の材料は、金属が一般的に用いられる。銅が好適に使用され、銅の表面に銀を形成したものも好適に使用される。金属以外ではITO等も使用される。
(electrode)
A metal is generally used as an electrode material. Copper is preferably used, and copper formed with silver on the surface is also preferably used. Other than metal, ITO is also used.

電極の形成方法としては、電解メッキ、無電解メッキ、蒸着、スパッタ等で形成可能である。   The electrode can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like.

<第2の実施の形態>
図4と図5は、第2の実施の形態における面状発光装置4000を示す。線状発光装置は3000で示している。導光板を409で表している。線状発光装置3000と導光板409は光学的に接続される状態に配置される。導光板の入光部形状は平面形状でも良いが、好ましくは線状発光装置の封止樹脂部分と勘合する形状が好ましい。すなわち導光板の入光部形状が半円柱状の凹部を有することが好ましい。線状発光装置と導光板の間に空気層を介在させてしまうと光の入光効率が低下してしまうためである。入光部における半円柱状の凹部の曲率は、線状発光装置の封止樹脂の半円柱状を構成する曲率と同じか、それよりも大きいことが好ましい。線状発光装置の封止樹脂が固い材質の樹脂を使用した場合であり、且つ、導光板の材質が固い場合は、略完全に互いの曲率を揃えることが好ましい。
<Second Embodiment>
4 and 5 show a planar light emitting device 4000 according to the second embodiment. The linear light emitting device is indicated by 3000. The light guide plate is represented by 409. The linear light emitting device 3000 and the light guide plate 409 are disposed in an optically connected state. The light incident portion of the light guide plate may have a planar shape, but preferably has a shape that fits with the sealing resin portion of the linear light emitting device. That is, it is preferable that the light incident portion of the light guide plate has a semi-cylindrical recess. This is because if the air layer is interposed between the linear light emitting device and the light guide plate, the light incident efficiency is lowered. It is preferable that the curvature of the semi-cylindrical recess in the light entrance is the same as or larger than the curvature constituting the semi-cylindrical shape of the sealing resin of the linear light emitting device. In the case where the sealing resin of the linear light emitting device is made of a hard resin, and the light guide plate is hard, it is preferable that the curvatures of the light emitting plates are almost completely aligned.

一方、封止樹脂が柔らかい材質の樹脂を使用した場合、若しくは、導光板の材質が柔らかい場合は、導光板の曲率が大きくした方が好ましい。互いを接合するときに、機械的に押し当てていく過程で空気層を押し出していくことが可能になるためである。   On the other hand, when the sealing resin is a soft resin, or when the light guide plate is soft, it is preferable to increase the curvature of the light guide plate. This is because it is possible to extrude the air layer in the process of mechanically pressing when joining each other.

(導光板)
導光板の材料としては、アクリル樹脂、ポリカーボネート樹脂、非晶質ポリオレフィン樹脂、ポリスチレン樹脂、ノルボルネン系樹脂、シクロオレフィンポリマー(COP)等が挙げられる。
(Light guide plate)
Examples of the material of the light guide plate include acrylic resin, polycarbonate resin, amorphous polyolefin resin, polystyrene resin, norbornene resin, and cycloolefin polymer (COP).

<第3の実施の形態>
図15と図16は、第3の実施形態における線状発光装置15000と16000を示す。第3の実施の形態では、実装基板が長手方向に長方形状の凹部を有し、該凹部内に前記複数の発光素子と、前記蛍光体層と、を有している。凹部は底部1513a、1613aと、壁部1513b、1513c、1513d、1613b、1513cとから構成される。凹部の形成方法は適宜選択しうるが、セラミックの積層構造を採用することにより、容易に実施可能である。例えば図15においては1503a,1503b,1503c,1503d,1503eの5枚のセラミックシートを積層させ実装基板1503を実現している。それぞれのセラミックシートを所定の形状に打ち抜き加工を施し、所定の電極パターンを電解・無電解メッキ等で施し、互いに重ね合わせ、積層させた状態で焼結させる。これにより凹部を有する実装基板が得られる。
<Third Embodiment>
15 and 16 show linear light-emitting devices 15000 and 16000 in the third embodiment. In the third embodiment, the mounting substrate has a rectangular recess in the longitudinal direction, and the plurality of light emitting elements and the phosphor layer are included in the recess. The concave portion includes bottom portions 1513a and 1613a and wall portions 1513b, 1513c, 1513d, 1613b and 1513c. The method of forming the recesses can be selected as appropriate, but can be easily implemented by adopting a ceramic laminated structure. For example, in FIG. 15, a mounting substrate 1503 is realized by laminating five ceramic sheets 1503a, 1503b, 1503c, 1503d, and 1503e. Each ceramic sheet is punched into a predetermined shape, and a predetermined electrode pattern is applied by electrolysis / electroless plating, etc., stacked on each other, and sintered in a laminated state. As a result, a mounting substrate having a recess is obtained.

凹部の深さや壁部1513b,1513cの角度は目的とする配光特性と蛍光体層の厚さに応じて適宜選択する。   The depth of the recess and the angles of the walls 1513b and 1513c are appropriately selected according to the intended light distribution characteristics and the thickness of the phosphor layer.

また短手方向の凹部の壁を設けないことにより、線状光源として長手方向の配光特性を広配光にすることが可能である。長手方向に広配光特性を持たせることにより、導光板と光学的に接続して面状発光光源とした場合、輝度ムラの低減が可能となる。   Further, by not providing the wall of the concave portion in the short direction, it is possible to widen the light distribution characteristic in the longitudinal direction as a linear light source. By providing wide light distribution characteristics in the longitudinal direction, luminance unevenness can be reduced when a planar light source is optically connected to the light guide plate.

保護素子を実装する場合は、図16のように発光素子と同一面に実装しても良いし、図15のように発光素子よりも一段高く、蛍光体層と略同一面状に形成しても良い。   When the protective element is mounted, it may be mounted on the same surface as the light emitting element as shown in FIG. 16, or it is one step higher than the light emitting element as shown in FIG. Also good.

保護素子は一般的に光を吸収する性質を有するため、蛍光体層内部に封止した場合と、蛍光体層から露出させた場合とでは、配光特性が異なる。図15のように凹部を中央の壁で分断し、その中央の壁の上部に保護素子を実装した場合は中央部の輝度を下げることが可能となり、そのような配光特性が求められる場合に有用である。   Since the protective element generally has a property of absorbing light, the light distribution characteristics are different between when it is sealed inside the phosphor layer and when it is exposed from the phosphor layer. When the concave portion is divided by the central wall as shown in FIG. 15 and a protective element is mounted on the upper portion of the central wall, the luminance of the central portion can be lowered, and such light distribution characteristics are required. Useful.

本発明により、従来よりも点状光源である発光素子を使用して安価に線状発光装置およびそれを用いた面状発光装置の実現が可能となる。   According to the present invention, it is possible to realize a linear light-emitting device and a planar light-emitting device using the light-emitting element, which is a point light source, more inexpensively than in the past.

本発明に係る線状発光装置の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light-emitting device which concerns on this invention. 本発明に係る線状発光装置の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light-emitting device which concerns on this invention. 本発明に係る線状発光装置の製造方法を示す図である。It is a figure which shows the manufacturing method of the linear light-emitting device which concerns on this invention. 本発明に係る面状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the planar light emission source which concerns on this invention. 本発明に係る面状発光装置の導光板の入光部のバリエーションを表す図である。It is a figure showing the variation of the light-incidence part of the light-guide plate of the planar light-emitting device concerning this invention. 本発明に係る線状発光装置の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light-emitting device which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention. 本発明に係る線状発光光源の一実施形態を示す図である。It is a figure which shows one Embodiment of the linear light emission light source which concerns on this invention.

符号の説明Explanation of symbols

101,201,301,1101,1201,1301,1401,1501,1601 ・・・発光素子
103,203,303,803,1503,1603・・・実装基板
1503a,1503b,1503c,1503d,1503e, 1603a,1603b,1603c,1603d,1603e・・・実装基板を構成する各層
105,205,305,605,1105,1205,1305,1405,1505,1605・・・蛍光体層
107,207,307,707,907,1007,1107,1207,1307,1407,1507,1607・・・封止樹脂
307a,907a,1007a,1507a,1607a・・・凸部
307b,907b,1007b,1507b,1607b・・・平坦部
409・・・導光板
111a,111b,211a,211b,311a,311b,1111a,1111b,1211a,1211b,1311a,1311b,1411a,1411b,1511a,1511b,1611a,1611b・・・電極
1513,1613・・・凹部
1513a,1513b,1513c,1513d,1613a,1613b,1613c・・・凹部を形成する壁
1515,1615・・・保護素子
1000,2000,3000,6000,7000,8000,9000,10000,11000,12000,13000,14000,15000,16000・・・線状発光装置
4000・・・面状発光装置
101,201,301,1101,1201,1301,1401,1501,1601 ・ ・ ・ Light emitting element
103,203,303,803,1503,1603 ・ ・ ・ Mounting board
1503a, 1503b, 1503c, 1503d, 1503e, 1603a, 1603b, 1603c, 1603d, 1603e ・ ・ ・ Each layer constituting the mounting board
105,205,305,605,1105,1205,1305,1405,1505,1605 ... phosphor layer
107,207,307,707,907,1007,1107,1207,1307,1407,1507,1607 ・ ・ ・ Sealing resin
307a, 907a, 1007a, 1507a, 1607a ... convex
307b, 907b, 1007b, 1507b, 1607b ・ ・ ・ Flat part
409 ... Light guide plate
111a, 111b, 211a, 211b, 311a, 311b, 1111a, 1111b, 1211a, 1211b, 1311a, 1311b, 1411a, 1411b, 1511a, 1511b, 1611a, 1611b ...
1513,1613 ・ ・ ・ Recess
1513a, 1513b, 1513c, 1513d, 1613a, 1613b, 1613c ... Walls forming recesses
1515,1615 ... Protective element
1000, 2000, 3000, 6000, 7000, 8000, 9000, 10000, 11000, 12000, 13000, 14000, 15000, 16000 ... Linear light emitting devices
4000 ... Surface emitting device

Claims (5)

長方形状の実装基板と、
該実装基板上の長手方向に配された青色系発光の複数の発光素子と、
少なくとも前記複数の発光素子を線状に覆う蛍光体層と、
該蛍光体層を覆う封止樹脂と、を有する線状発光装置であって、
前記実装基板が長手方向に長方形状の凹部を有し、該凹部内に前記複数の発光素子と、前記蛍光体層と、を有し、
前記凹部は、該凹部を形成する壁を長手方向に有し、該線状発光装置の短手方向の端面には該凹部を形成する壁を有さない線状発光装置。
A rectangular mounting board;
A plurality of blue light emitting elements arranged in the longitudinal direction on the mounting substrate;
A phosphor layer covering at least the plurality of light emitting elements in a line;
A linear light emitting device having a sealing resin covering the phosphor layer ,
The mounting substrate has a rectangular recess in the longitudinal direction, the plurality of light emitting elements in the recess, and the phosphor layer,
The said recessed part has the wall which forms this recessed part in a longitudinal direction, The linear light-emitting device which does not have the wall which forms this recessed part in the end surface of the transversal direction of this linear light-emitting device.
前記封止樹脂が半円柱状である請求項1に記載の線状発光装置。   The linear light-emitting device according to claim 1, wherein the sealing resin has a semi-cylindrical shape. 前記封止樹脂が前記実装基板の長手方向に延在する凸部と、該凸部の側方に延在する平坦部と、を有する請求項1に記載の線状発光装置。   The linear light-emitting device according to claim 1, wherein the sealing resin has a convex portion extending in a longitudinal direction of the mounting substrate and a flat portion extending to a side of the convex portion. 前記凸部が半円柱状である請求項3に記載の線状発光装置。   The linear light-emitting device according to claim 3, wherein the convex portion has a semi-cylindrical shape. 入光部を有する導光板と、
該導光板に光学的に接続された請求項1乃至のいずれか1項に記載の線状発光装置と、
を備えることを特徴とする面状発光装置。
A light guide plate having a light incident portion;
The linear light-emitting device according to any one of claims 1 to 4 , which is optically connected to the light guide plate;
A planar light emitting device comprising:
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