JP5554899B2 - ワイヤを連結するための低抵抗率ジョイント並びにその製作方法 - Google Patents
ワイヤを連結するための低抵抗率ジョイント並びにその製作方法 Download PDFInfo
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- JP5554899B2 JP5554899B2 JP2008079436A JP2008079436A JP5554899B2 JP 5554899 B2 JP5554899 B2 JP 5554899B2 JP 2008079436 A JP2008079436 A JP 2008079436A JP 2008079436 A JP2008079436 A JP 2008079436A JP 5554899 B2 JP5554899 B2 JP 5554899B2
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- Prior art keywords
- wire
- magnesium diboride
- joint
- superconducting
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title description 9
- PZKRHHZKOQZHIO-UHFFFAOYSA-N [B].[B].[Mg] Chemical compound [B].[B].[Mg] PZKRHHZKOQZHIO-UHFFFAOYSA-N 0.000 claims description 153
- 238000000034 method Methods 0.000 claims description 92
- 239000000463 material Substances 0.000 claims description 72
- 238000005253 cladding Methods 0.000 claims description 14
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 238000000859 sublimation Methods 0.000 claims description 2
- 230000008022 sublimation Effects 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 63
- 239000002245 particle Substances 0.000 description 40
- 239000012071 phase Substances 0.000 description 29
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- 230000005291 magnetic effect Effects 0.000 description 26
- 238000010586 diagram Methods 0.000 description 24
- 230000004888 barrier function Effects 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- 238000002595 magnetic resonance imaging Methods 0.000 description 18
- 239000002243 precursor Substances 0.000 description 16
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 16
- 229910010271 silicon carbide Inorganic materials 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 13
- 239000010409 thin film Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 11
- 229910052796 boron Inorganic materials 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000005304 joining Methods 0.000 description 6
- 210000001503 joint Anatomy 0.000 description 6
- 229910052749 magnesium Inorganic materials 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- 239000002887 superconductor Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- -1 borides Chemical class 0.000 description 5
- 229910052729 chemical element Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000010297 mechanical methods and process Methods 0.000 description 4
- 230000005226 mechanical processes and functions Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012704 polymeric precursor Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000001311 chemical methods and process Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011852 carbon nanoparticle Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- UPKIHOQVIBBESY-UHFFFAOYSA-N magnesium;carbanide Chemical compound [CH3-].[CH3-].[Mg+2] UPKIHOQVIBBESY-UHFFFAOYSA-N 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- LNHZORZALMMUQW-UHFFFAOYSA-N oxane-2-carbonitrile Chemical compound N#CC1CCCCO1 LNHZORZALMMUQW-UHFFFAOYSA-N 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003257 polycarbosilane Polymers 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001778 solid-state sintering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/68—Connections to or between superconductive connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49014—Superconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Description
12 スキャナ
14 スキャナ制御回路
16 システム制御回路
18 患者ボア
20 テーブル
22 患者
24 主マグネットコイル
26 傾斜コイル
28 傾斜コイル
30 傾斜コイル
32 RFコイル
34 電源
36 制御回路
38 メモリ回路
40 制御回路
42 受信インタフェース回路
44 インタフェース構成要素
46 オペレータ制御装置
48 コンピュータモニタ
50 コンピュータキーボード
52 コンピュータマウス
54 プリンタ
56 ローカル及びリモートの画像アクセス/検査制御デバイス
58 ドープされた2ホウ化マグネシウム粉末
60 2ホウ化マグネシウム粒子
62 第2位相粒子
64 2ホウ化マグネシウム粉末
66 2ホウ化マグネシウム粒子
68 薄膜
70 厚さ
72〜74 方法工程
76〜88 方法工程
90〜94 方法工程
98 超伝導ワイヤ
100 フィラメント
101 バリア層
102 金属基
104〜112 方法工程
116 第1のワイヤ
118 第2のワイヤ
120 2ホウ化マグネシウムフィラメント
122 金属クラッド
124 拡散バリア
126 2ホウ化マグネシウムフィラメント
128 金属クラッド
130 拡散バリア
132 ボア穴
134 延長部分
136 ジョイント
138 材料
140〜146 方法工程
150 ジョイント
152 第1のワイヤ
154 第2のワイヤ
156 2ホウ化マグネシウムフィラメント
158 クラッド材料
160 ジョイント材料
162 ラッピング材料
164 突合せジョイント
166 ジョイント
168 2ホウ化マグネシウム/はんだ複合物
170 ジョイント
172 クプラート材料
174 析出物
176 ヒートシンク
Claims (3)
- ワイヤ(116、118、152、154)を連結する方法(140)であって、
ジョイント部位(136、150、164、166、170)において第1のワイヤ(116、152)の端部及び第2のワイヤ(118、154)の端部に2ホウ化マグネシウムジョイント材料を導入する工程(144)であって、該第1及び第2のワイヤ(116、118、152、154)のうちの少なくとも1つは超伝導2ホウ化マグネシウムフィラメント(120、126、156)を備える導入工程と、
前記第1のワイヤ(116、152)の端部と前記第2のワイヤ(118、154)の端部が前記ジョイント材料を介して電気的かつ機械的に結合されるようにジョイント部位(136、150、164、166、170)を処置する工程(146)と、
を含み、
前記ジョイント部位(136、150、164、166、170)を処置する前記工程(146)が、気化、昇華または揮発、あるいはこれらの組み合わせのうちの少なくとも1つを含み、
前記方法(140)が、さらに、前記導入工程の前に、前記2ホウ化マグネシウムフィラメントの端部及び該2ホウ化マグネシウムフィラメントを囲繞するクラッド材料の端部をシュレッダー加工し、第1のワイヤの粗面の端部及び前記第2のワイヤの粗面の端部を準備する工程(142)を有する
ことを特徴とする、方法。 - 前記シュレッダー加工は、硝酸を用いて行われることを特徴とする、請求項1に記載の方法。
- 前記ジョイント部位が、前記2ホウ化マグネシウムフィラメントと比べてより高い臨界温度を有するクプラート材料(172)を含むことを特徴とする、請求項1又は2に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/731,536 | 2007-03-30 | ||
US11/731,536 US20080236869A1 (en) | 2007-03-30 | 2007-03-30 | Low resistivity joints for joining wires and methods for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008258158A JP2008258158A (ja) | 2008-10-23 |
JP5554899B2 true JP5554899B2 (ja) | 2014-07-23 |
Family
ID=39386609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008079436A Expired - Fee Related JP5554899B2 (ja) | 2007-03-30 | 2008-03-26 | ワイヤを連結するための低抵抗率ジョイント並びにその製作方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20080236869A1 (ja) |
JP (1) | JP5554899B2 (ja) |
GB (1) | GB2448051B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8229528B2 (en) | 2008-04-17 | 2012-07-24 | Asg Superconductors, S.P.A. | Superconducting coil having a granular superconducting junction |
DE102008056824A1 (de) * | 2008-11-11 | 2010-05-20 | H.C. Starck Gmbh | Anorganische Verbindungen |
US8812069B2 (en) * | 2009-01-29 | 2014-08-19 | Hyper Tech Research, Inc | Low loss joint for superconducting wire |
DE102009010112B3 (de) * | 2009-02-21 | 2010-09-02 | Bruker Eas Gmbh | Verfahren zur supraleitenden Verbindung von MgB2-Supraleiterdrähten über eine MgB2-Matrix aus einem Mg-infiltrierten Borpulver-Presskörper |
DE102009010011B3 (de) * | 2009-02-21 | 2010-08-26 | Bruker Eas Gmbh | Verfahren zur Verbindung von zwei oder mehr MgB2-Supraleiterdrähten über einen Presskörper aus HTS-Pulver und supraleitende Verbindungsstelle von zwei oder mehr dieser Drähte |
DE102009022672A1 (de) * | 2009-05-26 | 2010-12-02 | Siemens Aktiengesellschaft | Supraleitfähige Verbindungseinrichtung der Endstücke zweier Supraleiter sowie Verfahren zu deren Herstellung |
US8345435B2 (en) * | 2009-08-07 | 2013-01-01 | Semiconductor Energy Laboratory Co., Ltd. | Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof |
DE102009043580B4 (de) * | 2009-09-30 | 2017-01-12 | Karlsruher Institut für Technologie | Verfahren zur Herstellung einer Verbindungsstruktur zwischen zwei Supraleitern und Struktur zur Verbindung zweier Supraleiter |
KR20110105679A (ko) * | 2010-03-19 | 2011-09-27 | 고려대학교 산학협력단 | 제 1세대 고온 초전도 선재의 초전도 접합 방법 |
JP5560160B2 (ja) * | 2010-10-28 | 2014-07-23 | 株式会社日立製作所 | 超電導線材の接続部及び超電導線材の接続方法 |
GB2487926B (en) | 2011-02-08 | 2013-06-19 | Siemens Plc | Joints with very low resistance between superconducting wires and methods for making such joints |
JP5603297B2 (ja) * | 2011-07-04 | 2014-10-08 | 株式会社日立製作所 | 超電導マグネット及びその製造方法 |
JP2013093401A (ja) * | 2011-10-25 | 2013-05-16 | Hitachi Ltd | 超電導マグネット及びその製造方法 |
GB2498565B (en) * | 2012-01-20 | 2014-09-17 | Siemens Plc | Methods for forming joints between magnesium diboride conductors |
JP2013225598A (ja) * | 2012-04-23 | 2013-10-31 | Hitachi Ltd | MgB2超電導マグネット |
WO2015049776A1 (ja) * | 2013-10-04 | 2015-04-09 | 株式会社日立製作所 | MgB2超電導線材、超電導接続構造およびそれを用いた超電導マグネット、超電導ケーブル |
EP2879238A1 (en) | 2013-11-27 | 2015-06-03 | Siemens Aktiengesellschaft | Method for forming a superconducting connection structure and superconducting connection structure |
DE102014206506A1 (de) | 2014-04-04 | 2015-10-08 | Siemens Aktiengesellschaft | Elektrische Spuleneinrichtung mit wenigstens zwei Teilspulen und Verfahren zur Herstellung |
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WO2023280739A1 (en) * | 2021-07-06 | 2023-01-12 | Nv Bekaert Sa | Method for restoring superconductivity of an mgb2 wire |
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JP2986871B2 (ja) * | 1990-08-22 | 1999-12-06 | 株式会社日立製作所 | 酸化物超電導体および酸化物超電導線ならびに超電導コイル |
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FR2712429B1 (fr) * | 1993-11-12 | 1996-01-26 | Michel Jean Robert Lagues | Materiau supraconducteur constitue de couches monomoleculaires superposees |
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JP2003086265A (ja) * | 2001-09-12 | 2003-03-20 | Furukawa Electric Co Ltd:The | 超電導線の接続部及びその接続方法 |
US20040077224A1 (en) * | 2002-05-13 | 2004-04-22 | Marchese Greg M. | Combination terminal device |
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US7745376B2 (en) * | 2004-08-10 | 2010-06-29 | Nove Technologies, Inc. | Superconducting composite |
US7464901B2 (en) * | 2005-01-28 | 2008-12-16 | The Boeing Company | Method and device for magnetic space radiation shield |
US7071148B1 (en) * | 2005-04-08 | 2006-07-04 | Superpower, Inc. | Joined superconductive articles |
US7494688B2 (en) | 2006-07-24 | 2009-02-24 | General Electric Company | Methods for making doped magnesium diboride powders |
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US9287485B2 (en) | 2016-03-15 |
GB0805295D0 (en) | 2008-04-30 |
US20080236869A1 (en) | 2008-10-02 |
GB2448051A (en) | 2008-10-01 |
JP2008258158A (ja) | 2008-10-23 |
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