JP5554563B2 - 次数選択されたオーバレイ測定 - Google Patents

次数選択されたオーバレイ測定 Download PDF

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Publication number
JP5554563B2
JP5554563B2 JP2009513282A JP2009513282A JP5554563B2 JP 5554563 B2 JP5554563 B2 JP 5554563B2 JP 2009513282 A JP2009513282 A JP 2009513282A JP 2009513282 A JP2009513282 A JP 2009513282A JP 5554563 B2 JP5554563 B2 JP 5554563B2
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Japan
Prior art keywords
optical device
grating
pitch
target
diffraction orders
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JP2009513282A
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Japanese (ja)
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JP2009539109A (ja
JP2009539109A5 (enExample
Inventor
カンデル・ダニエル
レビンスキ・ブラディミル
アデル・マイケル・イー．
セリグソン・ジョエル・エル．
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2009513282A 2006-06-01 2007-05-31 次数選択されたオーバレイ測定 Active JP5554563B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US81056006P 2006-06-01 2006-06-01
US60/810,560 2006-06-01
US89763707P 2007-01-26 2007-01-26
US60/897,637 2007-01-26
US11/754,892 2007-05-29
US11/754,892 US7528941B2 (en) 2006-06-01 2007-05-29 Order selected overlay metrology
PCT/US2007/012875 WO2007143056A2 (en) 2006-06-01 2007-05-31 Order selected overlay metrology

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014110715A Division JP6073832B2 (ja) 2006-06-01 2014-05-29 次数選択されたオーバレイ測定

Publications (3)

Publication Number Publication Date
JP2009539109A JP2009539109A (ja) 2009-11-12
JP2009539109A5 JP2009539109A5 (enExample) 2013-03-28
JP5554563B2 true JP5554563B2 (ja) 2014-07-23

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ID=38789680

Family Applications (2)

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JP2009513282A Active JP5554563B2 (ja) 2006-06-01 2007-05-31 次数選択されたオーバレイ測定
JP2014110715A Active JP6073832B2 (ja) 2006-06-01 2014-05-29 次数選択されたオーバレイ測定

Family Applications After (1)

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JP2014110715A Active JP6073832B2 (ja) 2006-06-01 2014-05-29 次数選択されたオーバレイ測定

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US (1) US7528941B2 (enExample)
JP (2) JP5554563B2 (enExample)
WO (1) WO2007143056A2 (enExample)

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KR101855220B1 (ko) * 2013-10-30 2018-05-08 에이에스엠엘 네델란즈 비.브이. 검사 장치 및 방법, 계측 타겟을 가지는 기판, 리소그래피 시스템, 및 디바이스 제조 방법
US9490182B2 (en) * 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
US9784690B2 (en) 2014-05-12 2017-10-10 Kla-Tencor Corporation Apparatus, techniques, and target designs for measuring semiconductor parameters
NL2015160A (en) 2014-07-28 2016-07-07 Asml Netherlands Bv Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method.
WO2016045945A1 (en) 2014-09-26 2016-03-31 Asml Netherlands B.V. Inspection apparatus and device manufacturing method
CN112698551B (zh) 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
TWI755987B (zh) 2015-05-19 2022-02-21 美商克萊譚克公司 具有用於疊對測量之形貌相位控制之光學系統
JP6378149B2 (ja) * 2015-09-16 2018-08-22 東芝メモリ株式会社 欠陥検出装置、欠陥検出方法およびプログラム
DE102015221773A1 (de) * 2015-11-05 2017-05-11 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Charakterisierung eines durch wenigstens einen Lithographieschritt strukturierten Wafers
WO2017097532A1 (en) 2015-12-09 2017-06-15 Asml Holding N.V. A flexible illuminator
US9846128B2 (en) * 2016-01-19 2017-12-19 Applied Materials Israel Ltd. Inspection system and a method for evaluating an exit pupil of an inspection system
JP6731490B2 (ja) 2016-03-07 2020-07-29 エーエスエムエル ネザーランズ ビー．ブイ． 照明システムおよびメトロロジシステム
KR102640173B1 (ko) * 2016-06-14 2024-02-26 삼성전자주식회사 회절 기반 오버레이 마크 및 오버레이 계측방법
US11112704B2 (en) * 2017-02-10 2021-09-07 Kla-Tencor Corporation Mitigation of inaccuracies related to grating asymmetries in scatterometry measurements
JP7115826B2 (ja) * 2017-07-18 2022-08-09 三星電子株式会社 撮像装置および撮像方法
US10429315B2 (en) * 2017-07-18 2019-10-01 Samsung Electronics Co., Ltd. Imaging apparatus and imaging method
US10705435B2 (en) 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
KR102729956B1 (ko) 2018-08-28 2024-11-13 케이엘에이 코포레이션 2-회절된 차수들의 이미징을 사용한 축외 조명 오버레이 측정
WO2020074412A1 (en) * 2018-10-08 2020-04-16 Asml Netherlands B.V. Metrology method, patterning device, apparatus and computer program
CN113260924B (zh) 2018-12-31 2025-02-18 Asml荷兰有限公司 用于重叠量测的方法及其设备
US11256177B2 (en) * 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
US11346657B2 (en) 2020-05-22 2022-05-31 Kla Corporation Measurement modes for overlay
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
US11355375B2 (en) * 2020-07-09 2022-06-07 Kla Corporation Device-like overlay metrology targets displaying Moiré effects
US11164307B1 (en) 2020-07-21 2021-11-02 Kla Corporation Misregistration metrology by using fringe Moiré and optical Moiré effects
JP2023043534A (ja) * 2021-09-16 2023-03-29 キオクシア株式会社 測定方法、測定装置、及びマーク
US11841621B2 (en) * 2021-10-29 2023-12-12 KLA Corporation CA Moiré scatterometry overlay
US11796925B2 (en) 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
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Also Published As

Publication number Publication date
US20070279630A1 (en) 2007-12-06
JP2009539109A (ja) 2009-11-12
JP2014160874A (ja) 2014-09-04
WO2007143056A2 (en) 2007-12-13
US7528941B2 (en) 2009-05-05
JP6073832B2 (ja) 2017-02-01
WO2007143056A3 (en) 2008-11-13

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