JP5542802B2 - 複数のスペクトルを使用する化学機械研磨での終点検出 - Google Patents

複数のスペクトルを使用する化学機械研磨での終点検出 Download PDF

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Publication number
JP5542802B2
JP5542802B2 JP2011507606A JP2011507606A JP5542802B2 JP 5542802 B2 JP5542802 B2 JP 5542802B2 JP 2011507606 A JP2011507606 A JP 2011507606A JP 2011507606 A JP2011507606 A JP 2011507606A JP 5542802 B2 JP5542802 B2 JP 5542802B2
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Prior art keywords
spectrum
substrate
polishing
spectra
determining whether
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Japanese (ja)
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JP2011520264A5 (enrdf_load_stackoverflow
JP2011520264A (ja
Inventor
ジュン キアン，
シヴァクマー ダンダパニ，
ハリー， キュー． リー，
トーマス， エイチ． オスターヘルド，
ジセ チュ，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011507606A 2008-05-02 2009-04-29 複数のスペクトルを使用する化学機械研磨での終点検出 Active JP5542802B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4996508P 2008-05-02 2008-05-02
US61/049,965 2008-05-02
PCT/US2009/042085 WO2009134865A2 (en) 2008-05-02 2009-04-29 Endpoint detection in chemical mechanical polishing using multiple spectra

Publications (3)

Publication Number Publication Date
JP2011520264A JP2011520264A (ja) 2011-07-14
JP2011520264A5 JP2011520264A5 (enrdf_load_stackoverflow) 2012-06-21
JP5542802B2 true JP5542802B2 (ja) 2014-07-09

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JP2011507606A Active JP5542802B2 (ja) 2008-05-02 2009-04-29 複数のスペクトルを使用する化学機械研磨での終点検出

Country Status (5)

Country Link
US (1) US20090275265A1 (enrdf_load_stackoverflow)
JP (1) JP5542802B2 (enrdf_load_stackoverflow)
KR (2) KR101619374B1 (enrdf_load_stackoverflow)
CN (2) CN103537975A (enrdf_load_stackoverflow)
WO (1) WO2009134865A2 (enrdf_load_stackoverflow)

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Also Published As

Publication number Publication date
CN102017094B (zh) 2013-11-20
KR101619374B1 (ko) 2016-05-10
KR20110021842A (ko) 2011-03-04
CN103537975A (zh) 2014-01-29
KR20160052769A (ko) 2016-05-12
WO2009134865A3 (en) 2010-02-18
WO2009134865A2 (en) 2009-11-05
JP2011520264A (ja) 2011-07-14
US20090275265A1 (en) 2009-11-05
CN102017094A (zh) 2011-04-13

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