KR101619374B1 - 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 - Google Patents

다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 Download PDF

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KR101619374B1
KR101619374B1 KR1020107027159A KR20107027159A KR101619374B1 KR 101619374 B1 KR101619374 B1 KR 101619374B1 KR 1020107027159 A KR1020107027159 A KR 1020107027159A KR 20107027159 A KR20107027159 A KR 20107027159A KR 101619374 B1 KR101619374 B1 KR 101619374B1
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Prior art keywords
spectra
polishing
end point
substrate
chemical mechanical
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KR20110021842A (ko
Inventor
준 킨
시바쿠말 단다파니
해리 큐. 리
토마스 에이치. 오스터헬드
자이즈 츄
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020107027159A 2008-05-02 2009-04-29 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출 Active KR101619374B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4996508P 2008-05-02 2008-05-02
US61/049,965 2008-05-02

Related Child Applications (1)

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KR1020167010766A Division KR20160052769A (ko) 2008-05-02 2009-04-29 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출

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KR20110021842A KR20110021842A (ko) 2011-03-04
KR101619374B1 true KR101619374B1 (ko) 2016-05-10

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KR1020167010766A Ceased KR20160052769A (ko) 2008-05-02 2009-04-29 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출

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US (1) US20090275265A1 (enrdf_load_stackoverflow)
JP (1) JP5542802B2 (enrdf_load_stackoverflow)
KR (2) KR101619374B1 (enrdf_load_stackoverflow)
CN (2) CN103537975A (enrdf_load_stackoverflow)
WO (1) WO2009134865A2 (enrdf_load_stackoverflow)

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Publication number Publication date
CN102017094B (zh) 2013-11-20
KR20110021842A (ko) 2011-03-04
CN103537975A (zh) 2014-01-29
KR20160052769A (ko) 2016-05-12
JP5542802B2 (ja) 2014-07-09
WO2009134865A3 (en) 2010-02-18
WO2009134865A2 (en) 2009-11-05
JP2011520264A (ja) 2011-07-14
US20090275265A1 (en) 2009-11-05
CN102017094A (zh) 2011-04-13

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