JP5541770B2 - ウェーハ研磨装置およびウェーハの製造方法 - Google Patents

ウェーハ研磨装置およびウェーハの製造方法 Download PDF

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Publication number
JP5541770B2
JP5541770B2 JP2009217854A JP2009217854A JP5541770B2 JP 5541770 B2 JP5541770 B2 JP 5541770B2 JP 2009217854 A JP2009217854 A JP 2009217854A JP 2009217854 A JP2009217854 A JP 2009217854A JP 5541770 B2 JP5541770 B2 JP 5541770B2
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Japan
Prior art keywords
wafer
hole
absence
carrier
polishing
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JP2009217854A
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English (en)
Japanese (ja)
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JP2011066342A (ja
JP2011066342A5 (enrdf_load_stackoverflow
Inventor
正博 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
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Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Priority to JP2009217854A priority Critical patent/JP5541770B2/ja
Priority to KR1020100089936A priority patent/KR101657316B1/ko
Priority to CN201010287709.6A priority patent/CN102019581B/zh
Publication of JP2011066342A publication Critical patent/JP2011066342A/ja
Publication of JP2011066342A5 publication Critical patent/JP2011066342A5/ja
Application granted granted Critical
Publication of JP5541770B2 publication Critical patent/JP5541770B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009217854A 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法 Active JP5541770B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法
KR1020100089936A KR101657316B1 (ko) 2009-09-18 2010-09-14 웨이퍼 연마 장치 및 웨이퍼의 제조 방법
CN201010287709.6A CN102019581B (zh) 2009-09-18 2010-09-17 晶圆研磨装置和晶圆的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2011066342A JP2011066342A (ja) 2011-03-31
JP2011066342A5 JP2011066342A5 (enrdf_load_stackoverflow) 2012-10-25
JP5541770B2 true JP5541770B2 (ja) 2014-07-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009217854A Active JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Country Status (3)

Country Link
JP (1) JP5541770B2 (enrdf_load_stackoverflow)
KR (1) KR101657316B1 (enrdf_load_stackoverflow)
CN (1) CN102019581B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616464B1 (ko) * 2014-11-18 2016-04-29 주식회사 엘지실트론 웨이퍼 연마장비의 웨이퍼 로딩장치 및 웨이퍼 로딩위치 조정 방법
CN109434671A (zh) * 2018-10-11 2019-03-08 德淮半导体有限公司 一种晶圆加工设备及加工方法
JP2020059095A (ja) * 2018-10-11 2020-04-16 株式会社ブイ・テクノロジー ウェハの研磨装置および研磨方法
CN111347061B (zh) * 2018-12-24 2021-03-30 有研半导体材料有限公司 一种硅环加工的工艺方法
CN110767587B (zh) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110752169B (zh) * 2019-10-21 2022-03-22 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110695840B (zh) * 2019-11-07 2021-02-02 许昌学院 一种基于光电检测的半导体研磨装置
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统
JP2024151787A (ja) * 2023-04-13 2024-10-25 株式会社太陽 両面研磨装置
CN117260450B (zh) * 2023-11-22 2024-01-23 连云港弘鼎石英有限公司 一种具有防尘机构的石英制品加工用磨边设备
CN119833445B (zh) * 2025-01-09 2025-09-02 北京日扬弘创智能装备有限公司 用于半导体制造设备控制的方法、系统、装置及设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3663348B2 (ja) * 2000-09-26 2005-06-22 Ｔｏｗａ株式会社 研磨装置及び研磨方法
JP4337581B2 (ja) * 2004-02-27 2009-09-30 信越半導体株式会社 半導体ウエーハの両面研磨装置及び割れ検査方法
JP2005288648A (ja) * 2004-04-02 2005-10-20 Sumco Corp 両面研磨装置の異物検出方法
JP4522360B2 (ja) * 2005-12-02 2010-08-11 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP2009123790A (ja) * 2007-11-13 2009-06-04 Disco Abrasive Syst Ltd 研削装置

Also Published As

Publication number Publication date
CN102019581B (zh) 2015-03-25
CN102019581A (zh) 2011-04-20
JP2011066342A (ja) 2011-03-31
KR101657316B1 (ko) 2016-09-13
KR20110031108A (ko) 2011-03-24

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