JP5539321B2 - 安定な水性スラリー懸濁物 - Google Patents
安定な水性スラリー懸濁物 Download PDFInfo
- Publication number
- JP5539321B2 JP5539321B2 JP2011506239A JP2011506239A JP5539321B2 JP 5539321 B2 JP5539321 B2 JP 5539321B2 JP 2011506239 A JP2011506239 A JP 2011506239A JP 2011506239 A JP2011506239 A JP 2011506239A JP 5539321 B2 JP5539321 B2 JP 5539321B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- aqueous
- abrasive
- metal
- suspended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/061—Carbides; Hydrides; Nitrides
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/08—Inorganic acids or salts thereof
- C10M2201/084—Inorganic acids or salts thereof containing sulfur, selenium or tellurium
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/0406—Ethers; Acetals; Ortho-esters; Ortho-carbonates used as base material
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
- C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2050/00—Form in which the lubricant is applied to the material being lubricated
- C10N2050/015—Dispersions of solid lubricants
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2008/005256 WO2009131556A1 (en) | 2008-04-24 | 2008-04-24 | Stable aqueous slurry suspensions |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011524814A JP2011524814A (ja) | 2011-09-08 |
JP5539321B2 true JP5539321B2 (ja) | 2014-07-02 |
Family
ID=41217080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011506239A Expired - Fee Related JP5539321B2 (ja) | 2008-04-24 | 2008-04-24 | 安定な水性スラリー懸濁物 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2268777A4 (zh) |
JP (1) | JP5539321B2 (zh) |
KR (1) | KR20110013417A (zh) |
CN (1) | CN102027101A (zh) |
WO (1) | WO2009131556A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019520989A (ja) * | 2016-06-23 | 2019-07-25 | ピーピーティー リサーチ,インク. | 分散媒中の不活性粒子および研磨粒子を分離および懸濁させることを目的とした粘性粒子の水性、半水性、非水性スラリーサスペンションのin−situ生成 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010014551A1 (de) * | 2010-03-23 | 2011-09-29 | Schott Solar Ag | Fluide Trennmedien und deren Verwendung |
CN102451623A (zh) * | 2010-10-15 | 2012-05-16 | Ppt研究公司 | 稳定的水性浆状悬浮液 |
CN102453439B (zh) * | 2010-10-22 | 2015-07-29 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
JP2012135870A (ja) * | 2010-12-10 | 2012-07-19 | Nagasaki Univ | 切断方法 |
CN103192297B (zh) * | 2012-08-24 | 2016-09-21 | 广东工业大学 | 一种单晶碳化硅晶片的化学集群磁流变复合加工方法 |
CN102983071B (zh) * | 2012-12-12 | 2015-05-06 | 天津中环领先材料技术有限公司 | 一种使用普通砂料的单晶硅晶圆片背损伤加工方法 |
US11026765B2 (en) | 2013-07-10 | 2021-06-08 | H2O Tech, Inc. | Stabilized, water-jet slurry apparatus and method |
CN103740452B (zh) * | 2013-12-20 | 2015-04-29 | 开封恒锐新金刚石制品有限公司 | 环保型金刚线切割用冷却液及其配制方法 |
CN105908154B (zh) * | 2016-06-04 | 2018-02-02 | 常州大学 | 一种用于制备金刚石线锯的二氧化钛溶胶及其应用 |
CN106590904B (zh) * | 2016-11-14 | 2019-08-06 | 武汉宜田科技发展有限公司 | 一种金刚线切割单/多晶硅棒用冷却液 |
CN108034486B (zh) * | 2017-12-20 | 2020-06-19 | 苏州禾川化学技术服务有限公司 | 一种高润滑自消泡易清洗环保油性线切割液 |
EP3632618B1 (en) * | 2018-10-04 | 2021-03-10 | Politecnico di Milano | Abrasive water-jet cutting machine and method, and composition comprising abrasive material |
CN113614196B (zh) * | 2019-01-31 | 2023-09-29 | 普瑞恩有限公司 | 用于抛光硬质基材的多峰金刚石磨料包或浆料 |
CN111437973B (zh) * | 2020-04-15 | 2022-03-29 | 山东格润德环保科技有限公司 | 一种粒径分布均匀的氢氧化镁悬浮液的研磨方法及其应用 |
TW202311461A (zh) * | 2020-07-20 | 2023-03-16 | 美商Cmc材料股份有限公司 | 矽晶圓拋光組合物及方法 |
CN115746789B (zh) * | 2022-12-12 | 2024-03-22 | 郑州磨料磨具磨削研究所有限公司 | 一种稳定全悬浮研磨用金刚石研磨液及其制备方法 |
WO2024162437A1 (ja) * | 2023-02-02 | 2024-08-08 | 三井金属鉱業株式会社 | 研磨材スラリー |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU956529A1 (ru) * | 1981-01-05 | 1982-09-07 | Волжский Филиал Всесоюзного Научно-Исследовательского Института Абразивов И Шлифования | Суспензи дл механической обработки металлов |
EP0396711A1 (fr) | 1988-11-03 | 1990-11-14 | Trimex Silicon E.U.R.L. | Unite de clivage par abrasion |
JP3296781B2 (ja) * | 1998-04-21 | 2002-07-02 | 信越半導体株式会社 | 水性切削液、その製造方法、ならびにこの水性切削液を用いた切削方法 |
FR2789998B1 (fr) * | 1999-02-18 | 2005-10-07 | Clariant France Sa | Nouvelle composition de polissage mecano-chimique d'une couche en un materiau conducteur d'aluminium ou d'alliage d'aluminium |
US6054422A (en) | 1999-02-19 | 2000-04-25 | Ppt Research, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
US6402978B1 (en) * | 1999-05-06 | 2002-06-11 | Mpm Ltd. | Magnetic polishing fluids for polishing metal substrates |
JP3721497B2 (ja) * | 1999-07-15 | 2005-11-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物の製造方法 |
US6503418B2 (en) * | 1999-11-04 | 2003-01-07 | Advanced Micro Devices, Inc. | Ta barrier slurry containing an organic additive |
JP2001284296A (ja) * | 2000-03-02 | 2001-10-12 | Eternal Chemical Co Ltd | 研磨性スラリー及びその使用 |
JP2002020732A (ja) * | 2000-07-05 | 2002-01-23 | Showa Denko Kk | 研磨用組成物 |
AU2001269436A1 (en) * | 2000-07-05 | 2002-01-14 | Showa Denko K K | Polishing composition and magnetic recording disk substrate polished with the polishing composition |
US6602834B1 (en) | 2000-08-10 | 2003-08-05 | Ppt Resaerch, Inc. | Cutting and lubricating composition for use with a wire cutting apparatus |
TW575660B (en) * | 2001-09-07 | 2004-02-11 | Dai Ichi Kogyo Seiyaku Co Ltd | Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
JP3813865B2 (ja) * | 2001-12-11 | 2006-08-23 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
US7294044B2 (en) * | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
JP2006352096A (ja) * | 2005-05-17 | 2006-12-28 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
-
2008
- 2008-04-24 JP JP2011506239A patent/JP5539321B2/ja not_active Expired - Fee Related
- 2008-04-24 WO PCT/US2008/005256 patent/WO2009131556A1/en active Application Filing
- 2008-04-24 KR KR1020107026288A patent/KR20110013417A/ko not_active Application Discontinuation
- 2008-04-24 CN CN2008801287872A patent/CN102027101A/zh active Pending
- 2008-04-24 EP EP08743223A patent/EP2268777A4/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019520989A (ja) * | 2016-06-23 | 2019-07-25 | ピーピーティー リサーチ,インク. | 分散媒中の不活性粒子および研磨粒子を分離および懸濁させることを目的とした粘性粒子の水性、半水性、非水性スラリーサスペンションのin−situ生成 |
JP7116872B2 (ja) | 2016-06-23 | 2022-08-12 | ピーピーティー リサーチ,インク. | 分散媒中の不活性粒子および研磨粒子を分離および懸濁させることを目的とした粘性粒子の水性、半水性、非水性スラリーサスペンションのin-situ生成 |
Also Published As
Publication number | Publication date |
---|---|
CN102027101A (zh) | 2011-04-20 |
EP2268777A1 (en) | 2011-01-05 |
KR20110013417A (ko) | 2011-02-09 |
WO2009131556A1 (en) | 2009-10-29 |
JP2011524814A (ja) | 2011-09-08 |
EP2268777A4 (en) | 2011-11-23 |
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