JP5537552B2 - シザーリフト搬送ロボット - Google Patents

シザーリフト搬送ロボット Download PDF

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Publication number
JP5537552B2
JP5537552B2 JP2011531099A JP2011531099A JP5537552B2 JP 5537552 B2 JP5537552 B2 JP 5537552B2 JP 2011531099 A JP2011531099 A JP 2011531099A JP 2011531099 A JP2011531099 A JP 2011531099A JP 5537552 B2 JP5537552 B2 JP 5537552B2
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JP
Japan
Prior art keywords
platform
coupled
end effector
assembly
linear
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JP2011531099A
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English (en)
Japanese (ja)
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JP2012505548A (ja
JP2012505548A5 (OSRAM
Inventor
真一 栗田
隆之 松本
スハイル アンワー
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2012505548A5 publication Critical patent/JP2012505548A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
    • B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
    • B66F7/06—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms supported by levers for vertical movement
    • B66F7/065—Scissor linkages, i.e. X-configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Structural Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011531099A 2008-10-07 2009-10-05 シザーリフト搬送ロボット Active JP5537552B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/247,135 2008-10-07
US12/247,135 US8272830B2 (en) 2008-10-07 2008-10-07 Scissor lift transfer robot
PCT/US2009/059570 WO2010042448A2 (en) 2008-10-07 2009-10-05 Scissor lift transfer robot

Publications (3)

Publication Number Publication Date
JP2012505548A JP2012505548A (ja) 2012-03-01
JP2012505548A5 JP2012505548A5 (OSRAM) 2013-07-04
JP5537552B2 true JP5537552B2 (ja) 2014-07-02

Family

ID=42075949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011531099A Active JP5537552B2 (ja) 2008-10-07 2009-10-05 シザーリフト搬送ロボット

Country Status (6)

Country Link
US (1) US8272830B2 (OSRAM)
JP (1) JP5537552B2 (OSRAM)
KR (1) KR101292135B1 (OSRAM)
CN (1) CN102165575B (OSRAM)
TW (1) TWI402206B (OSRAM)
WO (1) WO2010042448A2 (OSRAM)

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US20130277632A1 (en) * 2008-09-03 2013-10-24 Cemb S.P.A. Lifting device, particularly for lifting wheels and the like, for wheel balancing and tire moving machines
JP2010158759A (ja) * 2008-12-08 2010-07-22 Daihen Corp ワーク搬送装置
US9691650B2 (en) * 2009-09-29 2017-06-27 Applied Materials, Inc. Substrate transfer robot with chamber and substrate monitoring capability
JP6298232B2 (ja) * 2010-01-22 2018-03-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板冷却を備えた搬送ロボット
KR101230467B1 (ko) 2010-07-29 2013-02-25 주식회사 티이에스 기판 이송 유닛 및 이를 포함하는 기판 이송 장치
US20120223540A1 (en) * 2011-03-01 2012-09-06 L&W Engineering, Inc. Recreational Vehicle Lift Mechanism
KR101167120B1 (ko) * 2011-05-30 2012-07-20 주은유브이텍 주식회사 자외선 경화장치
JP5896549B2 (ja) * 2011-07-20 2016-03-30 株式会社ダイヘン 冷却ユニット及びこれを用いたワーク搬送装置
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
US20130309048A1 (en) * 2012-05-16 2013-11-21 Lam Research Ag Apparatus and method for transporting wafer-shaped articles
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
US9387869B1 (en) * 2015-04-16 2016-07-12 Aviad Berger Luggage with mechanically integrated trolley
US10052764B2 (en) 2016-06-16 2018-08-21 Toyota Motor Engineering & Manufacutring North America, Inc. Automated and adjustable platform surface
US10470841B2 (en) 2017-03-28 2019-11-12 Steris Inc. Robot-based rack processing system
DE102018113197A1 (de) * 2017-06-02 2018-12-06 Dücker Group GmbH Palettenroboter mit Hubscherengliedern
CN107225554B (zh) * 2017-06-19 2020-07-14 中电投宣化新能源发电有限公司 一种用于光伏发电装置维护工作的智能巡检设备
CN108145734B (zh) * 2017-12-26 2020-12-29 浙江勃嘉工业自动化有限公司 一种便于拆卸的自动化机械手
KR102405917B1 (ko) * 2020-04-06 2022-06-07 한국기계연구원 적층형 모듈 로봇
KR102405918B1 (ko) * 2020-04-27 2022-06-07 한국기계연구원 리프트 모듈 및 적층형 모듈 로봇
US11602064B2 (en) 2020-09-01 2023-03-07 Applied Materials, Inc. Dynamic electrical and fluid delivery system with indexing motion for batch processing chambers
CN112357581A (zh) * 2020-12-30 2021-02-12 彩虹（合肥）液晶玻璃有限公司 一种玻璃基板风干及传送装置
JP2023104250A (ja) * 2022-01-17 2023-07-28 東京エレクトロン株式会社 基板処理装置、および漏液検知方法

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Also Published As

Publication number Publication date
US20100086380A1 (en) 2010-04-08
CN102165575B (zh) 2014-07-09
JP2012505548A (ja) 2012-03-01
US8272830B2 (en) 2012-09-25
CN102165575A (zh) 2011-08-24
WO2010042448A2 (en) 2010-04-15
TW201022111A (en) 2010-06-16
KR20110070897A (ko) 2011-06-24
WO2010042448A3 (en) 2010-07-22
KR101292135B1 (ko) 2013-08-16
TWI402206B (zh) 2013-07-21

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