JP5535060B2 - 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 - Google Patents

銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 Download PDF

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Publication number
JP5535060B2
JP5535060B2 JP2010292233A JP2010292233A JP5535060B2 JP 5535060 B2 JP5535060 B2 JP 5535060B2 JP 2010292233 A JP2010292233 A JP 2010292233A JP 2010292233 A JP2010292233 A JP 2010292233A JP 5535060 B2 JP5535060 B2 JP 5535060B2
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Japan
Prior art keywords
etching
acid
copper
component
mass
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JP2010292233A
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Japanese (ja)
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JP2012140651A (ja
Inventor
裕一郎 岸
亜沙子 佐々木
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Adeka Corp
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Adeka Corp
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Priority to JP2010292233A priority Critical patent/JP5535060B2/ja
Priority to TW100143354A priority patent/TWI541384B/zh
Priority to KR1020110142235A priority patent/KR101878496B1/ko
Publication of JP2012140651A publication Critical patent/JP2012140651A/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2010292233A 2010-12-28 2010-12-28 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 Active JP5535060B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010292233A JP5535060B2 (ja) 2010-12-28 2010-12-28 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
TW100143354A TWI541384B (zh) 2010-12-28 2011-11-25 含銅材料用蝕刻劑組成物及含銅材料的蝕刻方法
KR1020110142235A KR101878496B1 (ko) 2010-12-28 2011-12-26 구리 함유 재료용 에칭제 조성물 및 구리 함유 재료의 에칭 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010292233A JP5535060B2 (ja) 2010-12-28 2010-12-28 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Publications (2)

Publication Number Publication Date
JP2012140651A JP2012140651A (ja) 2012-07-26
JP5535060B2 true JP5535060B2 (ja) 2014-07-02

Family

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Family Applications (1)

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JP2010292233A Active JP5535060B2 (ja) 2010-12-28 2010-12-28 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Country Status (3)

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JP (1) JP5535060B2 (ko)
KR (1) KR101878496B1 (ko)
TW (1) TWI541384B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775858B1 (ko) 2013-12-06 2017-09-06 멕크 가부시키가이샤 에칭액, 보급액 및 구리 배선 형성 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036064A (ja) * 2012-08-08 2014-02-24 Ube Ind Ltd プリント配線板の製造方法
KR102079658B1 (ko) * 2013-04-05 2020-02-20 해성디에스 주식회사 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
KR101527117B1 (ko) 2013-06-27 2015-06-09 삼성디스플레이 주식회사 식각액 조성물, 이를 이용한 금속 배선 제조 방법 및 박막 트랜지스터 기판 제조방법
CN105603433A (zh) * 2016-01-29 2016-05-25 江苏净拓环保科技有限公司 一种酸性蚀刻液提铜系统添加剂配方
JP7027323B2 (ja) * 2016-10-21 2022-03-01 株式会社Adeka エッチング液組成物及びエッチング方法
KR102554816B1 (ko) 2018-04-23 2023-07-12 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 금속 패턴의 제조 방법
KR20210035090A (ko) * 2018-08-13 2021-03-31 가부시키가이샤 아데카 조성물 및 에칭 방법
US11268025B2 (en) * 2019-06-13 2022-03-08 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
WO2020261995A1 (ja) * 2019-06-28 2020-12-30 株式会社Adeka 組成物及びエッチング方法
JP7274221B2 (ja) * 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
CN114807944A (zh) * 2021-01-28 2022-07-29 江苏悦锌达新材料有限公司 一种环保型退镀剂及其制备方法和使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3930885B2 (ja) * 2000-12-27 2007-06-13 荏原ユージライト株式会社 銅および銅合金用のマイクロエッチング剤
JP3962239B2 (ja) * 2001-10-30 2007-08-22 株式会社Ａｄｅｋａ エッチング剤組成物及びパターン形成方法
JP4916455B2 (ja) * 2008-01-15 2012-04-11 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101775858B1 (ko) 2013-12-06 2017-09-06 멕크 가부시키가이샤 에칭액, 보급액 및 구리 배선 형성 방법

Also Published As

Publication number Publication date
KR101878496B1 (ko) 2018-07-13
TW201231725A (en) 2012-08-01
TWI541384B (zh) 2016-07-11
JP2012140651A (ja) 2012-07-26
KR20120075395A (ko) 2012-07-06

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