JP5534549B2 - Transfer apparatus, transfer method, and device manufacturing method - Google Patents

Description

  The present invention relates to a transfer apparatus, a transfer method, and a device manufacturing method for transferring a pattern provided on a pattern member to a plurality of partition regions provided on a belt-like substrate.

  A glass substrate or a resin substrate used for a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP), or an organic EXL tends to increase in size in response to a demand for an increase in screen size. An exposure apparatus that irradiates a glass substrate or a resin substrate with a circuit pattern of a pattern member is increased in size in accordance with the increase in size of the glass substrate or the resin substrate.

  Among exposure apparatuses, there is an apparatus that conveys and irradiates a band-shaped substrate wound in a roll shape in order to cope with mass production and enlargement of an FPD or the like. For example, in the projection exposure apparatus disclosed in Patent Document 1, the belt-shaped substrate is intermittently transported by alternately performing vacuuming and releasing the vacuum and moving the stage device in the transport direction. According to the projection exposure apparatus of Patent Document 1, the belt-shaped substrate is transported without fear of occurrence of positional deviation, stretching, waves, wrinkles, etc. of the belt-shaped substrate, and the pattern of the pattern member is irradiated onto the belt-shaped substrate. Is done.

JP 2007-114385 A

  However, since a belt-like substrate wound in a roll shape is generally thin and soft, it is easily stretched and deformed by a tensile force or heat treatment applied to the substrate. Further, when a plurality of processes are performed on the substrate, the deformation is complicated. For this reason, the partition area (pattern formation area) provided on the substrate is also complicatedly deformed, and there is a problem in that a new pattern cannot be accurately superimposed on a pattern previously formed in the partition area. It was.

  An aspect of the present invention is to provide a transfer apparatus, a transfer method, and a device manufacturing method that can accurately transfer a pattern to a partition region provided on a belt-like substrate regardless of the presence or absence of deformation. And

According to the first aspect of the present embodiment, the transfer for sequentially transferring the pattern of the electric device to each of the plurality of exposure regions arranged at predetermined intervals along the longitudinal direction of the flexible belt-like substrate. An apparatus is provided. The transfer device holds the transfer device for transferring the substrate in the longitudinal direction, a part including the exposure area of the substrate, and a short direction intersecting the longitudinal direction along the surface of the substrate; A stage apparatus movable in the longitudinal direction, and an image of a pattern corresponding to the electrical device is projected on each of the plurality of different areas in the longitudinal direction of one exposure area on the substrate. A pattern generation device comprising: a plurality of projection optical systems arranged in a plurality of projection optical systems; and a correction device for individually correcting at least one of the projection position or image rotation of the image of the pattern by each of the projection optical systems; , An alignment sensor for detecting positions of a plurality of marks formed in the periphery in the longitudinal direction and the periphery in the short direction of the exposure area of the substrate, and positions of the detected marks Based on the information related to the deformation, the calculation device calculates the information related to the deformation of the exposure area, and moves the stage device holding the substrate in the short direction at a predetermined speed. And a control device that scans and exposes the exposure area in the lateral direction while correcting and correcting the image of the pattern projected from the pattern generation device.

According to the second aspect of the present embodiment, the pattern of the electric device is sequentially transferred to each of a plurality of exposure regions arranged at predetermined intervals along the longitudinal direction on the flexible belt-like substrate. A transfer method is provided. The transfer method includes a step of holding a part including the exposure area of the substrate on a flat stage device movable in a short direction intersecting the longitudinal direction of the substrate and the longitudinal direction; An alignment sensor detects each position of a plurality of marks formed in the periphery in the longitudinal direction and the periphery in the short direction of the exposure area above, and based on each detected position, the position of the exposure area Each of the plurality of regions having different longitudinal directions of one exposure region on the substrate is obtained by a step of obtaining information relating to deformation and a pattern generating apparatus having a plurality of projection optical systems arranged in the longitudinal direction of the substrate. A step of projecting a pattern image corresponding to the electrical device, and a projection position or image rotation of the pattern image projected for each of the plurality of projection optical systems, based on the information on the deformation. And a step of scanning and exposing the exposure area on the substrate in the short direction by moving the stage device at a predetermined speed in the short direction while controlling a correction device for correction. To do.

  According to the third aspect of the present embodiment, a manufacturing method for forming a device pattern in each of a plurality of exposure regions arranged at predetermined intervals along the longitudinal direction on a flexible belt-like substrate Is provided. The manufacturing method includes a step of holding a part including the exposure area of the substrate on a stage device movable in a lateral direction intersecting the longitudinal direction of the substrate and the longitudinal direction; The positions of a plurality of marks formed around the longitudinal direction and the lateral direction of the exposure area are detected by an alignment sensor, and the exposure area is deformed based on the detected positions. The exposure area is obtained by a pattern generating apparatus comprising a step of obtaining information, and a projection area having a range over the exposure area in the longitudinal direction and a partial area of the exposure area in the lateral direction. A step of projecting a partial image of the pattern corresponding to the device, and a correction for correcting the position or rotation of the partial image of the pattern that is provided in the pattern generation device and projected into the projection area. Scanning the exposure area on the substrate in the lateral direction by moving the stage device at a predetermined speed in the lateral direction while controlling the apparatus based on the information related to the deformation; and It is characterized by including.

  According to the aspect of the present invention, a pattern can be accurately transferred to a partitioned region provided on a belt-like substrate regardless of the presence or absence of deformation.

(A) is a schematic top view which shows the exposure apparatus EX of this embodiment, and in order to help an understanding, the main part below the strip | belt-shaped board | substrate FB is drawn. (B) is a schematic side view of the exposure apparatus EX. FIG. 3A is a top view of the substrate stage FBS, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. It is BB sectional drawing of Fig.2 (a). It is the conceptual diagram which showed another Example of the substrate stage FBS which supports the strip | belt-shaped board | substrate FB. (A) is a schematic top view which shows the substrate stage FBS of this embodiment, and in order to help an understanding, the part below the strip | belt-shaped board | substrate FB is drawn. (B) is a schematic side view of the exposure apparatus EX. It is the figure which showed alignment sensor LSA. It is the figure which showed alignment mark AM for LSA. It is a schematic perspective view of projection optical system PL. It is a flowchart of the exposure method of the 1st example. It is the conceptual top view which showed the exposure operation | movement of the exposure method of a 1st example. It is the conceptual top view which showed the exposure operation | movement of the exposure method of a 1st example. It is explanatory drawing which adjusts the projection image PI by the projection optical system PL, and correct | amends the shift | offset | difference of exposure area EA. (A) is a plan view in which the exposure area EA is deformed from an ideal shape without deformation as indicated by a dotted line to a deformation shape as indicated by a solid line, and (b) is an X-axis direction of the exposure area EA. FIG. 6C is a plan view in which the deviation and rotation of the exposure area EA in the Y-axis direction are corrected. It is a top view which shows exposure apparatus EX of the 2nd example. It is a conceptual top view which showed the exposure operation | movement of the exposure method of the 2nd example. It is a conceptual top view which showed the exposure operation | movement of the exposure method of the 2nd example. It is a flowchart which shows an electric device manufacturing method.

In the embodiment of the present invention, a transfer apparatus will be described by taking an exposure apparatus as an example.
<Entire Configuration of Exposure Apparatus: First Example>
The exposure apparatus EX of the first example will be described below with reference to FIG. FIG. 1A is a schematic plan view showing the exposure apparatus EX of the present embodiment, and the main part below the strip-shaped substrate FB is drawn to help understanding. FIG. 1B is a schematic side view of the exposure apparatus EX.

  The exposure apparatus EX according to the present embodiment is a scanning exposure apparatus that performs exposure by synchronously scanning the mask M and the strip-shaped substrate FB with respect to the exposure light EXL. The exposure apparatus EX scans and exposes the exposure area EA of the strip-shaped substrate FB. In FIG. 1, the exposed exposure area EA is shown by a mesh, and the unexposed exposure area EA is shown in white. The optical axis direction of the projection optical system PL is the Z-axis direction, the direction perpendicular to the Z-axis direction is the synchronous movement direction of the mask M and the strip-shaped substrate FB is the Y-axis direction (scanning direction), the Z-axis direction, and the Y-axis direction. The direction orthogonal to the X axis direction (non-scanning direction).

The exposure apparatus EX includes a supply roller FR that supplies a strip-shaped substrate FB and a take-up roller WR that winds the strip-shaped substrate FB as a transfer device. The supply roller FR and the take-up roller WR can rotate in the arrow direction, and can transport the belt-like substrate FB in the X-axis direction. Here, the belt-like substrate FB is a thin resin film that can be wound into a roll. The band-shaped substrate FB is a substrate that is sufficiently thin with respect to its area and has flexibility. The strip-shaped substrate FB has a length of, for example, 100 meters in the X-axis direction, a width of 1 meter in the Y-axis direction, and a thickness of 100 micrometers. Photoresist is applied to one side of the belt-like substrate FB on the mask M side. Specifically, the band-shaped substrate FB is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin. Can be used. The mask M uses a light-transmitting base material having a small linear expansion coefficient and a small change due to humidity, specifically glass or quartz, and a fine mask pattern is formed on the light-transmitting base material with a light shielding material. Has been.

In this embodiment, the mask M is used as the pattern generation device, but a reflective or transmissive spatial light modulator or the like is also used. As the reflective spatial light modulator, an element capable of selectively adjusting the light transmitting area, for example, an element having a liquid crystal material or an electrochromic material, or an element capable of selectively adjusting light reflection, such as a digital micromirror. There is a device (DMD). DMD is a kind of spatial light modulator, and is a device in which a plurality of small mirrors called micromirrors that rotate around a fixed axis by an electrostatic field effect or the like are arranged in a matrix on a semiconductor substrate such as Si. As the transmissive spatial light modulator, a PLZT element that is an optical element that modulates transmitted light by an optical effect can be used. The PLZT element is an oxide ceramic containing lead, lanthanum, zircon, and titanium, and is a device called PLZT from the initials of each element symbol. The PLZT element transmits light with a transparent ceramic, but the direction of deflection can be changed when a voltage is applied, and a light control device is configured by combining with a polarizer. It should be noted that a correction device is provided for both the reflective spatial light modulator and the transmissive spatial light modulator to correct pattern deformation.

The exposure apparatus EX includes a mask stage MST that supports a mask M on which a pattern is formed, and a substrate stage FBS that supports a strip-shaped substrate FB. The mask M is a member in which a circuit pattern or the like is drawn on quartz glass. The exposure apparatus EX includes a plurality of laser interferometers LM that detect positions in the X-axis direction and the Y-axis direction of the mask stage MST that supports the mask M, and the X-axis direction and Y of the substrate stage FBS that supports the strip-shaped substrate FB. And a plurality of laser interferometers MM that detect positions in the axial direction. Mask stage MST can move a long stroke in the direction of arrow AR1 (the Y-axis direction), which is the scanning direction, and can move a short stroke in the X-axis direction by a linear motor (not shown). Similarly, the substrate stage FBS can move a long stroke in the AR1 direction that is the scanning direction, and can also move in a long stroke direction in the direction of the arrow AR2 that is the non-scanning direction. Further, the substrate stage FBS constitutes a transport device for the substrate FB together with the supply roller FR and the take-up roller WR. The exposure apparatus EX according to this embodiment performs scanning exposure by synchronously moving the mask M and the strip-shaped substrate FB with respect to the exposure light EXL in the direction of the arrow AR1 illustrated in FIG. Device. In FIG. 1B, only one laser interferometer LMx and one laser interferometer MMx for detecting the position in the X-axis direction are drawn.

  Further, the exposure apparatus EX has a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EXL by an illumination optical system (not shown) onto a strip-shaped substrate FB supported by the substrate stage FBS. Yes. As shown in FIG. 1A, the projection image PI of the pattern of the mask M is shown in a trapezoidal shape, the exposure apparatus EX is arranged in two rows in the Y-axis direction and five projections arranged alternately in the X-axis direction. It has an optical system PL. The mask M supported by the mask stage MST and the belt-like substrate FB supported by the substrate stage FBS are arranged in a conjugate positional relationship via the projection optical system PL.

  The exposure apparatus EX has four alignment sensors LSA (LSA1, LSA2, LSA3, LSA4) that detect alignment marks AM provided on the strip-shaped substrate FB adjacent to the projection optical system PL. In the following description, a number such as “LSA1” is added to the end when specifying each alignment sensor LSA, and when the alignment sensors LSA1 to LSA4 are not distinguished, they are called alignment sensors LSA. The alignment sensor LSA is connected to a calculation unit FP that calculates information related to the deformation of the exposure area EA based on the detection result.

  As shown in FIG. 1A, the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 are arranged side by side in the Y-axis direction. The alignment sensor LSA2 and the alignment sensor LSA3 are arranged side by side in the X-axis direction.

  The alignment sensor LSA is an LSA (Laser Step Alignment) type sensor that irradiates a laser beam onto an alignment mark AM formed in a dot array and detects the mark position using light diffracted or scattered by the alignment mark AM. is there. A plurality of alignment marks AM are already formed around the exposure area EA, which is the irradiation area of the exposure light EXL, on the belt-like substrate FB. In the present embodiment, a total of 36 alignment marks AM are formed for each periphery of one exposure area EA.

  The four alignment sensors LSA in the present embodiment are of an off-axis type, and a baseline amount that is a relative position between the mask M and the alignment sensor LSA is measured when performing alignment processing. In FIG. 1B, only two alignment sensors LSA are drawn.

  The substrate stage FBS is provided with a first reference member 18 having a Y-axis LSA mark 14, a substrate LSA mark 16, and a substrate-side AIS mark 17. The substrate stage FBS is provided with a second reference member 19 having an X-axis LSA mark 15. In this embodiment, the Y-axis LSA mark 14 and the X-axis LSA mark 15 are divided as reference members in the present embodiment, but they may be formed as a single reference member, or the shape of the reference member may be determined depending on the shape of the pattern. Can be changed. As shown in FIG. 1B, the mask M is provided with a mask side AIS mark 11 for baseline measurement, and the mask side AIS mark 11 is a specific position (for example, a center position) of the mask M. Are provided in a predetermined positional relationship. The mask side AIS mark 11 and the substrate side AIS mark 17 correspond to each other, and, for example, six mask side AIS marks 11 and substrate side AIS marks 17 are provided side by side in the X-axis direction. In the vicinity of the six substrate-side AIS marks 17, six substrate LSA marks 16 extending in the Y-axis direction are arranged.

<Configuration of substrate stage>
FIG. 2A is a top view of the substrate stage FBS, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG. 3 is a cross-sectional view taken along the line BB in FIG. In FIG. 2A, the visual field areas of the alignment sensors LSA1 to LSA4 with respect to the first reference member 18 and the second reference member 19 are drawn by dotted lines.

  The first reference member 18 and the second reference member 19 provided on the substrate stage FBS are made of a transparent member having a small thermal expansion coefficient and transmitting light, and the Y-axis LSA mark 14 and the X-axis LSA. The mark 15, the substrate LSA mark 16, and the substrate-side AIS mark 17 are formed of a metal such as chromium on the surface of the transparent member. In the drawings such as FIG. 2, these marks are exaggerated.

  The first reference member 18 has a Y-axis LSA mark 14 extending in the X-axis direction. The alignment sensor LSA2 and the alignment sensor LSA3 can simultaneously detect the Y-axis LSA mark 14. With this Y-axis LSA mark 14, the positions of the alignment sensor LSA2 and the alignment sensor LSA3 in the Y-axis direction can be grasped.

  The second reference member 19 has an X-axis LSA mark 15 extending in the Y-axis direction. The alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 can simultaneously detect the X-axis LSA mark 15. With the X-axis LSA mark 15, the positions of the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 in the Y-axis direction can be grasped.

  The substrate side AIS mark 17 formed on the first reference member 18 is, for example, a cross-shaped mark, but is not limited thereto, and may be a box mark “□”, for example. Under the substrate side AIS mark 17, that is, inside the substrate stage FBS, as shown in FIG. 2B, a lens system 23 for condensing the light that has passed through the first reference member 18, and a lens system An AIS image pickup device 24 that receives the passing light through 23 is embedded. The AIS image sensor 24 is a two-dimensional image element such as a MOS or a CCD.

  The substrate LSA mark 16 and the substrate-side AIS mark 17 are accurately formed, and they are formed at a distance PX in the X-axis direction. The Y-axis LSA mark 14 and the substrate-side AIS mark 17 are accurately formed, and they are formed at a distance PY apart in the Y-axis direction. In FIG. 2A, the substrate LSA mark 16 and the substrate side AIS mark 17 are arranged on the minus Y axis side from the Y axis LSA mark 14, but conversely, the substrate LSA mark 16 and the substrate side AIS mark. 17 may be arranged on the plus Y-axis side from the Y-axis LSA mark 14.

  As shown in FIG. 3, the surface of the first reference member 18 having the Y-axis LSA mark 14 and the substrate-side AIS mark 17 has a height equivalent to the surface height of the strip-shaped substrate FB indicated by the dotted line (Z-axis). Direction). Although not shown, the surface height of the second reference member 19 is also equal to the surface height of the band-shaped substrate FB.

  Now, as shown in FIGS. 2A and 3, a vacuum pipe 21 that vacuum-sucks the belt-like substrate FB is disposed on the surface of the substrate stage FBS. This vacuum pipe 21 is connected to a vacuum pump (not shown). The substrate stage FBS holds the strip-shaped substrate FB via the vacuum pipe 21. A substrate stage moving unit 28 is provided below the substrate stage FBS for moving in the θZ direction (rotation direction) centered in the X-axis direction, the Y-axis direction, and the Z-axis direction. The substrate stage moving unit 28 can move the substrate stage FBS by about 1 m in the Y-axis direction and the X-axis direction. The substrate stage moving unit 28 is controlled by a control device (not shown).

  A three-point or four-point height adjustment unit 26 is placed on the substrate stage moving unit 28. The height adjusting unit 26 has a stroke of about 10 mm in the Z-axis direction. For example, after the exposure apparatus EX scans and exposes the exposure area EA, the strip-shaped substrate FB and the substrate stage FBS are moved to several mm until only the strip-shaped substrate FB is transferred and the next exposure area EA moves onto the substrate stage FBS. It is preferable to leave a gap. Therefore, the height adjusting unit 26 has a stroke for forming a gap between the belt-like substrate FB and the substrate stage FBS. Further, the height adjustment unit 26 aligns the substrate stage FBS in the optical axis direction (Z-axis direction) in order to match the image plane of the projection optical system PL and the surface of the strip-shaped substrate FB adsorbed to the substrate stage FBS. Move. Also, by moving one or two of the three or four height adjustment units 26, the θX direction (rotation direction) centered on the X axis direction and the θY direction centered on the Y axis direction It is also possible to move the substrate stage FBS in the (rotating direction).

  FIG. 4 is a conceptual diagram showing another embodiment of the substrate stage FBS that supports the belt-like substrate FB. FIG. 4A is a schematic plan view showing the substrate stage FBS of the present embodiment, and a portion below the belt-like substrate FB is drawn to help understanding. FIG. 4B is a schematic side view of the exposure apparatus EX.

  2 and 3, the substrate stage FBS is provided with the vacuum pipe 21, but the vacuum pipe 21 is not necessarily provided. For example, as shown in FIG. 4, a pair of crimp fixing portions 30 may be provided so as to sandwich the exposure area EA in the X-axis direction. The crimping fixing portion 30 includes two pairs of piston portions 33 and a pair of crimping plates 35. The two pairs of piston portions 33 are disposed in the vicinity of the four corners of the substrate stage FBS, and the pressure plate 35 extending in the Y-axis direction is disposed on the pair of piston portions 33. However, as illustrated in FIG. 4B, the one pressure plate 35 on the left side in the drawing is arranged on the exposure area EA side with respect to the second reference member 19 so that the exposure area EA is flat. Is preferred.

  When the two pairs of piston portions 33 are lowered in the Z-axis direction from the state depicted in FIG. 4B, the pair of pressure-bonding plates 35 pressure-bond the strip-shaped substrate FB to the surface of the substrate stage FBS. As will be described later, since the substrate stage FBS moves in the Y-axis direction, excessive tension may be applied to the belt-like substrate FB. Even in these cases, since the belt-like substrate FB is pressed against the substrate stage FBS by the pressure plate 35 in the Z-axis direction, the position of the belt-like substrate FB does not shift.

  In addition to the vacuum pipe 21 provided on the substrate stage FBS, a crimp fixing part 30 may be provided. With such a configuration, the positional deviation between the belt-like substrate FB and the substrate stage FBS is further reduced.

  FIG. 5 is a diagram showing the alignment sensor LSA. The alignment sensor LSA includes a laser light source 41. As the laser light source 41, for example, a He—Ne laser light source can be used. The beam (linearly polarized light) emitted from the laser light source 41 forms a linear beam via the cylindrical lens 43 after passing through an optical isolator 42 for preventing return light from the subsequent optical system. Undergoes shaping and focusing. The beam that passes through the cylindrical lens 43 enters the beam splitter 44 and is divided into an LSA beam for X-axis direction measurement and an LSA beam for Y-axis direction measurement. That is, the X-axis direction measurement LSA beam transmitted through the beam splitter 44 is limited to a predetermined beam shape by the field stop 45a arranged at a position conjugate with the surface of the belt-like substrate FB, and then enters the mirror 46a. . Further, the LSA beam for measurement in the Y-axis direction reflected by the beam splitter 44 is limited to a predetermined beam shape by a field stop 45b disposed at a position conjugate with the band-shaped substrate FB surface, and then enters the mirror 46b. To do.

The LSA beam for X-axis direction measurement enters the polarization beam splitter 47a. Each beam transmitted through the polarization beam splitter 47a is reflected by the reflecting mirror 49a and enters the field synthesis mirror 51 through the Fourier transform lens 50a. On the other hand, the LSA beam for measurement in the Y-axis direction reflected by the mirror 46b enters the polarization beam splitter 47b. Each beam that has passed through the polarization beam splitter 47b is reflected by the reflecting mirror 49b and reaches the visual field synthesis mirror 51 via the Fourier transform lens 50b.

  An LSA beam for X-axis direction measurement and an LSA beam for Y-axis direction measurement are subjected to field synthesis via the field synthesis mirror 51. Each beam synthesized by the field synthesis mirror 51 becomes circularly polarized light via the quarter-wave plate 52 and then reaches the band-shaped substrate FB via the objective lens 53. An LSA beam AB is formed on the band-shaped substrate FB. LSA alignment marks AM formed on the strip-shaped substrate FB are indicated by dotted lines. The X-axis direction measurement LSA beam AB condensed by the objective lens 53 forms a X-axis direction measurement linear beam AB-X extending along the Y direction on the belt-like substrate FB. Further, the LSA beam AB for measurement in the Y-axis direction collected by the objective lens 53 forms a linear beam AB-Y for measurement in the Y-axis direction extending along the X direction on the belt-like substrate FB.

FIG. 6 is a view showing an alignment mark AM for LSA. As shown in FIG. 6A, an X-axis direction measurement alignment mark AM and a linear beam AB-Y corresponding to the linear beam AB-X are disposed around the exposure area EA of the strip-shaped substrate FB. Corresponding alignment marks AM for measurement in the Y-axis direction are each formed as a lattice pattern. FIG. 6B shows a cross section of the alignment mark AM. The alignment mark AM is composed of, for example, a square-shaped convex portion Ta having a side of 4 μm. A plurality of the convex portions Ta are provided side by side with a pitch of 8 μm. When the alignment mark AM crosses the linear beam AB, diffracted or scattered light is generated. FIG. 6C is an enlarged plan view of a portion surrounded by a dotted line C in FIG. As shown in FIG. 6C, the diffracted light or scattered light generated when the alignment mark AM passes the linear beam AB is maximized, so that the measurement by the laser interferometer MM (see FIG. 1) at that position is performed. The coordinates of the alignment mark AM can be detected from the value.

  Returning again to FIG. 5, the diffracted light or scattered light from each alignment mark AM reaches the visual field synthesis mirror 51 via the objective lens 53 and the quarter-wave plate 52. The diffracted light from the alignment mark AM for X-axis direction measurement is reflected by the reflection surface of the field synthesis mirror 51 and enters the polarization beam splitter 47a via the Fourier transform lens 50a. The diffracted light or scattered light reflected by the polarization beam splitter 47a reaches the photodetector 48a. Then, the photodetector 48a selectively receives diffracted light or scattered light from the alignment mark AM. On the other hand, the diffracted light from the alignment mark AM for Y-axis direction measurement passes through the field synthesis mirror 51 and enters the polarization beam splitter 47b through the Fourier transform lens 50b. The diffracted light or scattered light reflected by the polarization beam splitter 47b reaches the photodetector 48b. Then, the photodetector 48b selectively receives diffracted light or scattered light from the alignment mark AM. Thereafter, the calculation unit FP can calculate information related to the deformation of the exposure area EA based on the detection result.

  As shown in FIG. 1, the movement amounts of the substrate stage FBS in the X-axis direction and the Y-axis direction are constantly measured by the laser interferometer MM. Therefore, the position of the alignment mark AM in the X-axis direction and the Y-axis direction can be detected based on the change in the amount of received light in the photodetector 48 and the output of the laser interferometer MM.

FIG. 7 is a schematic perspective view of the projection optical system PL. As shown in FIG. 7, the projection optical system PL projects the pattern of the mask M onto the substrate FB via the right-angle prism mirrors 63 and 69, the lenses 66 and 70, and the concave mirrors 67 and 71. The right-angle prism mirror 63 is fixed to the prism base 61 via a pair of piezo elements 62a and 62b. Here, the piezo elements 62a and 62b have a stroke of several μm. A zoom optical system 64 used for magnification adjustment is provided between the right-angle prism mirror 63 and the lens 66, and an actuator 65 is provided above the zoom optical system 64. The actuator 65 can control the projection magnification by controlling the distance between the lenses of the zoom optical system 64. Further, a field stop 68 is provided between the right-angle prism mirror 63 and the right-angle prism mirror 69 so that the shape of the projection image PI becomes a trapezoidal shape.

Two parallel plate glasses SF-X and SF-Y are provided above the right-angle prism mirror 63 as shifters. The parallel flat glasses SF-X and SF-Y move the projection image PI in the X-axis or Y-axis direction. The shifter unit is a belt-like substrate FB by rotating the parallel flat glass SF-X for X direction shift and the parallel flat glass SF-Y for Y direction shift around the X axis or the Y axis by a driving device such as a motor. Is shifted in the X direction or the Y direction. Thereby, the deviation of the X axis or the Y axis can be corrected. For example, when the incident light is adjusted by the parallel flat glass SF-X and SF-Y as shown in FIG. 7, the projected image PI moves along the X-axis direction as indicated by an arrow AR3, and PI-X Or move along the Y-axis direction as indicated by an arrow AR4 to reach the PI-Y position.

Further, the right angle prism mirror 63 fixed to the prism base 61 via the piezo elements 62a and 62b rotates around an axis parallel to the Z axis, thereby performing rotation correction. Specifically, by driving either one of the piezo elements 62a and 62b, or by driving both the piezo elements 62a and 62b in the opposite direction, the right-angle prism mirror 63 rotates in the arrow D or in the opposite direction. Therefore, the projected image PI of the pattern of the mask M can be rotated in the rotation direction of the arrow AR5 or in the opposite direction. For example, when the right-angle prism mirror 63 rotates in the direction of arrow D, the projected image PI of the pattern of the mask M rotates to the position PI-R. Thereby, rotation correction is performed. In FIG. 7, the pair of piezo elements 62a and 62b are arranged at two locations, but the right-angle prism mirror 31 may be supported using three or four piezo elements.

<Alignment and exposure method: first example>
FIG. 8 is a flowchart of the exposure method of the first example using the exposure apparatus EX of the first example. 9 and 10 are conceptual plan views showing the exposure operation of the exposure apparatus EX.

  Steps S111 to S114 are baseline measurement steps of the alignment sensor LSA1 to the alignment sensor LSA4. In the baseline measurement, the measurement is performed before the belt-like substrate FB is sent to the substrate stage FBS.

  In step S111, the reference position in the X-axis direction of the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 is measured by the X-axis LSA mark 15. First, the X-axis LSA mark 15 on the substrate stage FBS is detected simultaneously by the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4. As the substrate stage FBS moves in the X-axis direction, the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 detect the X-axis LSA mark 15. As described in FIG. 6, the position of the substrate stage FBS is measured by the laser interferometer MM. For this reason, the relative positions of the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 in the X-axis direction can be grasped based on the position of the X-axis LSA mark 15.

  The alignment sensor LSA4 detects the substrate LSA mark 16 on the first reference member 18 of the substrate stage FBS. Here, as shown in FIG. 2, since the positions of the substrate LSA mark 16 and the substrate side AIS mark 17 are fixed, the alignment sensor LSA4 has a relationship between the X-axis LSA mark 15 and the substrate side AIS mark 17. The relative positional relationship can be measured. Therefore, since the relative positions of the alignment sensor LSA1, the alignment sensor LSA2, and the alignment sensor LSA4 in the X-axis direction are grasped on the basis of the position of the X-axis LSA mark 15, the alignment sensor LSA1 and the alignment sensor LSA2 are also arranged on the substrate side. The relative positional relationship with the AIS mark 17 can be measured.

  In step S112, the Y-axis LSA mark 14 detects the positions of the alignment sensors LSA2 and LSA3 in the Y-axis direction. With reference to the position of the Y-axis LSA mark 14, the relative positions of the alignment sensor LSA2 and the alignment sensor LSA3 in the Y-axis direction can be grasped. Here, since the positions of the Y-axis LSA mark 14 and the substrate side AIS mark 17 are fixed, the relative positional relationship between the alignment sensor LSA2 and the alignment sensor LSA3 and the substrate side AIS mark 17 can be measured. Therefore, the relative positional relationship between the substrate-side AIS mark 17, the alignment sensor LSA2, and the alignment sensor LSA3 can also be measured.

In step S113, the mask side AIS mark 11 shown in FIG. 1B and the mask side AIS mark 17 and the substrate side AIS mark 17 via the projection optical system PL as shown in FIG. 2B. Relative positional relationship is measured. The images of the mask side AIS mark 11 and the substrate side AIS mark 17 are detected by the AIS image sensor 24. Thereby, the image position of the mask side AIS mark 11 can be measured based on the position of the substrate side AIS mark 17.

  In step S114, the relative positional relationship between the measurement reference positions of the alignment sensors LSA1 to LSA4 and the mask M projection image PI in the X-axis direction and the Y-axis direction is measured based on the results of the above-described steps S111, S112, and S113. . That is, the baseline from the alignment sensors LSA1 to LSA4 can be measured.

  In step S115, the strip-shaped substrate FB is transferred in the −X direction by the supply roller FR and the take-up roller WR while the strip-shaped substrate FB and the substrate stage FBS are separated from each other in the Z-axis direction (FIG. 9A )). The strip-shaped substrate FB is rough-aligned with the strip-shaped substrate FB by a rough alignment apparatus (not shown) so that the exposure area EA is aligned with the substrate stage FBS. Next, the substrate stage FBS is raised by the height adjusting unit 26 (see FIG. 3), the belt-like substrate FB and the substrate stage FBS come into contact with each other, and the substrate FB is vacuum-sucked to the substrate stage FBS by the vacuum pipe 21.

  In step S116, the substrate stage FBS moves as shown in FIGS. 9A to 9B. That is, the alignment sensor LSA1 and the alignment sensor LSA2 detect the alignment mark AM provided along the X-axis direction around the exposure area EA of the belt-like substrate FB while the belt-like substrate FB is moved along the X-axis direction. . At the same time, the X coordinate of the alignment mark AM is obtained by the laser interferometer MMx (see FIG. 1).

In step S117, the substrate stage FBS moves in the Y direction as shown in FIGS. 9B to 9C. That is, the alignment mark AM provided along the Y-axis direction around the exposure area EA of the belt-like substrate FB is detected by the alignment sensor LSA2 and the alignment sensor LSA3 while moving the belt-like substrate FB along the Y-axis direction. The At the same time, the Y coordinate of the alignment mark AM is obtained by the laser interferometer MMy. When the substrate stage FBS moves, the belt-like substrate FB is sent out in the −X direction and the + X direction from the supply roller FR and the take-up roller WR, respectively. In this way, an extra tensile force is not applied to the area indicated by the dotted line F on the belt-like substrate FB.

  In step S118, when the substrate stage FBS moves to the position shown in FIG. 9C, the substrate stage FBS is exactly at the exposure start position. At this time, the baseline measurement result obtained in step S114 is corrected with respect to the measurement coordinates of the alignment mark AM. On the other hand, based on the results of step S114, step S116, and step S117, the stretched state of the strip-shaped substrate FB, the positional deviation in the X-axis or Y-axis direction, or the rotation of the strip-shaped substrate FB (rotation around the Z-axis) ) State is required.

In step S119, the pattern of the mask M is projected by the projection optical system PL based on the expansion / contraction state of the band-shaped substrate FB obtained in step S118 described above, the positional deviation in the X-axis or Y-axis direction, or the rotation of the band-shaped substrate FB. The position of the projected image PI is adjusted. As described above, the X and Y coordinates of the alignment mark AM obtained in steps S116 and S117 are compared with the standard coordinates (the coordinates of the alignment mark AM when the exposure area EA has an ideal shape without deformation). View. As a result, the amount of expansion / contraction from the standard position of the exposure area EA of the belt-like substrate FB is obtained. And the projection image PI of the mask M is adjusted by operating the parallel flat glass SF-X and SF-Y and the piezo elements 62a and 62b. For example, when the projected image PI is displaced in the X-axis direction, the parallel flat glass SF-X is corrected by being tilted. When the projected image PI is displaced in the Y-axis direction, the parallel flat glass SF-Y is corrected. When tilt correction is performed and rotation correction of the projected image PI is necessary, the correction is performed by expanding and contracting the piezo elements 62a and 62b. This will be described in detail with reference to FIG.

  FIG. 11 is an explanatory diagram for correcting the deviation of the exposure area EA by adjusting the projection image PI by the projection optical system PL. (A) is a plan view in which the exposure area EA is deformed from an ideal shape without deformation as shown by a dotted line to a deformed shape as shown by a solid line, and (b) is a parallel flat glass SF-X. FIG. 6C is a plan view in which the deviation in the X-axis direction of the exposure area EA is corrected by (c), the deviation in the Y-axis direction of the exposure area EA is corrected by the parallel flat glass SF-Y, and the exposure area EA is corrected by the piezoelectric elements 62a and 62b. It is the top view which correct | amended rotation.

  In FIG. 11A, the exposure area EA is in a state of being deformed from an ideal shape without deformation as indicated by the dotted line. The deformed shape can be studied based on the X coordinate and Y coordinate of the alignment mark AM obtained in step S114, step S116, and step S117. In FIG. 11A, the exposure area EA extends in the + X direction. Further, the short side in the + X direction is extended in the Y direction. Conversely, the short side in the -X direction is shortened. For this reason, the entire length of the projection image PI of the arranged projection optical system PL is shorter than the long side of the exposure area EA according to the shape of the ideal exposure area EA that is not deformed.

  Therefore, first, as shown in FIG. 11B, the projection image PI is projected by the zoom optical system 64 and the actuator 65 of each projection optical system PL so that the entire length of the projection image PI is longer than the long side of the exposure area EA. Increase the image PI. Furthermore, each projection image PI is moved along the X + direction by rotating the parallel flat glass SF-X.

  Then, as shown in FIG. 11C, the projected images PI1 and PI4 are rotated by expanding and contracting the piezo elements 62a and 62b, and Y + by rotating the parallel flat glass SF-Y of the projection optical system PL. Move along the direction. The projected image PI2 rotates by expanding and contracting the piezo elements 62a and 62b. Furthermore, the projected images PI3 and PI5 are rotated by expanding and contracting the piezo elements 62a and 62b, and are moved along the Y-direction by rotating the parallel flat glass SF-Y of the projection optical system PL. Thereby, the position of the projection image PI is adjusted according to the shape of the exposed exposure area EA.

  Returning to FIG. 8 again, in step S120, scanning exposure is performed while the substrate stage FBS moves from FIG. 9C to FIG. 10D. That is, the substrate stage FBS is scanned along the exposure area EA while moving along the −Y direction.

  In step S121, after the exposure is finished, the vacuum suction between the substrate FB and the substrate stage FBS is finished, and the substrate stage FBS is lowered by the height adjusting unit 26. Therefore, the substrate FB and the substrate stage FBS are separated. Then, the substrate stage FBS proceeds to the exposure area EA of the unexposed area shown in FIG. The state of the substrate stage FBS shown in FIG. 10 (e) returns to the same position as the position of the substrate stage FBS described in step S111, that is, FIG. 9 (a).

<Entire Configuration of Exposure Apparatus: Second Example>
FIG. 12 is a plan view showing the exposure apparatus EX of the second example.
As shown in FIG. 12, in the exposure apparatus EX of the second example, rails R are respectively provided below the supply roller FR and the take-up roller WR, and the supply roller FR and the take-up roller WR are connected to the substrate stage FBS. Can be freely moved in the Y-axis direction in synchronization with the.

  When the substrate FB is exposed by the exposure apparatus EX of the first example as shown in FIG. 9C, when the substrate stage FBS moves in the Y-axis direction, a tensile force is easily applied to the belt-like substrate FB. In addition, the band-shaped substrate FB is twisted and wrinkles are generated in the area indicated by the dotted line F. Corresponding to this case, in the exposure apparatus EX of the second example, the supply roller FR and the take-up roller WR freely move in the Y-axis direction in synchronization with the substrate stage FBS. In the second example, it is possible to prevent the above-described wrinkle generated in the strip-shaped substrate FB.

  Note that in the exposure apparatus EX of the second example, the configuration other than the rail R is the same as that of the exposure apparatus EX of the first example, and thus the description thereof is omitted here.

<Alignment and exposure method: second example>
13 and 14 are plan views showing an exposure operation for exposing the strip-shaped substrate FB by the exposure apparatus EX of the second example. Here, the difference from the alignment and exposure method of the first example is that when the substrate stage FBS on which the band-shaped substrate FB is placed moves along the Y-axis direction, both the supply roller FR and the take-up roller WR It is a point that moves at the same time.

First, the baseline amount is measured as shown in steps S111 to S114 of the alignment and exposure method of the first example.
In FIG. 13A, the belt-like substrate FB is transferred in the −X direction by the supply roller FR and the take-up roller WR while the belt-like substrate FB and the substrate stage FBS are separated from each other in the Z-axis direction. The strip-shaped substrate FB is rough-aligned with the strip-shaped substrate FB by a rough alignment apparatus (not shown) so that the exposure area EA is aligned with the substrate stage FBS. Then, the substrate stage FBS is raised by the height adjusting unit 26, and the belt-like substrate FB and the substrate stage FBS come into contact with each other. Thereafter, the substrate FB is vacuum-sucked to the substrate stage FBS by the vacuum pipe 21 (see FIG. 3).

  Next, as shown in FIGS. 13A to 13B, the substrate stage FBS moves in the −X axis direction. That is, the alignment sensor LSA1 and the alignment sensor LSA2 detect the alignment mark AM provided along the X-axis direction around the exposure area EA of the belt-like substrate FB while the belt-like substrate FB is moved along the X-axis direction. . At the same time, the X coordinate of the alignment mark AM is obtained by the laser interferometer MMx (see FIG. 1).

Next, as shown in FIG. 14D through FIGS. 13B to 13C, the substrate stage FBS moves in the Y direction. That is, the alignment mark AM provided along the Y-axis direction around the exposure area EA of the belt-like substrate FB is detected by the alignment sensor LSA2 and the alignment sensor LSA3 while moving the belt-like substrate FB along the Y-axis direction. The
When the substrate stage FBS moves, the supply roller FR and the take-up roller WR move in the Y-axis direction in synchronization with the substrate stage FBS. For this reason, the belt-like substrate FB is not subjected to excessive tension or torsion.

Next, as shown in FIGS. 14D to 14E, scanning exposure is performed while the substrate stage FBS moves. That is, the substrate stage FBS is scanned along the exposure area EA while moving along the −Y direction. Further, the supply roller FR and the take-up roller WR move in the Y-axis direction in synchronization with the substrate stage FBS.

  Finally, as shown in FIG. 14F, after the exposure is completed, the vacuum suction between the strip-shaped substrate FB and the substrate stage FBS is completed, and the substrate stage FBS is lowered by the height adjusting unit 26 and the substrate FB. And go back to the first position.

<Device manufacturing method>
FIG. 15 is a flowchart showing an electrical device manufacturing method.
As shown in FIG. 15, the electrical device includes a step S211 for performing function / performance / pattern design of the device, a step S212 for producing a mask M based on step S211 and a strip-shaped substrate coated with a photosensitive agent. Step S213 for producing an FB.
Further, the pattern of the mask M is exposed on the belt-like substrate FB by the exposure method described in the first example or the second example (step S214). Thereafter, the photosensitizer on the belt-like substrate FB is developed (step S215), and a transfer pan layer having an uneven shape corresponding to the pattern of the mask M is formed on the belt-like substrate FB (step S216). The substrate is processed through the transfer pattern layer (step S217), and the devices are combined (step S218). In this way, an electrical device is manufactured.

  The optimum embodiment of the present invention has been described in detail above. However, as will be apparent to those skilled in the art, the present invention can be implemented with various modifications and variations within the technical scope thereof.

The transfer apparatus of the present invention has been described using an exposure apparatus provided with a detection apparatus that detects diffracted light from a plurality of marks. However, the transfer apparatus of the present invention is not limited to an exposure apparatus, but a stamper method (imprint) in which a material is pressed with a mold having irregularities, an ink jet printer that cures while gradually depositing the liquid material by discharging the liquid material, etc. Also applies.

DESCRIPTION OF SYMBOLS 11 Mask side AIS mark 14 Y-axis LSA mark, 15 X-axis LSA mark 16 Board | substrate LSA mark, 17 Board | substrate side AIS mark 18 1st reference member, 19 2nd reference member 21 Vacuum suction hole 23 Lens system 24 AIS image sensor 26 Height adjustment unit 28 Substrate stage moving unit 30 Crimp fixing unit 33 Piston unit 35 Crimping plate 41 Laser light source, 42 Optical isolator 43 Cylindrical lens, 44 Beam splitter 45a, 45b Field stop, 46a, 46b Mirror 47a, 47b Polarizing beam splitter, 48a, 48b Photodetector 49a, 49b Reflector 50a, 50b Fourier transform lens 51 Field synthesis mirror, 52 1/4 wave plate, 53 Objective lens 61 Prism stage, 62a, 62b Piezo element 63 Right angle prism mirror, 64 Zoom Optical system, 65 Actuator 66 Lens, 67 Concave mirror, 68 Field stop, 69 Right angle prism mirror 70 Lens, 71 Concave mirror AB, AB-X, AB-Y Linear beam AM Alignment mark EA Exposure area EX Exposure device EXL Exposure light FB Substrate FBS substrate stage FP calculation unit FR supply roller LM, LMx Laser interferometer LSA, LSA1, LSA2, LSA3, LSA4 Alignment sensor M mask MST mask stage MM, MMx Laser interferometer PI projection image PL projection optical system R rail SF-X, SF-Y Parallel flat glass Ta Convex part WR Take-up roller

Claims (20)

Flexibility to each of the plurality of exposure regions arranged at predetermined intervals along the longitudinal direction of the band-shaped substrate having, a transfer device for sequentially transferring the pattern of electrical devices,
A transfer device for transferring the substrate in the longitudinal direction;
A stage device that holds a part of the substrate including the exposure region and is movable along the surface of the substrate in a lateral direction intersecting the longitudinal direction and in the longitudinal direction ;
A plurality of projection optical systems arranged in the longitudinal direction so that an image of a pattern corresponding to the electrical device is projected on each of the plurality of different regions in the longitudinal direction of one exposure region on the substrate; A pattern generation device comprising: a correction device for individually correcting at least one of a projection position or image rotation of the image of the pattern by each of the projection optical systems;
An alignment sensor for detecting each position of a plurality of marks formed in the periphery in the longitudinal direction and in the periphery in the short direction of the exposure area of the substrate;
Based on each position of the plurality of marks issued 該検, an arithmetic unit for calculating information on deformation of the exposure area,
An image of the pattern projected from the pattern generation device is controlled by controlling the correction device based on the information on the deformation while moving the stage device holding the substrate in the short direction at a predetermined speed. A control device that scans and exposes the exposure area in the lateral direction while correcting,
A transfer apparatus comprising: The pattern generation device is configured to hold a mask on which a pattern corresponding to one exposure region on the substrate is drawn,
The correction device is an optical member provided so as to be finely movable in each optical path of the plurality of projection optical systems;
The transfer device according to claim 1. The pattern generation device includes a reflective or transmissive spatial light modulator for generating a pattern corresponding to one exposure region on the substrate, and the correction device is provided in the spatial light modulator. ,
The transfer device according to claim 1 . The stage device holds a part of the substrate and moves in the longitudinal direction ,
The alignment sensor, when the stage apparatus is moved in the longitudinal direction, the positions of the plurality of said marks along said the longitudinal direction around the exposed regions are formed at predetermined intervals on the substrate The transfer device according to claim 2 , wherein the transfer device is detected. The transfer device includes a roller disposed before and after the stage device in the transfer direction to transfer the substrate in the longitudinal direction,
The transfer device according to claim 4 , wherein the roller is moved in the short direction in synchronization with the movement of the stage device in the short direction during the scanning exposure . The stage device includes a measuring device that measures the moving position in the longitudinal direction and the moving position in the short direction of the stage device, and is measured by the measuring device when the position of the mark is detected by the alignment sensor. The transfer apparatus according to claim 5 , wherein a coordinate position of the detected mark is specified based on a moving position of the mark . In order to detect information related to the relative position between the stage device and the alignment sensor, a first reference pattern that is disposed on one peripheral portion of the short-side direction on the stage device and is detectable by the alignment sensor is The transfer apparatus according to claim 6, further comprising a first reference member provided along the longitudinal direction. It has a second reference member which is arranged in one peripheral part of the longitudinal direction on the stage device and which has a second reference pattern which can be detected by the alignment sensor along the short direction. The transfer device according to claim 7 . The pattern generation apparatus can project a mask side AIS mark provided in a fixed positional relationship with a pattern corresponding to the electric device toward the stage apparatus via the projection optical system,
The stage device is a projection image of the mask-side AIS mark projected through the projection optical system to detect information on the relative position between the image of the pattern projected from the pattern generation device and the stage device. The transfer device according to claim 7, further comprising: a position detection unit that detects the position of the transfer device. Each of the plurality of projection optical systems projects an image of the pattern projected onto the substrate into a trapezoidal projection region extending in the longitudinal direction,
Among the trapezoidal projection areas, the projection areas adjacent in the longitudinal direction are arranged so as to partially overlap,
When the projection image of the mask side AIS mark is detected by the position detection unit, the mask side AIS mark is set to be projected within the partially overlapping area of the trapezoidal projection area, and the stage Moving the apparatus to install the position detector below the projected image of the mask side AIS mark;
The transfer device according to claim 9. The first reference member is composed of a transparent member having a small thermal expansion coefficient and transmitting light,
The position detection unit includes a substrate-side AIS mark formed on the transparent member together with the first reference pattern, and light that has been projected from the projection optical system and passed through the transparent member of the projection image of the mask-side AIS mark. An image sensor for receiving light,
The transfer device according to claim 10. The transfer device according to any one of claims 1 to 11 , wherein the stage device includes a height adjusting unit that moves in a normal direction of the substrate. A method of sequentially transferring a pattern of an electric device to each of a plurality of exposure regions arranged at predetermined intervals along a longitudinal direction on a flexible belt-like substrate,
Holding a part including the exposure area of the substrate on a flat stage device movable in a short direction intersecting the longitudinal direction of the substrate and the longitudinal direction;
Each position of a plurality of marks formed in the periphery in the longitudinal direction and the periphery in the short direction of the exposure area on the substrate is detected by an alignment sensor, and the exposure is performed based on the detected positions. Obtaining information about the deformation of the region;
A pattern corresponding to the electrical device in each of a plurality of different regions in the longitudinal direction of one exposure region on the substrate by a pattern generating apparatus including a plurality of projection optical systems arranged in the longitudinal direction of the substrate. Projecting an image of
While controlling the correction device that corrects the projection position or image rotation of the image of the pattern projected for each of the plurality of projection optical systems based on the information related to the deformation, the stage device is set in a predetermined direction in the short direction. Scanning the exposure area on the substrate in the short direction by moving at a speed; and
A transfer method comprising : Before the step of holding a part of the substrate on the stage apparatus, one exposure region on the substrate is positioned on the holding surface of the stage apparatus by the transfer device that transfers the substrate in the longitudinal direction. Including the step of transferring to
The transfer method according to claim 13. The step of obtaining information on the deformation includes
The stage apparatus holding a part of the substrate so that the alignment sensor sequentially detects the plurality of marks formed at predetermined intervals along the longitudinal direction around the exposure area on the substrate. Including moving in the longitudinal direction;
The transfer method according to claim 14. The step of obtaining information on the deformation includes
The stage apparatus holding a part of the substrate so that the alignment sensor sequentially detects the plurality of marks formed at predetermined intervals along the short direction around the exposure area on the substrate. And moving the transfer device in the short direction in synchronization with the movement of the stage device.
The transfer method according to any one of claims 14 and 15, wherein: The pattern generation device is configured to hold a mask on which a pattern corresponding to one exposure region on the substrate is drawn,
The correction device is constituted by an optical member provided in a light-movable manner in each optical path of the plurality of projection optical systems;
The transfer method according to any one of claims 13 to 16 . The pattern generation device includes a reflective or transmissive spatial light modulator for generating a projection image corresponding to the pattern of the electrical device, and the correction device is provided in the spatial light modulator;
The transfer method according to any one of claims 13 to 16 . A device manufacturing method using the transfer apparatus according to any one of claims 1 to 12,
A step of transferring a flexible strip-shaped resin substrate in the longitudinal direction of the substrate and holding a part of the substrate including the exposure region on the stage device;
The projection image of the pattern corresponding to the device projected from the pattern generation device is measured by the alignment sensor and the arithmetic device while moving the stage device at a predetermined speed in the short direction intersecting the longitudinal direction. Scanning and exposing the exposure area in the lateral direction while correcting based on the information about the deformation that has been made,
After the step of performing the scanning exposure, a step of processing the substrate on which the pattern is transferred based on the pattern;
A device manufacturing method comprising: A manufacturing method for forming a device pattern in each of a plurality of exposure regions arranged at predetermined intervals along a longitudinal direction on a flexible belt-like substrate,
Holding a part including the exposure area of the substrate on a stage device movable in a short direction intersecting the longitudinal direction of the substrate and the longitudinal direction;
Each position of a plurality of marks formed in the periphery in the longitudinal direction and the periphery in the short direction of the exposure area on the substrate is detected by an alignment sensor, and the exposure is performed based on the detected positions. Obtaining information about the deformation of the region;
The exposure area corresponds to the device by means of a pattern generating device having a projection area having a range extending over the exposure area in the longitudinal direction and a partial area of the exposure area in the lateral direction. Projecting a partial image of the pattern;
While controlling a correction device that is provided in the pattern generation device and corrects the position or rotation of an image of a part of the pattern projected into the projection area based on the information related to the deformation, the stage device is Scanning the exposure area on the substrate in the lateral direction by moving the lateral direction at a predetermined speed; and
A device manufacturing method comprising: